RSR025N05FRA Nch 45V 2.5A Power MOSFET Datasheet AEC-Q101 Qualified lOutline VDSS 45V RDS(on) (Max.) 100mW ID 2.5A PD 1.0W TSMT3 (3) (1) (2) lInner circuit lFeatures 1) Low on - resistance. (1) Gate (2) Source (3) Drain 2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (TSMT3). 4) Pb-free lead plating ; RoHS compliant *1 BODY DIODE *2 ESD PROTECTION DIODE lPackaging specifications Packaging Taping Reel size (mm) lApplication DC/DC converters, Relay drive Type 180 Tape width (mm) Basic ordering unit (pcs) 8 3,000 Taping code TL Marking ZF lAbsolute maximum ratings(Ta = 25°C) Parameter Symbol Value Unit Drain - Source voltage VDSS 45 V Continuous drain current ID *1 2.5 A ID,pulse *2 10 A Gate - Source voltage VGSS 20 V Avalanche energy, single pulse EAS *3 4.8 mJ PD *4 0.54 W PD *5 1.0 W Tj 150 °C Tstg -55 to +150 °C Pulsed drain current Power dissipation Junction temperature Range of storage temperature www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 1/11 2012.06 - Rev.B Data Sheet RSR025N05FRA lThermal resistance Parameter Symbol Values Min. Typ. Max. Unit Thermal resistance, junction - ambient RthJA *4 - - 125 °C/W Thermal resistance, junction - ambient RthJA *5 - - 231 °C/W lElectrical characteristics(Ta = 25°C) Parameter Drain - Source breakdown voltage Breakdown voltage temperature coefficient Symbol V(BR)DSS Conditions VGS = 0V, ID = 1mA ΔV(BR)DSS ID = 1mA ΔTj referenced to 25°C Values Unit Min. Typ. Max. 45 - - V - 42 - mV/°C Zero gate voltage drain current IDSS VDS = 45V, VGS = 0V - - 1 mA Gate - Source leakage current IGSS VGS = 20V, VDS = 0V - - 10 mA Gate threshold voltage VGS (th) VDS = 10V, ID = 1mA 1.0 - 3.0 V Gate threshold voltage temperature coefficient ΔV(GS)th ΔTj ID = 1mA referenced to 25°C - -4.2 - mV/°C VGS=10V, ID=2.5A - 70 100 VGS=4.5V, ID=2.5A - 95 150 VGS=4.0V, ID=2.5A - 105 160 VGS=10V, ID=2.5A, Tj=125°C - 110 154 RG f = 1MHz, open drain - 7 - W gfs *6 VDS = 10V, ID = 2.5A 2.0 4.2 - S Static drain - source on - state resistance Gate input resistannce Transconductance RDS(on) *6 mW *1 Limited only by maximum temperature allowed. *2 Pw 10ms, Duty cycle 1% *3 L ⋍ 1mH, VDD = 25V, Rg = 25W, starting Tj = 25°C *4 Mounted on a ceramic board (30×30×0.8mm) *5 Mounted on a FR4 (12×20×0.8mm) *6 Pulsed www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2/11 2012.06 - Rev.B Data Sheet RSR025N05FRA lElectrical characteristics(Ta = 25°C) Parameter Symbol Conditions Values Min. Typ. Max. Input capacitance Ciss VGS = 0V - 260 - Output capacitance Coss VDS = 10V - 90 - Reverse transfer capacitance Crss f = 1MHz - 30 - VDD ⋍ 25V, VGS = 10V - 9 - tr *6 ID = 1.25A - 11 - td(off) *6 RL = 20W - 25 - tf *6 RG = 10W - 8 - Turn - on delay time Rise time Turn - off delay time Fall time td(on) *6 Unit pF ns lGate Charge characteristics(Ta = 25°C) Parameter Total gate charge Symbol Qg *6 Gate - Source charge Qgs *6 Gate - Drain charge Qgd *6 Conditions Values Min. Typ. Max. VDD ⋍ 25V, ID = 2.5A VGS = 5V - 3.6 - VDD ⋍ 25V, ID = 2.5A VGS = 10V - 6 12 - 1.5 - - 0.8 - VDD ⋍ 25V, ID = 2.5A VGS = 5V Unit nC lBody diode electrical characteristics (Source-Drain)(Ta = 25°C) Parameter Inverse diode continuous, forward current Forward voltage www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. Symbol IS *1 VSD *6 Conditions