Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Second QUARTER 2012 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Technology List 10 10. Failure Rate Calculations 11 11. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: Jun 21, 2012 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 13 FITS (1,352K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 22 FITS (354K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 314 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 3,811K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 303 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS APG 1 LAST 4Q 0 0 82 328 0 0 82 328 0 0 82 328 0 0 82 328 82,000 328,000 23 23 0 0 492 123 ASIC 1 LAST 4Q 0 0 280 1,190 0 0 280 990 0 0 280 990 0 0 100 700 190,000 854,600 13 24 0 0 363 45 MEMORY 1 LAST 4Q 0 0 100 1,372 0 0 100 1,000 0 0 100 1,000 0 0 100 999 100,000 1,017,356 48 47 0 0 189 19 MCU 1 LAST 4Q 0 0 1,662 8,158 0 0 468 1,369 0 0 468 1,190 0 0 231 408 406,812 1,154,944 61 34 0 37 23 RFA 1 LAST 4Q 0 0 4,462 8,360 0 0 539 3,157 0 0 539 3,157 0 0 231 1,925 573,304 2,713,744 67 142 0 0 24 2 ATMEL 1 LAST 4Q 0 0 6,586 19,408 0 0 1,469 6,844 0 0 1,469 6,665 0 0 744 4,360 1,352,116 6,068,644 54 82 0 0 13 2 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 77 154,000 84 0 102 70 0 0 0 0 38,500 61,000 117 75 0 0 203 200 77 77 0 0 77 77 77,000 77,000 42 42 0 0 285 285 0 231 0 231 231,000 142 0 28 77 616 0 0 77 616 0 0 77 616 77,000 677,440 117 280 0 0 102 5 0 0 77 609 0 0 77 430 0 0 0 77 50,164 406,692 3 7 0 0 6,105 314 145 445 0 0 145 445 0 0 145 445 0 0 100 400 122,500 422,500 19 22 0 0 393 100 0 0 90 387 0 0 90 387 0 0 90 387 0 0 0 277 45,000 332,000 3 18 0 0 6,805 153 1 LAST 4Q 0 0 82 246 0 0 82 246 0 0 82 246 0 0 82 246 82,000 246,000 23 23 0 0 492 164 45.6K 1 LAST 4Q 0 0 154 467 0 0 154 467 0 0 154 467 0 0 0 236 77,000 351,500 142 114 0 0 84 23 45201 1 LAST 4Q 0 231 0 231 0 231 0 231 231,000 142 0 28 1 LAST 4Q 0 231 0 231 0 231 0 0 38,500 142 0 168 40K 1 LAST 4Q 0 0 477 631 0 0 77 231 0 0 77 231 0 0 77 231 96,200 250,200 117 117 0 0 81 31 38.6 K 1 LAST 4Q 0 0 3,600 3,754 0 0 77 231 0 0 77 231 0 0 77 231 246,104 400,104 17 55 0 0 225 41 35K 1 LAST 4Q 0 0 1,487 6,413 0 0 536 2,189 0 0 536 2,189 0 0 254 1,131 440,648 1,862,752 57 47 0 0 36 10 REJ SS REJ SS REJ SS REJ SS 1 LAST 4Q 0 231 0 231 0 231 0 SCMOS3 1 LAST 4Q 0 0 77 122 0 0 77 122 0 0 77 122 SAC2NV 1 LAST 4Q 0 0 77 77 0 0 77 77 0 0 40009 1 LAST 4Q 0 231 0 231 75K 1 LAST 4Q 0 0 77 1,896 0 0 58K 1 LAST 4Q 0 0 320 3,174 57K 1 LAST 4Q 0 0 56K 1 LAST 4Q 46K UHF 45102 RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH 34K 19K ATMEL QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 99 108,716 42 0 202 0 200 218,240 42 0 101 0 0 744 4,360 1,352,116 6,068,644 54 82 0 0 13 2 REJ SS REJ SS REJ SS REJ SS 1 LAST 4Q 0 292 0 100 0 100 0 1 LAST 4Q 0 580 0 200 0 200 1 LAST 4Q 0 0 6,586 19,408 0 0 1,469 6,844 0 0 1,469 6,665 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) BU QTR 168 Hours 500 Hours 1K Hours Device-Hours AF FITS REJ SS REJ SS REJ SS 1 LAST 4Q 0 80 0 80 