SOT317-2 plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 8 February 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code QFP100 Package type industry code QFP100 Package style descriptive code QFP (quad flat package) Package style suffix code NA (not applicable) Package body material type P (plastic) JEDEC package outline code MO-112 Mounting method type S (surface mount) Issue date 25-2-2003 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 19.9 - 20 20.1 mm E package width 13.9 - 14 14.1 mm A seated height [tbd] - 3.2 3.2 mm A2 package height 2.65 - 2.8 2.9 mm n2 actual quantity of termination - - 100 - SOT317-2 NXP Semiconductors plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 2. Package outline QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm SOT317-2 c y X 80 A 51 81 50 ZE e E HE A A2 (A 3) A1 θ wM pin 1 index Lp bp L 31 100 detail X 30 1 wM bp e ZD v M A D B HD v M B 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp v w y mm 3.2 0.25 0.05 2.90 2.65 0.25 0.40 0.25 0.25 0.14 20.1 19.9 14.1 13.9 0.65 24.2 23.6 18.2 17.6 1.95 1.0 0.6 0.2 0.15 0.1 Z D(1) Z E(1) 0.8 0.4 1.0 0.6 θ 7o o 0 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT317-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-25 MO-112 Fig. 1. Package outline QFP100 (SOT317-2) SOT317-2 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT317-2 NXP Semiconductors plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 3. Soldering Footprint information for reflow soldering of QFP100 package SOT317-2 Hx Gx P2 Hy (0.125) P1 Gy By Ay C D2 (8×) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.650 P2 Ax Ay Bx By 0.700 25.300 19.300 20.900 14.900 C D1 D2 2.200 0.400 0.500 Gx Gy Hx Hy 20.500 14.500 25.550 19.550 sot317-2_fr Fig. 2. Reflow soldering footprint for QFP100 (SOT317-2) SOT317-2 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT317-2 NXP Semiconductors plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT317-2 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT317-2 NXP Semiconductors plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT317-2 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5