Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot Third QUARTER 2011 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Technology List 10 10. Failure Rate Calculations 11 11. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: Oct 11, 2011 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 10 FITS (1,587K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 10 FITS (782K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 702 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 865K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 782 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS APG 2 LAST 4Q 0 0 82 408 0 0 82 408 0 0 82 408 0 0 82 408 82,000 408,000 23 28 0 0 492 81 ASIC 2 LAST 4Q 0 0 590 1,250 0 0 390 1,050 0 0 390 1,050 0 0 300 915 354,600 992,100 31 25 0 0 84 37 MEMORY 2 LAST 4Q 0 0 200 1,200 0 0 200 1,000 0 0 200 1,000 0 0 200 1,000 200,000 1,009,600 48 51 0 0 95 18 MCU 2 LAST 4Q 0 0 2,085 70,335 0 0 408 2,028 0 0 408 1,797 0 0 100 796 334,496 4,614,044 25 6 0 0 112 34 RFA 2 LAST 4Q 0 0 693 3,000 0 0 693 3,000 0 0 693 3,000 0 0 539 2,001 616,000 2,500,500 99 112 0 0 15 3 ATMEL 2 LAST 4Q 0 0 3,650 76,193 0 0 1,773 7,486 0 0 1,773 7,255 0 0 1,221 5,120 1,587,096 9,524,244 58 42 0 0 10 2 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 230 230,000 117 0 34 0 0 22,500 3 0 14,017 45 275 0 0 0 0 22,500 137,500 3 112 0 0 13,610 59 0 461 0 77 269,000 81 0 42 77 0 77 0 77 77,000 206 0 58 0 154 0 154 0 154 154,000 117 0 51 154 0 154 0 154 0 154 154,000 117 0 51 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77 77 77,000 77,000 142 142 0 0 84 84 2 LAST 4Q 0 0 308 1,232 0 0 308 1,232 0 0 308 1,232 0 0 308 1,001 308,000 1,116,500 117 116 0 0 25 7 2 LAST 4Q 0 300 0 100 0 100 0 100 109,600 76 0 110 58K 2 LAST 4Q 0 0 1,522 3,376 0 0 276 738 0 0 276 661 0 0 0 385 197,808 662,560 12 5 0 0 399 259 57K 2 LAST 4Q 0 0 100 400 0 0 100 400 0 0 100 400 0 0 100 400 100,000 400,000 23 23 0 403 101 2 LAST 4Q 0 80 0 80 0 80 0 80 80,000 48 0 237 56K 2 LAST 4Q 0 0 177 477 0 0 177 477 0 0 177 477 0 0 177 477 177,000 477,000 20 22 0 0 258 88 46K 2 LAST 4Q 0 246 0 246 0 246 0 246 246,000 23 0 164 2 LAST 4Q 0 0 82 159 0 0 82 159 0 0 82 159 0 0 82 159 82,000 159,000 23 80 0 492 72 2 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77 77 77,000 77,000 142 142 0 0 84 84 REJ SS REJ SS REJ SS REJ SS 2 LAST 4Q 0 230 0 230 0 230 0 2 LAST 4Q 0 45 0 45 0 45 SCMOS3 2 LAST 4Q 0 0 45 275 0 0 45 275 0 0 SAC2NV 2 LAST 4Q 0 461 0 461 2 LAST 4Q 0 77 0 2 LAST 4Q 0 154 2 LAST 4Q 0 40009 2 LAST 4Q 75K 63K UHF SCMOS2 BCDMOS BICMOS2 0.5UMSPDMEE 56.9K 45.6K 45201 RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS 35K 2 LAST 4Q 0 0 962 68,073 0 0 531 2,404 0 0 531 2,250 0 0 300 1,326 436,188 4,965,984 44 14 0 0 48 13 19K 2 LAST 4Q 0 0 300 300 0 0 100 100 0 0 100 100 0 0 100 100 109,600 109,600 42 42 0 0 201 201 ATMEL 2 LAST 4Q 0 0 3,650 76,193 0 0 1,773 7,486 0 0 1,773 7,255 0 0 1,221 5,120 1,587,096 9,524,244 58 42 0 0 10 2 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) BU QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS APG 2 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 117 117 ASIC 2 LAST 4Q 0 1 80 80 0 0 80 80 