HFA16PA60C Vishay High Power Products HEXFRED® Ultrafast, Soft Recovery Diode, 2 x 8 A FEATURES • • • • • • Base common cathode 2 Ultrafast recovery Ultrasoft recovery Very low IRRM Very low Qrr Specified at operating conditions Designed and qualified for industrial level BENEFITS TO-247AC • • • • • 1 3 Anode Anode 2 1 2 Common cathode Reduced RFI and EMI Reduced power loss in diode and switching transistor Higher frequency operation Reduced snubbing Reduced parts count DESCRIPTION HFA16PA60C is a state of the art center tap ultrafast recovery diode. Employing the latest in epitaxial construction and advanced processing techniques it features a superb combination of characteristics which result in performance which is unsurpassed by any rectifier previously available. With basic ratings of 600 V and 8 A per leg continuous current, the HFA16PA60C is especially well suited for use as the companion diode for IGBTs and MOSFETs. In addition to ultrafast recovery time, the HEXFRED® product line features extremely low values of peak recovery current (IRRM) and does not exhibit any tendency to “snap-off” during the tb portion of recovery. The HEXFRED features combine to offer designers a rectifier with lower noise and significantly lower switching losses in both the diode and the switching transistor. These HEXFRED advantages can help to significantly reduce snubbing, component count and heatsink sizes. The HEXFRED HFA16PA60C is ideally suited for applications in power supplies and power conversion systems (such as inverters), motor drives, and many other similar applications where high speed, high efficiency is needed. PRODUCT SUMMARY VR 600 V VF at 8 A at 25 °C 1.7 V IF(AV) 2x8A trr (typical) 18 ns TJ (maximum) 150 °C Qrr 65 nC dI(rec)M/dt 240 A/µs ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL Cathode to anode voltage Maximum continuous forward current per leg per device IF Single pulse forward current IFSM Maximum repetitive forward current IFRM Maximum power dissipation PD Operating junction and storage temperature range Document Number: 93070 Revision: 29-Jul-08 TEST CONDITIONS VR TC = 100 °C VALUES UNITS 600 V 8 16 60 A 24 TC = 25 °C 36 TC = 100 °C 14 TJ, TStg For technical questions, contact: [email protected] - 55 to + 150 W °C www.vishay.com 1 HFA16PA60C Vishay High Power Products HEXFRED® Ultrafast, Soft Recovery Diode, 2 x 8 A ELECTRICAL SPECIFICATIONS PER LEG (TJ = 25 °C unless otherwise specified) PARAMETER SYMBOL TEST CONDITIONS Cathode to anode breakdown voltage VBR IR = 100 µA Maximum forward voltage VFM IF = 16 A IF = 8.0 A MIN. TYP. MAX. 600 - - UNITS - 1.4 1.7 - 1.7 2.1 IF = 8.0 A, TJ = 125 °C - 1.4 1.7 VR = VR rated - 0.3 5.0 - 100 500 - 10 25 pF - 8.0 - nH See fig. 1 Maximum reverse leakage current IRM Junction capacitance CT VR = 200 V Series inductance LS Measured lead to lead 5 mm from package body TJ = 125 °C, VR = 0.8 x VR rated See fig. 2 See fig. 3 V µA DYNAMIC RECOVERY CHARACTERISTICS PER LEG (TJ = 25 °C unless otherwise specified) PARAMETER Reverse recovery time See fig. 5, 6 and 16 Peak recovery current See fig. 7 and 8 Reverse recovery charge See fig. 9 and 10 Peak rate of fall recovery current during tb See fig. 11 and 12 SYMBOL TEST CONDITIONS MIN. TYP. MAX. trr IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V - 18 - trr1 TJ = 25 °C - 37 55 UNITS ns trr2 TJ = 125 °C - 55 90 IRRM1 TJ = 25 °C - 3.5 5.0 IRRM2 TJ = 125 °C - 4.5 8.0 Qrr1 TJ = 25 °C - 65 138 Qrr2 TJ = 125 °C - 124 360 dI(rec)M/dt1 TJ = 25 °C - 240 - dI(rec)M/dt2 TJ = 125 °C - 210 - MIN. TYP. MAX. UNITS - - 300 °C - - 3.5 - - 1.75 IF = 8.0 A dIF/dt = 200 A/µs VR = 200 V A nC A/µs THERMAL - MECHANICAL SPECIFICATIONS PARAMETER Lead temperature Junction to case, single leg conducting Junction to case, SYMBOL Tlead TEST CONDITIONS 0.063" from case (1.6 mm) for 10 s RthJC both leg conducting K/W Thermal resistance, junction