0 80 80,000 117 98 1 0 80 0 80 0 80 80,000 98 LAST 4Q 0 397 0 397 0 397 397,000 117 117 MCU 1 LAST 4Q 0 0 314 1,644 0 0 314 1,564 0 0 234 1,484 274,000 1,537,440 117 117 29 5 ATMEL 1 LAST 4Q 0 0 394 2,121 0 0 394 2,041 0 0 314 1,961 354,000 2,014,440 117 117 22 4 ASIC MEMORY RELIABILITY MONITOR -- ATMEL PROPRIETARY 20 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS 63 K 1 LAST 4Q 0 0 80 240 0 0 80 240 0 0 80 240 80,000 240,000 117 117 98 33 58K 1 LAST 4Q 0 0 77 619 0 0 77 539 0 0 77 539 77,000 552,440 117 117 102 14 35K 1 LAST 4Q 0 0 237 1,025 0 0 237 1,025 0 0 157 945 197,000 985,000 117 117 40 8 34K 1 LAST 4Q 0 77 0 77 0 77 77,000 117 102 1 LAST 4Q 0 160 0 160 0 160 160,000 117 49 1 LAST 4Q 0 0 394 2,121 0 0 394 2,041 0 0 314 1,961 354,000 2,014,440 117 117 22 4 19K ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles REJ SS REJ SS REJ SS REJ SS % Defective BGA 1 LAST 4Q 0 0 80 157 0 0 80 157 0 0 80 157 0 0 80 80 0.00% 0.00% LGA 1 LAST 4Q 0 79 0 79 0 79 0 79 0.00% 1 LAST 4Q 0 548 0 543 0 471 0 471 0.00% 1 LAST 4Q 0 157 0 157 0 157 0 157 0.00% 1 LAST 4Q 0 79 0 79 0 79 0 79 0.00% SOIC 1 LAST 4Q 0 0 80 160 0 0 80 160 0 0 80 160 0 0 80 160 0.00% 0.00% TQFP 1 LAST 4Q 0 0 154 542 0 0 72 383 0 0 0 311 0 0 0 152 0.00% 0.00% ATMEL 1 LAST 4Q 0 0 314 1,722 0 0 232 1,558 0 0 160 1,414 0 0 160 1,178 0.00% 0.00% MLF / QFN PDIP PLCC RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST PACKAGE QTR 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS BGA 1 LAST 4Q 0 77 0 77 0 77 0 0 77,000 0.00% MLF / QFN 1 LAST 4Q 0 0 308 847 0 0 308 847 0 0 308 847 0 0 1,694 3,243 3,696,000 7,333,000 0.00% 0.00% TQFP 1 LAST 4Q 0 308 0 308 0 307 0 695 1,697,500 0.00% TRANS 1 LAST 4Q 0 0 154 308 0 0 154 308 0 0 77 154 0 0 0 0 115,500 231,000 0.00% 0.00% ATMEL 1 LAST 4Q 0 0 462 1,540 0 0 462 1,540 0 0 385 1,385 0 0 1,694 4,174 3,811,500 9,810,500 0.00% 0.00% RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours REJ SS REJ SS REJ SS % Defective BGA 1 LAST 4Q 0 0 80 157 0 0 80 80 0 0 80 80 0.0% 0.0% LGA 1 LAST 4Q 0 80 0 80 0 80 0.0% 1 LAST 4Q 0 548 0 317 0 316 0.0% 1 LAST 4Q 0 157 0 157 0 157 0.0% 1 LAST 4Q 0 80 0 80 0 80 0.0% SOIC 1 LAST 4Q 0 0 80 160 0 0 80 160 0 0 80 160 0.0% 0.0% TQFP 1 LAST 4Q 0 0 143 607 0 0 0 80 0 0 0 80 0.0% 0.0% ATMEL 1 LAST 4Q 0 0 303 1,789 0 0 160 954 0 0 160 953 0.00% 0.00% MLF / QFN PDIP PLCC RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) 5 19.7 EPLD 0.5 PLD 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 5 34 EPROM 0.5 NTO 35 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH BiCMOS 0.6 5 42 CSO 43 HNO 46 5 55 Logic 5 55.8 5 56 5 TYPICAL PRODUCTS / APPLICATIONS EPROM ASIC ASIC, TX RF RFA 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH SJO 63 HNO 75 HNO 6UH6+BICMOS RFA HNO BCDMOS HNO BICMOS HNO BICMOS2 HNO I²L HNO SCMOS3 HNO RFA 6BD1 0.8 ASIC / RFA ASIC / RFA RFA 6IL4 2 ASIC SIGE2 6SG1 0.8 RFA HNO UHF 6UH6 0.5 ASIC / RFA HNO UNI3 NTO Z86 CMOS Digital 0.8 SRAM,MICRO, VAN DLC NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO RFA RFA NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12