HL QF P1 44 SOT612-3 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HLQFP144 Package type industry code HLQFP144 Package style descriptive code HLQFP (thermal enhanced low profile quad flat package) Package style suffix code NA (not applicable) Package body material type P (plastic) JEDEC package outline code MS-026 Mounting method type S (surface mount) Issue date 5-7-2004 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 19.9 - 20 20.1 mm E package width 19.9 - 20 20.1 mm A seated height 1.4 - 1.5 1.6 mm A2 package height 1.35 - 1.4 1.45 mm e nominal pitch - - 0.5 - mm n2 actual quantity of termination - - 144 - SOT612-3 NXP Semiconductors plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad 2. Package outline HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT612-3 c y exposed die pad X A Dh 73 72 108 109 ZE e Eh E HE A A2 (A 3 ) A1 wM bp L pin 1 index 144 θ Lp detail X 37 1 36 v M A ZD wM bp e D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) Dh E(1) Eh e mm 1.6 0.12 0.05 1.45 1.35 0.25 0.27 0.17 0.20 0.09 20.1 19.9 5.7 5.5 20.1 19.9 5.7 5.5 0.5 HD HE 22.15 22.15 21.85 21.85 L Lp v w y 1 0.75 0.45 0.2 0.08 0.08 ZD(1) ZE(1) 1.4 1.1 1.4 1.1 θ o 7 o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT612-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-07-12 04-07-05 MS-026 Fig. 1. Package outline HLQFP144 (SOT612-3) SOT612-3 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT612-3 NXP Semiconductors plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad 3. Soldering Footprint information for reflow soldering of HLQFP144 package SOT612-3 Hx Gx P2 (0.125) P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste SPx SPy nSPx nSPy 1.000 1.000 4 4 SLx SLy 5.900 5.900 occupied area Dimensions in mm P1 P2 0.500 0.560 Issue date Ax Ay Bx By 23.300 23.300 20.300 20.300 C D1 1.500 0.280 D2 0.400 Gx Gy Hx Hy 20.500 20.500 23.550 23.550 09-12-29 09-12-29 SPx tot SPy tot 5.800 5.800 sot612-3_fr Fig. 2. Reflow soldering footprint for HLQFP144 (SOT612-3) SOT612-3 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT612-3 NXP Semiconductors plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT612-3 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT612-3 NXP Semiconductors plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT612-3 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5