0 0 80 80 80,000 80,000 117 117 98 216 MEMORY 2 0 80 0 80 0 80 80,000 98 LAST 4Q 0 317 0 317 0 317 317,000 117 117 MCU 2 LAST 4Q 0 0 622 2,680 0 0 622 2,449 0 0 622 2,141 622,000 2,333,808 117 117 13 3 RFA 2 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 117 117 ATMEL 2 LAST 4Q 0 1 782 3,077 0 0 782 2,846 0 0 782 2,538 782,000 2,730,808 117 117 RELIABILITY MONITOR -- ATMEL PROPRIETARY 25 10 6 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS 63 K 2 LAST 4Q 0 0 80 317 0 0 80 317 0 0 80 317 80,000 317,000 117 117 98 25 58K 2 LAST 4Q 0 0 385 1,309 0 0 385 1,309 0 0 385 1,155 385,000 1,232,000 117 117 20 6 35K 2 LAST 4Q 0 0 237 1,371 0 0 237 1,140 0 0 237 986 237,000 1,101,808 117 117 33 7 19K 2 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 80,000 80,000 117 117 98 98 ATMEL 2 LAST 4Q 0 0 782 3,077 0 0 782 2,846 0 0 782 2,538 782,000 2,730,808 117 117 10 3 RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles % Defective REJ SS REJ SS REJ SS REJ SS 2 LAST 4Q 0 77 0 77 0 77 0 77 0.00% BGA 2 LAST 4Q 0 0 77 308 0 0 77 308 0 0 77 308 0 0 0 226 0.00% 0.00% LGA 2 LAST 4Q 0 77 0 77 0 77 0 77 0.00% MLF / QFN 2 LAST 4Q 0 0 311 468 0 0 311 468 0 0 311 468 0 0 311 463 0.00% 0.00% PDIP 2 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0 0 80 80 0.00% 0.00% SOIC 2 LAST 4Q 0 77 0 77 0 77 0 77 0.00% TQFP 2 LAST 4Q 0 0 234 1,235 0 0 234 1,235 0 0 234 1,235 0 0 80 753 0.00% 0.00% TSSOP 2 LAST 4Q 0 77 0 77 0 77 0 77 0.00% 2 LAST 4Q 0 0 702 2,399 0 0 702 2,399 0 0 702 2,399 0 0 471 1,830 0.00% 0.00% CASON ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST PACKAGE QTR 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS BGA 2 LAST 4Q 0 0 77 308 0 0 77 308 0 0 77 308 0 0 0 0 77,000 308,000 0.00% 0.00% MLF / QFN 2 LAST 4Q 0 0 154 231 0 0 154 231 0 0 154 231 0 0 160 240 474,000 711,000 0.00% 0.00% TQFP 2 LAST 4Q 0 0 154 818 0 0 154 818 0 0 154 587 0 0 79 79 312,000 860,500 0.00% 0.00% ATMEL 2 LAST 4Q 0 0 385 1,357 0 0 385 1,357 0 0 385 1,126 0 0 240 551 865,000 2,343,500 0.00% 0.00% RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE 96 Hours QTR 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 2 LAST 4Q 0 77 0 77 0 77 0.0% BGA 2 LAST 4Q 0 0 77 308 0 0 0 0 0 0 0 0 0.0% 0.0% LGA 2 LAST 4Q 0 77 0 77 0 77 0.0% 2 LAST 4Q 0 0 314 471 0 0 160 240 0 0 160 240 0.0% 2 LAST 4Q 0 0 80 80 0 0 80 80 0 0 80 80 0.0% 2 LAST 4Q 0 0 0 77 0 0 0 77 0 0 0 77 0.0% 2 LAST 4Q 0 0 311 1,311 0 0 80 80 0 0 80 80 0.0% 2 LAST 4Q 0 0 782 2,401 0 0 320 631 0 0 320 631 0.00% 0.00% CASON MLF / QFN PDIP SOIC TQFP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) PLD 5 19.7 EPLD 0.5 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 EPROM 0.5 5 34 NTO 35 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH BiCMOS 0.6 5 42 CSO 43 HNO 46 5 55 Logic 5 55.8 5 56 5 EPROM ASIC ASIC, TX RF RFA 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH SJO 63 HNO 75 RFA HNO 6UH6+BICMOS RFA HNO BCDMOS HNO BICMOS HNO BICMOS2 HNO I²L HNO SCMOS3 HNO 6BD1 0.8 ASIC / RFA ASIC / RFA RFA 6IL4 2 SIGE2 6SG1 0.8 RFA HNO UHF 6UH6 0.5 ASIC / RFA HNO UNI3 NTO Z86 CMOS Digital 0.8 SRAM,MICRO, VAN DLC ASIC RFA RFA NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12