DMN31D5UFZ N-CHANNEL ENHANCEMENT MODE MOSFET Product Summary • Low Package Profile, 0.42mm Maximum Package Height • 0.62mm x 0.62mm Package Footprint 1.5Ω @ VGS = 4.5V • Low On-Resistance 2.0Ω @ VGS = 2.5V • Very Low Gate Threshold Voltage, 1.0V max NEW PRODUCT ADVANCED INFORMATION NEW PRODUCT V(BR)DSS 30V Features and Benefits ID max TA = +25°C RDS(ON) max 0.22A 3.0Ω @ VGS = 1.8V 4.5Ω @ VGS = 1.5V Description ideal for high efficiency power management applications. General Purpose Interfacing Switch Power Management Functions • Analog Switch Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) • • Case: X2-DFN0606-3 Case Material: Molded Plastic, “Green” Molding Compound UL Flammability Classification Rating 94V-0 Applications • ESD Protected Gate • Mechanical Data This MOSFET has been designed to minimize the on-state resistance (RDS(ON)) and yet maintain superior switching performance, making it • • • Moisture Sensitivity: Level 1 per J-STD-020 • Terminals: Finish – NiPdAu over Copper leadframe Solderable per MIL-STD-202, Method 208 e4 • Weight: 0.001 grams (approximate) ESD PROTECTED Bottom View Equivalent Circuit Top View Package Pin Configuration Ordering Information (Note 4) Part Number DMN31D5UFZ-7B Notes: Case X2-DFN0606-3 Packaging 10K/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information R6 = Product Type Marking Code Top View Bar Denotes Gate and Source Side DMN31D5UFZ Document number: DS36843 Rev. 2 - 2 1 of 6 www.diodes.com June 2014 © Diodes Incorporated DMN31D5UFZ Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Value Units Drain-Source Voltage Characteristic VDSS 30 V Gate-Source Voltage VGSS ±12 V ID 220 150 mA IDM 500 mA Steady State Continuous Drain Current (Note 5) NEW PRODUCT ADVANCED INFORMATION NEW PRODUCT TA = +25°C TA = +85°C Pulsed Drain Current (Note 6) Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Symbol Value Total Power Dissipation (Note 5) Characteristic Steady state PD 393 mW Thermal Resistance, Junction to Ambient (Note 5) Steady state RθJA 318 °C/W TJ, TSTG -55 to +150 °C Operating and Storage Temperature Range Units Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic OFF CHARACTERISTICS (Note 7) Symbol Min Typ Max Unit BVDSS 30 — — V IDSS — — 100 nA VDS = 24V, VGS = 0V IGSS — — ±10 μA VGS = ±10V, VDS = 0V VGS(th) 0.4 — 1.0 V VDS = VGS, ID = 250μA — — 1.5 VGS = 4.5V, ID = 100mA — — 2.0 VGS = 2.5V, ID = 50mA — — 3.0 — — 4.5 — 2.8 — VSD — 0.75 1.0 V Input Capacitance Ciss — 22.2 — pF Output Capacitance Coss — 2.9 — pF Reverse Transfer Capacitance Crss — 2.2 — pF Total Gate Charge Qg — 0.35 — nC Gate-Source Charge Qgs — 0.05 — nC Gate-Drain Charge Qgd — 0.02 — nC Turn-On Delay Time tD(on) — 3.1 — ns Turn-On Rise Time tr — 2.0 — ns Turn-Off Delay Time tD(off) — 20 — ns tf — 6.9 — ns Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage @TC = +25°C Test Condition VGS = 0V, ID = 250μA ON CHARACTERISTICS (Note 7) Gate Threshold Voltage Static Drain-Source On-Resistance Diode Forward Voltage RDS(ON) Ω VGS = 1.8V, ID = 20mA VGS = 1.5V, ID = 10mA VGS = 1.2V, ID = 1mA VGS = 0V, IS = 10mA DYNAMIC CHARACTERISTICS (Note 8) Turn-Off Fall Time Notes: VDS = 15V, VGS = 0V, f = 1.0MHz VGS = 4.5V, VDS = 15V, ID = 200mA VDD = 10V, VGS = 4.5V, RG = 6Ω, ID = 200mA 5. Device mounted on FR-4 PCB, with minimum recommended pad layout. 6. Device mounted on minimum recommended pad layout test board, 10μs pulse duty cycle = 1%. