IGW40T120 ® TrenchStop Series Low Loss IGBT in TrenchStop® and Fieldstop technology C Short circuit withstand time – 10s Designed for : - Frequency Converters - Uninterrupted Power Supply ® TrenchStop and Fieldstop technology for 1200 V applications offers : - very tight parameter distribution - high ruggedness, temperature stable behavior NPT technology offers easy parallel switching capability due to positive temperature coefficient in VCE(sat) Low EMI Low Gate Charge 1 Qualified according to JEDEC for target applications Pb-free lead plating; RoHS compliant Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/ Type IGW40T120 G E PG-TO-247-3 VCE IC VCE(sat),Tj=25°C Tj,max Marking Code Package 1200V 40A 1.7V 150C G40T120 PG-TO-247-3 Maximum Ratings Parameter Symbol Value Unit Collector-emitter voltage VCE 1200 V DC collector current IC A TC = 25C 75 TC = 100C 40 Pulsed collector current, tp limited by Tjmax ICpul s 105 Turn off safe operating area - 105 VGE 20 V tSC 10 s Ptot 270 W C VCE 1200V, Tj 150C Gate-emitter voltage 2) Short circuit withstand time VGE = 15V, VCC 1200V, Tj 150C Power dissipation TC = 25C Operating junction temperature Tj -40...+150 Storage temperature Tstg -55...+150 Soldering temperature, 1.6mm (0.063 in.) from case for 10s - 1 2) 260 J-STD-020 and JESD-022 Allowed number of short circuits: <1000; time between short circuits: >1s. Power Semiconductors 1 Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series Thermal Resistance Parameter Symbol Conditions Max. Value Unit RthJC 0.45 K/W RthJA 40 Characteristic IGBT thermal resistance, junction – case Thermal resistance, junction – ambient Electrical Characteristic, at Tj = 25 C, unless otherwise specified Parameter Symbol Conditions Value min. typ. max. 1200 - - T j =2 5 C - 1.7 2.3 T j =1 2 5 C - 2.1 - T j =1 5 0 C - 2.3 - 5.0 5.8 6.5 Unit Static Characteristic Collector-emitter breakdown voltage V ( B R ) C E S V G E = 0V , I C = 1 .5m A Collector-emitter saturation voltage VCE(sat) V V G E = 15 V , I C = 40 A Gate-emitter threshold voltage VGE(th) I C = 1. 5m A, V C E = V G E Zero gate voltage collector current ICES V C E = 12 0 0V , V G E = 0V mA T j =2 5 C - - 0.4 T j =1 5 0 C - - 4.0 Gate-emitter leakage current IGES V C E = 0V , V G E =2 0 V - - 600 nA Transconductance gfs V C E = 20 V , I C = 40 A - 21 - S Integrated gate resistor RGint Power Semiconductors 6 2 Ω Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series Dynamic Characteristic Input capacitance Ciss V C E = 25 V , - 2500 - Output capacitance Coss V G E = 0V , - 130 - Reverse transfer capacitance Crss f= 1 MH z - 110 - Gate charge QGate V C C = 96 0 V, I C =4 0 A - 203 - nC - 13 - nH - 210 - A pF V G E = 15 V LE Internal emitter inductance measured 5mm (0.197 in.) from case Short circuit collector current 1) IC(SC) V G E = 15 V ,t S C 10 s V C C = 6 0 0 V, T j = 25 C Switching Characteristic, Inductive Load, at Tj=25 C Parameter Symbol Conditions Value min. typ. max. - 48 - - 34 - - 480 - - 70 - - 3.3 - - 3.2 - - 6.5 - Unit IGBT Characteristic Turn-on delay time td(on) Rise time tr Turn-off delay time td(off) Fall time tf Turn-on energy Eon Turn-off energy Eoff Total switching energy Ets T j =2 5 C , V C C = 60 0 V, I C = 4 0 A, V G E = 0/ 15 V , R G = 15 , 2) L =1 8 0n H, 2) C = 3 9p F Energy losses include “tail” and diode reverse recovery. ns mJ Switching Characteristic, Inductive Load, at Tj=150 C Parameter Symbol Conditions Value min. typ. max. - 52 - - 40 - - 580 - - 120 - - 5.0 - - 5.4 - - 10.4 - Unit IGBT Characteristic Turn-on