plastic surface-mounted package with increased heatsink; 4 leads

3
SO
T2
2
SOT223
plastic surface-mounted package with increased heatsink; 4
leads
8 February 2016
Package information
1. Package summary
Terminal position code
D (double)
Package type descriptive code
SC-73
Package type industry code
SC-73
Package style descriptive code
SO (small outline)
Package style suffix code
NA (not applicable)
Package body material type
P (plastic)
JEITA package outline code
SC-73
Mounting method type
S (surface mount)
Issue date
16-3-2006
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
6.3
-
6.5
6.7
mm
E
package width
3.3
-
3.5
3.7
mm
A
seated height
1.5
-
1.65
1.8
mm
n2
actual quantity of termination
-
-
4
-
SOT223
NXP Semiconductors
plastic surface-mounted package with increased
heatsink; 4 leads
2. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads
D
SOT223
E
B
A
X
c
y
HE
v M A
b1
4
Q
A
A1
1
2
e1
3
Lp
bp
w M B
detail X
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.8
1.5
0.10
0.01
0.80
0.60
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1
0.7
0.95
0.85
0.2
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT223
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-11-10
06-03-16
SC-73
Fig. 1. Package outline SC-73 (SOT223)
SOT223
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT223
NXP Semiconductors
plastic surface-mounted package with increased
heatsink; 4 leads
3. Soldering
7
3.85
3.6
3.5
0.3
1.3 1.2
(4×) (4×)
solder lands
4
solder resist
3.9
6.1 7.65
solder paste
occupied area
1
2
3
Dimensions in mm
2.3
2.3
1.2
(3×)
1.3
(3×)
6.15
sot223_fr
Fig. 2. Reflow soldering footprint for SC-73 (SOT223)
8.9
6.7
1.9
solder lands
4
solder resist
6.2
1
2
8.7
Dimensions in mm
3
1.9
(3×)
2.7
occupied area
preferred transport
direction during soldering
2.7
1.1
1.9
(2×)
sot223_fw
Fig. 3. Wave soldering footprint for SC-73 (SOT223)
SOT223
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT223
NXP Semiconductors
plastic surface-mounted package with increased
heatsink; 4 leads
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT223
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT223
NXP Semiconductors
plastic surface-mounted package with increased
heatsink; 4 leads
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 8 February 2016
SOT223
Package information
All information provided in this document is subject to legal disclaimers.
8 February 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5