Single N-channel MOSFET ELM14466AA-N ■General description ■Features ELM14466AA-N uses advanced trench technology to provide excellent Rds(on), low gate charge and low gate resistance. • • • • Vds=30V Id=9.4A (Vgs=10V) Rds(on) < 23mΩ (Vgs=10V) Rds(on) < 35mΩ (Vgs=4.5V) ■Maximum absolute ratings Parameter Drain-source voltage Gate-source voltage Ta=25°C. Unless otherwise noted. Limit Unit Note 30 V ±20 V Symbol Vds Vgs Ta=25°C Ta=70°C Continuous drain current Pulsed drain current 9.4 7.7 50 Id Idm Tc=25°C Power dissipation Tc=70°C Junction and storage temperature range Pd Tj, Tstg 3.1 A 1 A 2 W 2.1 -55 to 150 °C ■Thermal characteristics Parameter Maximum junction-to-ambient Symbol t≤10s Maximum junction-to-ambient Maximum junction-to-lead Steady-state Steady-state Rθja Rθjl ■Pin configuration Typ. 34 Max. 40 Unit °C/W 62 18 75 24 °C/W °C/W Note 1 3 ■Circuit SOP-8(TOP VIEW) 1 8 2 7 3 6 4 5 Pin No. 1 Pin name SOURCE 2 3 4 SOURCE SOURCE GATE 5 6 DRAIN DRAIN 7 DRAIN 8 DRAIN 4-1 D G S Single N-channel MOSFET ELM14466AA-N ■Electrical characteristics Parameter STATIC PARAMETERS Drain-source breakdown voltage Symbol Condition BVdss Id=250μA, Vgs=0V 100 nA 1.6 3.0 V A 17 23 24 30 27 24 35 mΩ S Is=1A, Vgs=0V 0.75 1.00 4.3 V A 820 Vgs=0V, Vds=15V, f=1MHz 621 118 pF pF Vgs=0V, Vds=0V, f=1MHz 85 0.8 1.5 pF Ω 11.3 17.0 nC 5.7 8.0 nC Vds=24V, Vgs=0V Gate-body leakage current Igss Vds=0V, Vgs=±20V Forward transconductance Gfs Diode forward voltage Max. body-diode continuous current DYNAMIC PARAMETERS Vsd Is Input capacitance Output capacitance Ciss Coss Reverse transfer capacitance Gate resistance SWITCHING PARAMETERS Total gate charge (10V) Crss Rg Total gate charge (4.5V) Qg Gate-source charge Gate-drain charge Turn-on delay time Qgs Qgd Turn-on rise time Turn-off delay time Turn-off fall time Body diode reverse recovery time Body diode reverse recovery charge 0.004 Ta=55°C Vgs(th) Vds=Vgs, Id=250μA Id(on) Vgs=4.5V, Vds=5V Rds(on) V μA Idss Static drain-source on-resistance 30 1.000 5.000 Zero gate voltage drain current Gate threshold voltage On state drain current Ta=25°C. Unless otherwise noted. Min. Typ. Max. Unit Vgs=10V, Id=9.4A 1.0 20 Ta=125°C Vgs=4.5V, Id=5A Vds=5V, Id=9.4A Qg Vgs=10V, Vds=15V, Id=9.4A 10 2.1 3.0 mΩ nC nC td(on) 4.5 6.5 ns tr Vgs=10V, Vds=15V td(off) RL=1.6Ω, Rgen=3Ω 3.1 15.1 5.0 23.0 ns ns 2.7 15.5 7.1 5.0 21.0 10.0 ns ns nC tf trr Qrr If=9.4A, dIf/dt=100A/μs If=9.4A, dIf/dt=100A/μs NOTE : 1. The value of Rθja is measured with the device mounted on 1in² FR-4 board of 2oz. Copper, in still air environment with Ta=25°C. The value in any given applications depends on the user’s specific board design, The current rating is based on the t ≤ 10s themal resistance rating. 2. Repetitive rating, pulse width limited by junction temperature. 3. The Rθja is the sum of the thermal impedance from junction to lead Rθjl and lead to ambient. 4. The static characteristics in Figures 1 to 6 are obtained using 80μs pulses, duty cycle 0.5%max. 5. These tests are performed with the device mounted on 1in² FR-4 board with 2oz. Copper, in a still air environment with Ta=25°C. The SOA curve provides a single pulse rating. 4-2 Single N-channel MOSFET AO4466 ELM14466AA-N ■Typical electrical and thermal characteristics TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 60 20 10V 50 6V 40 4.5V Id(A) Id (A) Vds=5V 16 30 12 8 20 125°C Vgs=3.5V 4 10 0 25°C 0 0 1 2 3 4 5 1.5 2 Vds (Volts) Fig 1: On-Region Characteristics 3.5 4 4.5 Normalized On-Resistance 1.6 35 Rds(on) (m�) 3 Vgs(Volts) Figure 2: Transfer Characteristics 40 Vgs=4.5V 30 25 20 Vgs=10V 15 10 Vgs=10V 1.4 Vgs=4.5V 1.2 1 0.8 0.6 0 5 10 15 20 -50 Id (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage -25 0 25 50 75 100 125 150 175 Temperature (°C) Figure 4: On-Resistance vs. Junction Temperature 60 1.0E+01 Id=9.4A 1.0E+00 50 1.0E-01 40 Is (A) Rds(on) (m�) 2.5 125°C 1.0E-02 125°C 25°C AS CRITICAL THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES 30 1.0E-03 COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, 20 1.0E-04 FUNCTIONS AND RELIABILITY WITHOUT 25°CNOTICE. 1.0E-05 10 2 4 6 8 0.0 10 0.2 0.4 0.6 0.8 Vsd (Volts) Figure 6: Body-Diode Characteristics Vgs (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage Alpha & Omega Semiconductor, Ltd. 4-3 1.0 Single N-channel MOSFET AO4466 ELM14466AA-N TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 1000 10 800 Vds=15V Id=9.4A Capacitance (pF) Vgs (Volts) 8 6 4 Ciss 600 400 2 200 0 0 0 2 4 6 8 10 12 Coss Crss 0 5 15 20 25 Vds (Volts) Figure 8: Capacitance Characteristics Qg (nC) Figure 7: Gate-Charge Characteristics 10.0 Rds(on) limited 100�s 1ms 0.1s 1.0 1s Tj(max)=150°C Ta=25°C DC 1 10 0.01 1 100 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-toAmbient (Note 5) 100 Figure 9: Maximum Forward Biased Safe Operating Area (Note 5) D=Ton/T Tj,pk=Ta+Pdm.Z�ja.R�ja R�ja=40°C/W 20 0 0.0001 Vds (Volts) 10 30 10 10s 0.1 0.1 Tj(max)=150°C Ta=25°C 40 10�s 10ms Z�ja Normalized Transient Thermal Resistance 30 50 Power (W) Id (Amps) 100.0 10 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse 1 THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS DOES NOT ASSUME ANY LIABILITY ARISIN 0.1 IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOSPd OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, Ton FUNCTIONS AND RELIABILITY WITHOUT NOTICE. T Single Pulse 0.01 0.00001 0.0001 0.001 0.01 0.1 1 10 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance Alpha & Omega Semiconductor, Ltd. 4-4 100 1000