delay time td(on) Rise time tr Turn-off delay time td(off) Fall time tf Turn-on energy Eon Turn-off energy Eoff Total switching energy Ets 1) 2) T j =1 5 0 C V C C = 60 0 V, I C = 4 0 A, V G E = 0/ 15 V , R G = 1 5 , 2) L =1 8 0n H, 2) C = 3 9p F Energy losses include “tail” and diode reverse recovery. ns mJ Allowed number of short circuits: <1000; time between short circuits: >1s. Leakage inductance L a nd Stray capacity C due to dynamic test circuit in Figure E. Power Semiconductors 3 Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series 100A tp=3µs 100A 80A 10µs IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT TC=80°C TC=110°C 60A 40A Ic 20A 10A 50µs 150µs 500µs 1A Ic 20ms DC 0A 10Hz 100Hz 1kHz 10kHz 0,1A 1V 100kHz f, SWITCHING FREQUENCY Figure 1. Collector current as a function of switching frequency (Tj 150C, D = 0.5, VCE = 600V, VGE = 0/+15V, RG = 15) 10V 100V 1000V VCE, COLLECTOR-EMITTER VOLTAGE Figure 2. Safe operating area (D = 0, TC = 25C, Tj 150C;VGE=15V) 70A 60A IC, COLLECTOR CURRENT Ptot, POWER DISSIPATION 250W 200W 150W 100W 50W 0W 25°C 50A 40A 30A 20A 10A 50°C 75°C 100°C 0A 25°C 125°C TC, CASE TEMPERATURE Figure 3. Power dissipation as a function of case temperature (Tj 150C) Power Semiconductors 4 75°C 125°C TC, CASE TEMPERATURE Figure 4. Collector current as a function of case temperature (VGE 15V, Tj 150C) Rev. 2.4 Nov. 09 IGW40T120 ® 100A 100A 90A 90A 80A VGE=17V 70A 15V IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT TrenchStop Series 13V 60A 11V 50A 9V 40A 7V 30A VGE=17V 70A 15V 13V 60A 11V 50A 9V 40A 7V 30A 20A 20A 10A 10A 0A 0A 0V 1V 2V 3V 4V 5V 6V 0V 100A 90A 80A 70A 60A 50A 40A 30A 20A TJ=150°C 25°C 10A 0A 0V 2V 4V 6V 8V 10V 12V VGE, GATE-EMITTER VOLTAGE Figure 7. Typical transfer characteristic (VCE=20V) Power Semiconductors 1V 2V 3V 4V 5V 6V VCE, COLLECTOR-EMITTER VOLTAGE Figure 6. Typical output characteristic (Tj = 150°C) VCE(sat), COLLECTOR-EMITT SATURATION VOLTAGE VCE, COLLECTOR-EMITTER VOLTAGE Figure 5. Typical output characteristic (Tj = 25°C) IC, COLLECTOR CURRENT 80A 3,5V IC=80A 3,0V 2,5V 2,0V IC=40A 1,5V IC=25A 1,0V IC=10A 0,5V 0,0V -50°C 0°C 50°C 100°C TJ, JUNCTION TEMPERATURE Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature (VGE = 15V) 5 Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series td(off) 100ns t, SWITCHING TIMES t, SWITCHING TIMES 1000 ns tf td(on) tr 10ns td(off) tf 100 ns td(on) tr 10 ns 1ns 0A 20A 40A 1 ns 60A IC, COLLECTOR CURRENT Figure 9. Typical switching times as a function of collector current (inductive load, TJ=150°C, VCE=600V, VGE=0/15V, RG=15Ω, Dynamic test circuit in Figure E) RG, GATE RESISTOR Figure 10. Typical switching times as a function of gate resistor (inductive load, TJ=150°C, VCE=600V, VGE=0/15V, IC=40A, Dynamic test circuit in Figure E) VGE(th), GATE-EMITT TRSHOLD VOLTAGE t, SWITCHING TIMES td(off) 100ns tf td(on) tr 10ns 0°C 50°C 100°C 150°C TJ, JUNCTION TEMPERATURE Figure 11. Typical switching times as a function of junction temperature (inductive load, VCE=600V, VGE=0/15V, IC=40A, RG=15Ω, Dynamic test circuit in Figure E) Power Semiconductors 7V 6V max. 5V typ. 4V min. 3V 2V 1V 0V -50°C 0°C 50°C 100°C 150°C TJ, JUNCTION TEMPERATURE Figure 12. Gate-emitter threshold voltage as a function of junction temperature (IC = 1.5mA) 6 Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series *) Eon and Ets include losses due to diode recovery Ets* 20,0mJ 15,0mJ Eon* 10,0mJ Eoff 5,0mJ 0,0mJ 10A 20A 30A 40A 50A 60A 10 mJ Eon* Eoff 5 mJ 0 mJ 70A IC, COLLECTOR CURRENT Figure 