Values Unit Min. Typ. Max. Ta = 25°C - - 0.8 A VGS = 0V, Is = 2.5A - - 1.2 V 3/11 2012.06 - Rev.B Data Sheet RSR025N05FRA lElectrical characteristic curves Fig.2 Maximum Safe Operating Area Fig.1 Power Dissipation Derating Curve 100 Operation in this area is limited by RDS(on) ( VGS = 10V ) 100 80 60 40 20 0 0 50 100 150 1 PW = 100μs DC Operation 0.1 0.01 200 PW = 10ms Ta=25ºC Single Pulse Mounted on a ceramic board. (30mm × 30mm × 0.8mm) 0.1 1 10 Fig.3 Normalized Transient Thermal Resistance vs. Pulse Width Fig.4 Single Pulse Maxmum Power dissipation 10 1000 Ta=25ºC Single Pulse top D=1 D=0.5 D=0.1 D=0.05 D=0.01 bottom Signle 0.1 0.01 0.001 0.0001 Rth(ch-a)=125ºC/W Rth(ch-a)(t)=r(t)×Rth(ch-a) Mounted on ceramic board (30mm × 30mm × 0.8mm) 0.01 1 Peak Transient Power : P(W) Ta=25ºC Single Pulse 1 100 10 1 0.1 0.0001 100 0.01 1 100 Pulse Width : PW [s] Pulse Width : PW [s] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 100 Drain - Source Voltage : VDS [V] Junction Temperature : Tj [°C] Normalized Transient Thermal Resistance : r(t) PW = 1ms 10 Drain Current : ID [A] Power Dissipation : PD/PD max. [%] 120 4/11 2012.06 - Rev.B Data Sheet RSR025N05FRA lElectrical characteristic curves Fig.6 Avalanche Energy Derating Curve vs Junction Temperature Fig.5 Avalanche Current vs Inductive Load 120% Starting Tch=25°C VDD=25V VGS=10V RG=10W Single Pulse 10 Avalanche Energy : EAS / EAS max. [%] Avalanche Current : IAR [A] 100 1 0.1 0.01 0.01 0.1 1 10 100 100% 80% 60% 40% 20% 0% 0 Coil Inductance : L [mH] Ta=25°C pulsed 3 2 VGS=3.2V 1 VGS=3.0V VGS=2.8V 0.2 125 150 175 0.4 0.6 0.8 Drain - Source Voltage : VDS [V] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 3 VGS=3.2V 2 VGS=3.0V 1 0 1 Ta=25°C pulsed VGS=10.0V VGS=4.5V VGS=4.0V 4 VGS=3.6V Drain Current : ID [A] Drain Current : ID [A] VGS=4.0 0 100 5 VGS=4.5 0 75 Fig.8 Typical Output Characteristics(II) VGS=10.0 4 50 Junction Temperature : Tj [ºC] Fig.7 Typical Output Characteristics(I) 5 25 VGS=2.8V 0 2 4 6 8 10 Drain - Source Voltage : VDS [V] 5/11 2012.06 - Rev.B Data Sheet RSR025N05FRA Fig.9 Breakdown Voltage vs. Junction Temperature Fig.10 Typical Transfer Characteristics 10 80 VDS=10V pulsed VGS=0V ID=1mA pulsed 60 Drain Current : ID [A] Drain - Source Breakdown Voltage : V(BR)DSS [V] lElectrical characteristic curves 40 20 0 1 0.1 0.01 0.001 -50 0 50 100 150 Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 0.0 0.5 Junction Temperature : Tj [°C] Transconductance : gfs [S] Gate Threshold Voltage : VGS(th) [V] 1 100 1 3.5 4.0 Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 0.1 0.01 0.01 150 Junction Temperature : Tj [°C] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 3.0 VDS=10V pulsed 2 50 2.5 10 VDS=10V ID=1mA pulsed 0 2.0 Fig.12 Transconductance vs. Drain Current 3 -50 1.5 Gate - Source Voltage : VGS [V] Fig.11 Gate Threshold Voltage vs. Junction Temperature 0 1.0 0.1 1 10 Drain Current : ID [A] 6/11 2012.06 - Rev.B Data Sheet RSR025N05FRA lElectrical characteristic curves Fig.13 Drain CurrentDerating Curve Fig.14 Static Drain - Source On - State Resistance vs. Gate Source Voltage Static Drain - Source On-State Resistance : RDS(on) [mW] Drain Current Dissipation : ID/ID max. (%) 1.2 1 0.8 0.6 0.4 0.2 0 -25 0 25 50 75 100 125 150 300 250 ID=1.25A 150 100 50 