Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Fourth QUARTER 2009 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Technology List 10 10. Failure Rate Calculations 11 11. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: Jan 13, 2010 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 5 FITS (2,937K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 9 FITS (870K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 727 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 1,078K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 693 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS APG 3 LAST 4Q 0 0 162 1,122 0 0 162 1,122 0 0 162 668 0 0 162 668 162,000 744,272 35 36 0 0 160 34 ASIC 3 LAST 4Q 0 0 2,303 8,925 0 0 605 3,735 0 0 605 2,963 0 0 545 1,728 656,504 2,724,316 16 41 0 0 90 8 MEMORY 3 LAST 4Q 0 0 800 4,286 0 0 400 2,260 0 0 400 1,756 0 0 400 1,747 419,200 1,933,420 48 65 0 0 46 7 MCU 3 LAST 4Q 0 0 2,455 10,069 0 0 408 1,532 0 0 408 1,457 0 0 254 995 429,256 1,648,376 20 13 0 0 108 43 RFA 3 LAST 4Q 0 0 1,078 2,818 0 0 1,078 2,818 0 0 1,078 2,818 0 0 1,001 2,741 1,270,500 3,239,500 103 124 0 0 7 2 ATMEL 3 LAST 4Q 0 0 6,798 27,220 0 0 2,653 11,467 0 0 2,653 9,662 0 0 2,362 7,879 2,937,460 10,289,884 60 67 0 0 5 1 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS Z92 3 LAST 4Q 0 0 45 2,522 0 0 45 353 0 0 45 353 0 0 0 154 22,500 357,612 3 3 0 0 14,833 899 UNI3 3 LAST 4Q 0 0 231 231 0 0 231 231 0 0 231 231 0 0 154 154 192,500 192,500 117 117 0 0 41 41 UHF 3 LAST 4Q 0 0 116 620 0 0 116 620 0 0 116 620 0 0 116 620 193,000 773,000 52 63 0 0 92 19 BCDMOS 3 LAST 4Q 0 80 0 80 0 80 0 80 80,000 6 0 1,937 BICMOS2 3 LAST 4Q 0 0 153 233 0 0 153 233 0 0 153 233 0 0 153 233 153,000 233,000 161 146 0 0 37 27 BICMOS 3 LAST 4Q 0 153 0 153 0 153 0 153 230,000 206 0 19 75K 3 LAST 4Q 0 0 308 1,155 0 0 308 1,155 0 0 308 1,155 0 0 308 1,155 385,000 1,232,000 117 174 0 0 20 4 63K 3 LAST 4Q 0 1,786 0 560 0 556 0 547 611,020 84 0 18 3 LAST 4Q 0 693 0 693 0 462 0 0 269,808 117 0 29 58K 3 LAST 4Q 0 0 607 2,947 0 0 77 275 0 0 77 200 0 0 0 123 63,940 302,356 3 4 0 0 4,962 830 57.5K 3 LAST 4Q 0 539 0 539 0 231 0 0 167,244 117 0 47 57K 3 LAST 4Q 0 0 141 567 0 0 141 567 0 0 141 567 0 0 141 567 141,000 567,000 17 20 0 0 382 81 56.9K 3 LAST 4Q 0 0 80 630 0 0 80 630 0 0 80 340 0 0 80 340 80,000 388,720 48 48 0 0 237 49 56.8K 3 LAST 4Q 0 385 0 385 0 154 0 0 115,808 117 0 68 56K 3 LAST 4Q 0 0 1,750 2,798 0 0 252 577 0 0 252 577 0 0 252 555 323,904 672,608 9 12 0 0 309 115 55K 3 LAST 4Q 0 154 0 154 0 152 0 0 76,336 117 0 102 58.8K RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS 46K 3 LAST 4Q 0 0 82 492 0 0 82 492 0 0 82 328 0 0 82 328 82,000 355,552 23 23 0 0 492 113 38.6 K 3 LAST 4Q 0 0 154 154 0 0 154 154 0 0 154 154 0 0 154 154 154,000 154,000 117 117 0 0 51 51 35K 3 LAST 4Q 0 0 2,231 8,681 0 0 714 2,816 0 0 714 2,316 0 0 622 1,916 817,816 2,634,520 34 31 0 0 33 11 34K 3 LAST 4Q 0 0 300 900 0 0 100 300 0 0 100 300 0 0 100 300 109,600 328,800 11 70 0 0 736 40 19K 3 LAST 4Q 0 0 600 1,500 0 0 200 500 0 0 200 500 0 0 200 500 219,200 548,000 63 50 0 0 67 33 ATMEL 3 LAST 4Q 0 0 6,798 27,220 0 0 2,653 11,467 0 0 2,653 9,662 0 0 2,362 7,879 2,937,460 10,289,884 60 67 0 0 5 1 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) BU QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS ASIC 3 LAST 4Q 0 0 231 770 0 0 231 770 0 0 231 693 231,000 731,500 117 117 34 11 MEMORY 3 0 231 0 231 0 231 231,000 34 LAST 4Q 0 1,339 0 1,339 0 1,339 1,339,000 117 117 MCU 3 LAST 4Q 0 0 485 2,085 0 0 485 2,085 0 0 331 1,699 408000 1,892,000 117 117 19 