13. Typical switching energy losses as a function of collector current (inductive load, TJ=150°C, VCE=600V, VGE=0/15V, RG=15Ω, Dynamic test circuit in Figure E) RG, GATE RESISTOR Figure 14. Typical switching energy losses as a function of gate resistor (inductive load, TJ=150°C, VCE=600V, VGE=0/15V, IC=40A, Dynamic test circuit in Figure E) *) Eon and Ets include losses due to diode recovery *) Eon and Ets include losses due to diode recovery 15mJ Ets* 10mJ Eoff 5mJ Eon* E, SWITCHING ENERGY LOSSES 15mJ E, SWITCHING ENERGY LOSSES Ets* 15 mJ 25,0mJ E, SWITCHING ENERGY LOSSES E, SWITCHING ENERGY LOSSES *) Eon and Etsinclude losses due to diode recovery 10mJ Ets* 5mJ E off Eon* 0mJ 50°C 100°C 0mJ 400V 150°C TJ, JUNCTION TEMPERATURE Figure 15. Typical switching energy losses as a function of junction temperature (inductive load, VCE=600V, VGE=0/15V, IC=40A, RG=15Ω, Dynamic test circuit in Figure E) Power Semiconductors 500V 600V 700V 800V VCE, COLLECTOR-EMITTER VOLTAGE Figure 16. Typical switching energy losses as a function of collector emitter voltage (inductive load, TJ=150°C, VGE=0/15V, IC=40A, RG=15Ω, Dynamic test circuit in Figure E) 7 Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series 1nF 15V 240V c, CAPACITANCE VGE, GATE-EMITTER VOLTAGE Ciss 960V 10V Crss 5V 0V 10pF 0nC 50nC 100nC 150nC 200nC IC(sc), short circuit COLLECTOR CURRENT 10µs 5µs 12V 14V 20V 300A 200A 100A 0A 16V VGE, GATE-EMITTETR VOLTAGE Figure 19. Short circuit withstand time as a function of gate-emitter voltage (VCE=600V, start at TJ=25°C) Power Semiconductors 10V VCE, COLLECTOR-EMITTER VOLTAGE Figure 18. Typical capacitance as a function of collector-emitter voltage (VGE=0V, f = 1 MHz) 15µs 0µs 0V 250nC QGE, GATE CHARGE Figure 17. Typical gate charge (IC=40 A) tSC, SHORT CIRCUIT WITHSTAND TIME Coss 100pF 12V 14V 16V 18V VGE, GATE-EMITTETR VOLTAGE Figure 20. Typical short circuit collector current as a function of gateemitter voltage (VCE 600V, Tj 150C) 8 Rev. 2.4 Nov. 09 IGW40T120 ® VCE 600V 60A 400V 40A 200V 20A 600V 60A 40A IC 400V 200V 20A VCE IC 0V 0A 0us 0.5us 1us 1.5us t, TIME Figure 21. Typical turn on behavior (VGE=0/15V, RG=15Ω, Tj = 150C, Dynamic test circuit in Figure E) ZthJC, TRANSIENT THERMAL RESISTANCE IC, COLLECTOR CURRENT VCE, COLLECTOR-EMITTER VOLTAGE TrenchStop Series 0A 0us 0V 0.5us 1us 1.5us t, TIME Figure 22. Typical turn off behavior (VGE=15/0V, RG=15Ω, Tj = 150C, Dynamic test circuit in Figure E) D=0.5 -1 10 K/W 0.2 0.1 0.05 -2 10 K/W R,(K/W) 0.159 0.133 0.02 0.120 0.01 0.038 single pulse R1 , (s) 1.10*10-1 1.56*10-2 1.35*10-3 1.51*10-4 R2 C 1 = 1 /R 1 C 2 = 2 /R 2 10ms 100ms -3 10 K/W 10µs 100µs 1ms tP, PULSE WIDTH Figure 23. IGBT transient thermal resistance (D = tp / T) Power Semiconductors 9 Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series PG-TO247-3 Power Semiconductors 10 Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series 1 2 r1 n r2 rn Tj (t) p(t) r1 r2 rn Figure A. Definition of switching times TC Figure D. Thermal equivalent circuit Figure B. Definition of switching losses Power Semiconductors Figure E. Dynamic test circuit Leakage inductance L =180nH an d Stray capacity C =39pF. 11 Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series Power Semiconductors 12 Rev. 2.4 Nov. 09 IGW40T120 ® TrenchStop Series Edition 2006-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 12/7/11. All Rights Reserved. Attention please! The information given in this data sheet shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Power Semiconductors 13 Rev. 2.4 Nov. 09