0 Ta=25°C pulsed VGS=4.0V VGS=4.5V VGS=10V 100 10 Drain Current : ID [A] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 2 4 6 8 10 Fig.16 Static Drain - Source On - State Resistance vs. Junction Temperature Static Drain - Source On-State Resistance : RDS(on) [mW] Static Drain - Source On-State Resistance : RDS(on) [mW] 1000 1 0 Gate - Source Voltage : VGS [V] Fig.15 Static Drain - Source On - State Resistance vs. Drain Current(I) 0.1 ID=2.5A 200 Junction Temperature : Tj [ºC] 10 0.01 Ta=25°C pulsed 120 100 80 60 40 VGS=10V ID=2.5A pulsed 20 0 -50 -25 0 25 50 75 100 125 150 Junction Temperature : Tj [ºC] 7/11 2012.06 - Rev.B Data Sheet RSR025N05FRA lElectrical characteristic curves Fig.18 Static Drain - Source On - State Resistance vs. Drain Current(III) 1000 VGS=10V pulsed Static Drain - Source On-State Resistance : RDS(on) [mW] Static Drain - Source On-State Resistance : RDS(on) [mW] Fig.17 Static Drain-Source On-State Resistance vs. Drain Current(II) Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 100 10 0.01 0.1 1 10 Drain Current : ID [A] 1000 VGS=4.5V pulsed Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 100 10 0.01 0.1 1 10 Drain Current : ID [A] Static Drain - Source On-State Resistance : RDS(on) [mW] Fig.19 Static Drain - Source On - State Resistance vs. Drain Current(IV) 1000 VGS=4V pulsed Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 100 10 0.01 0.1 1 10 Drain Current : ID [A] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 8/11 2012.06 - Rev.B Data Sheet RSR025N05FRA lElectrical characteristic curves Fig.20 Typical Capacitance vs. Drain - Source Voltage Fig.21 Switching Characteristics 1000 Ta=25°C f=1MHz VGS=0V 1000 Ciss 100 Coss 10 1 Crss 0.01 0.1 1 10 100 10 td(on) 1 100 td(off) 0.01 0.1 Fig.22 Dynamic Input Characteristics 1 10 Fig.23 Source Current vs. Source Drain Voltage 12 10 Ta=25°C VDD=25V ID=2.5A Pulsed VGS=0V pulsed Source Current : IS [A] Gate - Source Voltage : VGS [V] tr Drain Current : ID [A] Drain - Source Voltage : VDS [V] 10 VDD≒25V VGS=10V RG=10W Ta=25°C Pulsed tf Switching Time : t [ns] Capacitance : C [pF] 10000 8 6 4 1 Ta=125°C Ta=75°C Ta=25°C Ta= -25°C 0.1 2 0 0 2 4 6 0.01 8 Total Gate Charge : Qg [nC] www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 0.0 0.5 1.0 1.5 Source-Drain Voltage : VSD [V] 9/11 2012.06 - Rev.B Data Sheet RSR025N05FRA lMeasurement circuits Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform Fig.3-1 Avalanche Measurement Circuit Fig.3-2 Avalanche Waveform www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 10/11 2012.06 - Rev.B Data Sheet RSR025N05FRA lDimensions (Unit : mm) D A TSMT3 c L1 Lp HE E Q e b x S A A3 e1 A l1 A1 A2 e S b2 Patterm of terminal position areas DIM A A1 A2 A3 b c D E e HE L1 Lp Q x DIM e1 b2 l1 MILIMETERS MIN MAX 1.00 0.00 0.10 0.75 0.95 0.25 0.35 0.50 0.10 0.26 2.80 3.00 1.50 1.80 0.95 2.60 3.00 0.30 0.60 0.40 0.70 0.05 0.25 0.20 MILIMETERS MIN MAX 2.10 0.70 0.90 INCHES MIN 0 0.03 MAX 0.039 0.004 0.037 0.01 0.014 0.004 0.11 0.059 0.02 0.01 0.118 0.071 0.04 0.102 0.012 0.016 0.002 - 0.118 0.024 0.028 0.01 0.008 INCHES MIN MAX 0.08 - 0.028 0.035 Dimension in mm/inches www.rohm.com © 2012 ROHM Co., Ltd. All rights reserved. 11/11 2012.06 - Rev.B Datasheet Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001