TPD4S009 www.ti.com ........................................................................................................................................................................................................ SLVS817 – MAY 2008 4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE FEATURES 1 • Supports High-Speed Differential Data Rates (3-dB Bandwidth > 4 GHz) • 0.05-pF Matching Capacitance Between Differential Signal Pairs • Low 0.8-pF Line Capacitance for Each Data Line to GND • Flow-Through Single-in-Line Pin Mapping for High-Speed Lines Ensures No Additional Board Layout Burden While Placing ESD Protection Chip Near Connector • IEC 61000-4-2 (Level 4) System-Level ESD Compliance • 2.5-A Peak Pulse Current (8/20-µs Pulse) • Ioff Feature • Industrial Temperature Range: –40°C to 85°C • Space-Saving Package Options 2 DBV OR DCK PACKAGE (TOP VIEW) D1+ 1 6 D1– GND 2 5 VCC D2+ 3 4 D2– DRY PACKAGE (TOP VIEW) D1+ 1 6 D1– GND 2 5 VCC D2+ 3 4 D2– DESCRIPTION/ORDERING INFORMATION The TPD4S009 provides an electrostatic discharge (ESD) solution for high-speed differential lines. This device offers four ESD clamp circuits for dual differential lines. The monolithic silicon technology allows matching between the differential signal pairs. The excellent matching between the differential pair signal lines (0.05-pF line-line) enables this device to operate at high-speed differential data rates (3-dB bandwidth > 4 GHz). The TPD4S009 is suitable for high-speed differential applications, such as high-definition multimedia interface (HDMI), low-voltage differential signaling (LVDS), serial advanced technology attachment (SATA), Ethernet, 1394 (FireWire®), etc. The TPD4S009 complies with IEC 61000-4-2 (Level 4) ESD. This device is offered in space-saving DBV, DCK, and DRY packages. The TPD4S009 is characterized for operation over the ambient air temperature range of –40°C to 85°C. ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING SON – DRY Reel of 5000 TPD4S009DRYR 3H SOT (SOT-23) – DBV Reel of 3000 TPD4S009DBVR NFJK SOT (SC-70) – DCK Reel of 3000 TPD4S009DCKR PREVIEW Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. FireWire is a registered trademark of Apple Inc. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TPD4S009 SLVS817 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com CIRCUIT DIAGRAM VCC D2+ D1+ D1– D2– GND TERMINAL FUNCTIONS TERMINAL 2 TYPE DESCRIPTION NAME NO. D1+, D1–, D2+, D2– 1, 3, 4, 6 GND 2 GND Ground VCC 5 Supply Supply ESD port High-speed ESD clamp provides ESD protection to the high-speed differential data lines. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S009 www.ti.com ........................................................................................................................................................................................................ SLVS817 – MAY 2008 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) MIN MAX –0.3 6 V 0 VCC V Storage temperature range –65 125 °C Characterized free-air operating temperature range –40 85 °C 260 °C IEC 61000-4-2 Contact Discharge ±8 kV IEC 61000-4-2 Air-Gap Discharge ±9 kV Peak pulse power (tp = 8/20 µs) 25 W Peak pulse current (tp = 8/20 µs) 2.5 A VCC Supply voltage range VIO IO signal voltage range Tstg TA Lead temperature, 1.6 mm (1/16 in) from case for 10 s) UNIT ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP VRWM Reverse standoff voltage Any IO pin to ground VBR Breakdown voltage IIO = 1 mA Any IO pin to ground IIO IO port current VIO = 3.3 V, VCC = 5 V Any IO pin Ioff Current from IO port to supply pins VIO = 3.3 V, VCC = 5 V Any IO pin VD Diode forward voltage IIO = 8 mA Lower clamp diode RDYN Dynamic resistance I=1A Any IO pin 1.1 CIO IO capacitance VCC = 5 V, VIO = 2.5 V Any IO pin 0.8 ICC Operating supply current VIO = Open, VCC = 5 V VCC pin 0.1 MAX UNIT 5.5 V 0.1 µA 0.01 0.1 µA 0.8 0.95 9 V 0.01 0.6 pF 1 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 V Ω µA 3 TPD4S009 SLVS817 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS 2 70 D1+ Leakage Current (pA) Insertion Loss (dB) 0 D2+ -2 -4 -6 -8 60 50 40 30 20 10 -10 100k 1.E+05 1M 1.E+06 10M 1.E+07 100M 1.E+08 1G 1.E+09 0 10G 1.E+10 55 25 Temperature, TA (°C) –40 Frequency (Hz) Figure 1. Insertion Loss S21 – I/O to GND 85 Figure 2. Leakage Current vs Temperature (VIO = 2.5 V) 220 5.0 200 180 160 140 3.0 Amplitude (V) IO Capacitance (pF) 4.0 2.0 1.0 120 100 80 60 40 20 0 0.0 1 3 2 –20 5 4 0 25 IO Voltage (V) Figure 3. IO Capacitance vs Input Voltage (VCC = 5 V) 3.0 30 2.5 25 75 100 125 150 175 200 225 250 Time (nS) Figure 4. IEC Clamping Waveforms (8-kV Contact, Average of Ten Waveforms) 20 Current (A) 1.5 15 1.0 10 PPP (W) IPP (A) 2.0 50 Power (W) 5 0.5 0.0 0 0 5 10 15 20 25 30 35 Time (µs) 40 45 50 Figure 5. Pulse Waveform (8/20 µs Pulse) 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S009 www.ti.com ........................................................................................................................................................................................................ SLVS817 – MAY 2008 TYPICAL CHARACTERISTICS (continued) Figure 6. Eye Diagram Without TPD4S009 Figure 7. Eye Diagram With TPD4S009 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 5 PACKAGE OPTION ADDENDUM www.ti.com 28-Jul-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPD4S009DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) TPD4S009DCKR PREVIEW SC70 DCK 6 3000 TPD4S009DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) TBD Lead/Ball Finish CU NIPDAU Call TI CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM Call TI Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Jul-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) TPD4S009DBVR SOT-23 DBV 6 3000 180.0 TPD4S009DRYR SON DRY 6 5000 179.0 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 9.2 3.23 3.17 1.37 4.0 8.0 Q3 8.4 1.2 1.65 0.7 4.0 8.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 19-Jul-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD4S009DBVR TPD4S009DRYR SOT-23 DBV 6 3000 205.0 200.0 33.0 SON DRY 6 5000 220.0 205.0 50.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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