to ambient RthJA Typical socket mount - - 40 Thermal resistance, case to heatsink RthCS Mounting surface, flat, smooth and greased - 0.25 - - 6.0 - g - 0.21 - oz. 6.0 (5.0) - 12 (10) kgf · cm (lbf · in) Weight Mounting torque Marking device www.vishay.com 2 Case style TO-247AC (JEDEC) For technical questions, contact: [email protected] HFA16PA60C Document Number: 93070 Revision: 29-Jul-08 HFA16PA60C HEXFRED® Vishay High Power Products Ultrafast, Soft Recovery Diode, 2 x 8 A 1000 TJ = 150°C 100 100 TJ = 125°C 10 1 0.1 TJ = 25°C 0.01 TJ = 150°C 10 0.001 0 100 TJ = 125°C 200 300 400 500 600 Reverse Voltage - V R(V) T = 25°C J Fig. 2 - Typical Reverse Current vs. Reverse Voltage (Per Leg) 100 1 A TJ = 25°C 10 A 0.1 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 Forward Voltage Drop - VFM (V) 1 1 10 100 1000 Reverse Voltage - V R(V) Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg) Fig. 1 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current (Per Leg) Thermal Response (Z thJC ) 10 D = 0.50 1 0.20 0.10 0.05 0.1 0.01 0.00001 0.02 0.01 PDM SINGLE PULSE (THERMAL RESPONSE) t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = P DM x Z thJC + TC 0.0001 0.001 0.01 0.1 1 t1 , Rectangular Pulse Duration (sec) Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg) Document Number: 93070 Revision: 29-Jul-08 For technical questions, contact: [email protected] www.vishay.com 3 HFA16PA60C Vishay High Power Products HEXFRED® Ultrafast, Soft Recovery Diode, 2 x 8 A 500 80 VR = 200V TJ = 125°C TJ = 25°C I F = 16A IF F = 8.0A I F = 4.0A 400 I F = 16A 60 IF = 8.0A trr - (ns) IF = 4.0A 300 40 200 20 100 VR = 200V TJ = 125°C TJ = 25°C 0 100 dI f /dt - (A/µs) 1000 0 100 Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt (Per Leg) dI f /dt - (A/µs) 1000 Fig. 7 - Typical Stored Charge vs. dIF/dt (Per Leg) 10000 20 VR = 200V TJ = 125°C TJ = 25°C 16 VR = 200V TJ = 125°C TJ = 25°C I F = 16A I F = 8.0A IF = 16A I F = 4.0A I F = 8.0A 12 IF = 4.0A 1000 8 4 0 100 dI f /dt - (A/µs) 1000 Fig. 6 - Typical Recovery Current vs. dIF/dt (Per Leg) www.vishay.com 4 100 100 dI f /dt - (A/µs) 1000 Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt (Per Leg) For technical questions, contact: [email protected] Document Number: 93070 Revision: 29-Jul-08 HFA16PA60C HEXFRED® Vishay High Power Products Ultrafast, Soft Recovery Diode, 2 x 8 A VR = 200 V 0.01 Ω L = 70 µH D.U.T. dIF/dt adjust D IRFP250 G S Fig. 9 - Reverse Recovery Parameter Test Circuit (3) trr IF ta tb 0 Qrr (2) IRRM (4) 0.5 IRRM dI(rec)M/dt (5) 0.75 IRRM (1) dIF/dt (1) dIF/dt - rate of change of current through zero crossing (2) IRRM - peak reverse recovery current (3) trr - reverse recovery time measured from zero crossing point of negative going IF to point where a line passing through 0.75 IRRM and 0.50 IRRM extrapolated to zero current. (4) Qrr - area under curve defined by trr and IRRM Qrr = trr x IRRM 2 (5) dI(rec)M/dt - peak rate of change of current during tb portion of trr Fig. 10 - Reverse Recovery Waveform and Definitions Document Number: 93070 Revision: 29-Jul-08 For technical questions, contact: [email protected] www.vishay.com 5 HFA16PA60C Vishay High Power Products HEXFRED® Ultrafast, Soft Recovery Diode, 2 x 8 A ORDERING INFORMATION TABLE Device code HF A 16 PA 60 C - 1 2 3 4 5 6 7 1 - HEXFRED® family 2 - Process designator: A = Subs. elec. irrad. B = Subs. platinum 3 - Current rating (16 = 16 A) 4 - Package outline (PA = TO-247, 3 pins) 5 - Voltage rating (60 = 600 V) 6 - Configuration (C = Center tap common cathode) 7 - None = Standard production PbF = Lead (Pb)-free LINKS TO RELATED DOCUMENTS Dimensions http://www.vishay.com/doc?95223 Part marking information http://www.vishay.com/doc?95226 www.vishay.com 6 For technical questions, contact: [email protected] Document Number: 93070 Revision: 29-Jul-08 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1