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. DMN31D5UFZ Document number: DS36843 Rev. 2 - 2 2 of 6 www.diodes.com June 2014 © Diodes Incorporated DMN31D5UFZ 0.8 0.8 VGS = 1.8V VDS = 5.0V 0.7 VGS = 4.5V VGS = 4.0V 0.6 VGS = 2.5V VGS = 1.5V VGS = 3.0V 0.5 ID, DRAIN CURRENT (A) ID, DRAIN CURRENT (A) 0.7 0.4 0.3 VGS = 1.2V 0.2 0 0.5 1 1.5 2 2.5 VDS, DRAIN-SOURCE VOLTAGE (V) Figure 1 Typical Output Characteristics 0.4 0.3 TA = 150°C 0.2 0 3 T A = 85°C TA = 25°C TA = -55°C 0 0.5 1 1.5 2 2.5 VGS, GATE-SOURCE VOLTAGE (V) Figure 2 Typical Transfer Characteristics 3 3 3 2.5 VGS = 1.2V 2 VGS = 1.5V VGS = 1.8V 1.5 VGS = 2.5V 1 VGS = 4.5V 0.5 0 0.5 0.1 RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω) RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω) 0.0 0.6 T A = 125°C 0.1 0 0.2 0.4 0.6 ID, DRAIN-SOURCE CURRENT (A) Figure 3 Typical On-Resistance vs. Drain Current and Gate Voltage 0.8 RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω) 1.8 RDS(ON), DRAIN-SOURCE ON-RESISTANCE (NORMALIZED) NEW PRODUCT ADVANCED INFORMATION NEW PRODUCT VGS =2.0V VGS = 10V 1.6 VGS = 2.5V ID = 50mA 1.4 1.2 1 0.8 0.6 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Figure 5 On-Resistance Variation with Temperature DMN31D5UFZ Document number: DS36843 Rev. 2 - 2 3 of 6 www.diodes.com VGS = 4.5V 2.5 TA = 150°C 2 TA = 125°C T A = 85°C 1.5 TA = 25°C 1 T A = -55°C 0.5 0 0 0.2 0.4 0.6 ID, DRAIN CURRENT (A) Figure 4 Typical On-Resistance vs. Drain Current and Temperature 0.8 2 1.6 VGS = 2.5V ID = 50mA 1.2 VGS = 4.5V ID = 100mA 0.8 0.4 0 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Figure 6 On-Resistance Variation with Temperature June 2014 © Diodes Incorporated 0.8 0.9 0.7 IS, SOURCE CURRENT (A) VGS(th), GATE THRESHOLD VOLTAGE (V) 1 0.8 ID = 1mA 0.7 ID = 250µA 0.6 0.5 0.4 0.6 0.5 0.4 TA = 150°C 0.3 T A = 125°C 0.2 TA = 85°C TA = 25°C 0.1 0.3 -50 0 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) Figure 7 Gate Threshold Variation vs. Ambient Temperature VGS GATE THRESHOLD VOLTAGE (V) f = 1MHz C iss 10 Coss Crss 1 TA = -55°C 0 0.3 0.6 0.9 1.2 1.5 VSD, SOURCE-DRAIN VOLTAGE (V) Figure 8 Diode Forward Voltage vs. Current 10 100 CT, JUNCTION CAPACITANCE (pF) 0 5 10 15 20 25 VDS, DRAIN-SOURCE VOLTAGE (V) Figure 9 Typical Junction Capacitance 1 30 8 6 VDS = 15V ID = 200mA 4 2 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Qg, TOTAL GATE CHARGE (nC) Figure 10 Gate Charge 0.9 D = 0.9 D = 0.7 D = 0.5 r(t), TRANSIENT THERMAL RESISTANCE NEW PRODUCT ADVANCED INFORMATION NEW PRODUCT DMN31D5UFZ D = 0.3 0.1 D = 0.1 D = 0.05 D = 0.02 0.01 D = 0.01 D = 0.005 RθJA(t) = r(t) * RθJA RθJA = 313°C/W Duty Cycle, D = t1/ t2 D = Single Pulse 0.001 0.000001 0.00001 DMN31D5UFZ Document number: DS36843 Rev. 2 - 2 0.0001 0.001 0.01 0.1 1 t1, PULSE DURATION TIME (sec) Figure 11 Transient Thermal Resistance 4 of 6 www.diodes.com 10 100 1000 June 2014 © Diodes Incorporated DMN31D5UFZ Package Outline Dimensions Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. Seating Plane D 2 D 3 D 2 / e E 2 E e k x 2 b 2 L ︵ ︶ x 2 L NEW PRODUCT ADVANCED INFORMATION NEW PRODUCT 1 A A X2-DFN0606-3 Dim Min Max Typ A 0.36 0.42 0.39 A1 0 0.05 0.02 b 0.10 0.20 0.15 D 0.57 0.67 0.62 D2 0.155 BSC D3 0.185 BSC E 0.57 0.67 0.62 E2 0.40 0.60 0.50 e 0.35 BSC k 0.16 REF L 0.09 0.21 0.15 L2 0.11 0.31 0.21 All Dimensions in mm ︵ ︶ Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. X Y 1 Y C 1 X 2 X DMN31D5UFZ Document number: DS36843 Rev. 2 - 2 5 of 6 www.diodes.com Dimensions C X X1 X2 Y Y1 Value (in mm) 0.350 0.280 0.350 0.760 0.200 0.600 June 2014 © Diodes Incorporated DMN31D5UFZ IMPORTANT NOTICE NEW PRODUCT ADVANCED INFORMATION NEW PRODUCT DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2014, Diodes Incorporated www.diodes.com DMN31D5UFZ Document number: DS36843 Rev. 2 - 2 6 of 6 www.diodes.com June 2014 © Diodes Incorporated