Process Change Notice #1009061 ____________________________________________________________________________________________________ User Registration Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content available only to registered users. http://www.silabs.com/profile PCN Date: 06Sep10 Effective Date: : 06Dec10 Title: Si4708/09-B Assembly Site Expansion - SPIL Originator: Sheila Alvarez Phone: +65 9105-2961 Dept: Assembly NPI Customer Contact: Kathy Haggar Phone: +1.512.532.5261 Dept: Inside Sales PCN Type: Assembly Discontinuance Package Test Datasheet Fabrication Product Revision Packing Labeling Location Other Last Order Date: 06Dec10 PCN Details Description of Change: Silicon Laboratories is pleased to announce the successful qualification of SPIL (Siliconware Precision Industries Co. Ltd., Taiwan) as an additional assembly site for 16-QFN-2.5x2.5-LF. SPIL is an existing assembly site for Silicon Laboratories, is certified to ISO9001, ISO14001 & ISO/TS16949 and is a Sony Green Partner. The bill of material has minor differences from existing assembly suppliers detailed below. Assembly Bill of Material Comparison Table Lead Frame : ASEKR (EXISTING) Copper C7025, Half Etched, Ring-Plated Ag SPIL (NEW) Etched, EFTEC 64T Pre-Plating Die Attach Epoxy : Hitachi EN-4900GC Sumitomo 1033BF Bond Wire : 0.8mil Ø, 4N Gold 0.8mil Ø, 4N Gold Mold Compound : Sumitomo EME-G700 Sumitomo G770 Lead Finish : Sn 100 (Matte Tin), 10um Min. Thickness Sn 100 (Matte Tin), 10um Min. Thickness Reason for Change: Increase assembly capacity for 16-QFN-2.5x2.5-LF devices improving Silicon Lab’s on time performance to customer requested delivery dates. Impact on Form, Fit, Function, Quality, Reliability: There is no impact on fit, function, quality or reliability. The form has been changed as described above. The newly qualified 16-QFN-2.5x2.5-LF devices manufactured/assembled at SPIL fully comply with datasheet parameters and quality levels. W7206F1 Process Change Notice Form rev Y The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1 Process Change Notice #1009061 ____________________________________________________________________________________________________ Product Identification: This PCN applies to devices using the following ordering part numbers: Affected Order Part Numbers (OPN) SI4708-B-GM SI4709-B-GM SI4708-B-GMR SI4709-B-GMR Affected parts assembled in SPIL will be identified by a “TW” on the label location field as shown below: TW TW Sample label only – may be different from actual production label Last Date of Unchanged Product: 06Dec10 Following the Effective Date of this PCN, Silicon Laboratories may utilize any of the qualified assembly sites to schedule and fulfill orders for the affected products W7206F1 Process Change Notice Form rev Y The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 2 Process Change Notice #1009061 ____________________________________________________________________________________________________ Qualification Samples: Samples are available upon request. Please contact your local Silicon Laboratories sales representative to order samples. A list of Silicon Laboratories sales representatives may be found at www.silabs.com. Customer Early Acceptance Sign Off: Customers may approve early PCN acceptance by completing the information below: Early Acceptance Date: Name: Company: Email your early Acceptance approval to: [email protected] Qualification Data: See Appendix A for Qualification Report. ICP and MSDS reports are available upon request. A list of Silicon Laboratories sales representatives is available at www.silabs.com. W7206F1 Process Change Notice Form rev Y The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 3 Process Change Notice #1009061 ____________________________________________________________________________________________________ Appendix A: Qualification Report The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Si4708/09-B, TSMC Fabrication, SPIL Assembly Lot ID or Start Fail/Pass or End Notes Q29057 0/30 1 Q29060 0/30 1 3 lots Vcc=3.6V, 96 hours Q29063 0/30 1 0/90 JA104 Q29058 0/30 1 Q29061 0/30 1 3 lots Q29064 0/30 1 0/90 423506.1 0/25 1 423881.1 0/25 1 3 lots 424560.1 0/25 1 0/75 Q28888 0/3 SPIL ±1kV Test Name Test Condition Qualification Test Group A – Accelerated Environment Stress Tests - SPIL HAST JA110 130°C, 85%RH Temp Cycle Cond C: -65°C to 150°C 3 lots, N=>25 3 lots, N=>25 500 cycles HTSL JA103 150°C, 1000hr 3 lots, N=>25 Summary Status Pass Pass Pass Test Group E – Electrical Verification ESD-CDM JC101 1 lot, N=>3 Pass Notes: 1. Preceeded by MSL2 @260C Preconditioning W7206F1 Process Change Notice Form rev Y The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 4