4 ATMEL 3 LAST 4Q 0 0 947 4,194 0 0 947 4,194 0 0 793 3,731 870,000 3,962,500 117 117 9 2 RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours Device-Hours AF FITS REJ SS REJ SS REJ SS 3 LAST 4Q 0 154 0 154 0 77 115,500 117 68 63 K 3 LAST 4Q 0 0 77 539 0 0 77 539 0 0 77 539 77,000 539,000 117 117 102 15 56K 3 LAST 4Q 0 0 154 308 0 0 154 308 0 0 154 308 154,000 308,000 117 117 51 25 35K 3 LAST 4Q 0 0 331 2,149 0 0 331 2,149 0 0 254 1,917 292,500 2,033,000 117 117 27 4 34K 3 LAST 4Q 0 0 77 231 0 0 77 231 0 0 77 231 77,000 231,000 117 117 102 34 19K 3 LAST 4Q 0 0 154 385 0 0 154 385 0 0 154 385 154,000 385,000 117 117 51 20 58K 3 LAST 4Q 0 0 154 428 0 0 154 428 0 0 77 274 115,500 351,000 117 117 68 22 ATMEL 3 LAST 4Q 0 0 947 4,194 0 0 947 4,194 0 0 793 3,731 870,000 3,962,500 117 117 9 2 Z92 RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles REJ SS REJ SS REJ SS REJ SS % Defective CBGA 3 LAST 4Q 0 0 77 154 0 0 77 154 0 0 77 154 0 0 77 147 0.00% 0.00% LGA 3 LAST 4Q 0 77 0 77 0 77 0 77 0.00% MLF / QFN 3 LAST 4Q 0 0 308 698 0 0 308 698 0 0 308 698 0 0 308 616 0.00% 0.00% QFP 3 LAST 4Q 0 0 34 111 0 0 34 111 0 0 34 111 0 0 0 77 0.00% 0.00% PDIP 3 LAST 4Q 0 0 77 308 0 0 77 308 0 0 77 308 0 0 77 308 0.00% 0.00% PLCC 3 LAST 4Q 0 0 154 308 0 0 154 308 0 0 154 308 0 0 154 308 0.00% 0.00% SOIC 3 LAST 4Q 0 857 0 857 0 857 0 611 0.00% 3 LAST 4Q 0 77 0 77 0 77 0 77 0.00% TQFP 3 LAST 4Q 0 0 77 461 0 0 77 461 0 0 77 461 0 0 77 375 0.00% 0.00% TSOP / VSOP 3 LAST 4Q 0 230 0 230 0 230 0 230 0.00% 3 LAST 4Q 0 477 0 477 0 477 0 231 0.00% 3 LAST 4Q 0 0 727 3,758 0 0 727 3,758 0 0 727 3,758 0 0 693 3,057 0.00% 0.00% SOT-23 TSSOP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST PACKAGE QTR CBGA 3 LAST 4Q 0 0 77 154 0 0 77 154 0 0 77 154 0 0 0 0 77,000 154,000 0.00% 0.00% MLF / QFN 3 LAST 4Q 0 0 154 467 0 0 154 467 0 0 154 461 0 0 154 208 462,000 880,000 0.00% 0.00% QFP 3 LAST 4Q 0 77 0 77 0 77 0 0 77,000 0.00% 3 LAST 4Q 0 631 0 631 0 631 0 231 1,093,000 0.00% TQFP 3 LAST 4Q 0 0 77 460 0 0 77 460 0 0 77 384 0 0 0 0 77,000 422,000 0.00% 0.00% TSSOP 3 LAST 4Q 0 477 0 477 0 477 0 0 477,000 0.00% 3 LAST 4Q 0 0 308 2,266 0 0 308 2,266 0 0 308 2,184 0 0 385 1,440 1,078,000 5,105,000 0.00% 0.00% SOIC ATMEL 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours REJ SS REJ SS REJ SS % Defective CBGA 3 LAST 4Q 0 0 77 154 0 0 0 0 0 0 0 0 0.0% 0.0% LGA 3 LAST 4Q 0 77 0 77 0 77 0.0% MLF / QFN 3 LAST 4Q 0 0 308 613 0 0 154 231 0 0 154 231 0.0% 0.0% QFP 3 LAST 4Q 0 60 0 0 0 0 0.0% PDIP 3 LAST 4Q 0 0 77 308 0 0 77 308 0 0 77 308 0.0% 0.0% PLCC 3 LAST 4Q 0 0 154 308 0 0 154 308 0 0 154 308 0.0% 0.0% SOIC 3 LAST 4Q 0 862 0 231 0 231 0.0% 3 LAST 4Q 0 77 0 77 0 77 0.0% TQFP 3 LAST 4Q 0 0 77 459 0 0 0 0 0 0 0 0 0.0% 0.0% TSOP / VSOP 3 LAST 4Q 0 231 0 231 0 231 0.0% 3 LAST 4Q 0 477 0 0 0 0 0.0% 3 LAST 4Q 0 0 693 3,626 0 0 385 1,463 0 0 385 1,463 0.00% 0.00% SOT-23 TSSOP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) 5 19.7 EPLD 0.5 PLD 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 5 34 EPROM 0.5 EPROM NTO 35 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH BiCMOS 0.6 5 42 CSO 43 ASIC HNO 46 5 55 Logic 5 55.8 5 56 5 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH SJO 63 ASIC, TX RF RFA 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC HNO 75 RFA HNO 6UH6+BICMOS RFA HNO BCDMOS HNO BICMOS HNO BICMOS2 HNO I²L HNO SCMOS3 HNO 6BD1 0.8 ASIC / RFA ASIC / RFA RFA 6IL4 2 SIGE2 6SG1 0.8 RFA 6UH6 0.5 ASIC / RFA CMOS Digital 0.8 SRAM,MICRO, VAN DLC HNO UHF HNO UNI3 NTO Z86 ASIC RFA RFA NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12