Q3 2011 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
Third QUARTER 2011
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product BU)
2
3. HTOL (sorted by technology)
3-4
4. Data Retention Bake (sorted by product BU)
5
5. Data Retention Bake (sorted by technology)
6
6. Temperature Cycle
7
7. Temperature Humidity Bias & HAST
8
8. Steam Pressure Pot
9
9. Technology List
10
10. Failure Rate Calculations
11
11. Definitions
12
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
Oct 11, 2011
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process, package or business unit and performing a series of reliability
tests to ensure that the reliability has maintained over time. Listed below are the overall
results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C; 0 failures)
Failure Rate: 10 FITS (1,587K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours. All failures were inconclusive.
2.
Data Retention Bake (150°C; 0 failures)
Failure Rate: 10 FITS (782K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 117 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
Failure Rate: 0.00% (0 failures out of 702 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
Failure Rate: 0.00% (0 failures out of 865K device-hours)
Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
Failure Rate: 0.00% (0 failures out of 782 units)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
* indicates that preconditioning is performed prior to the stress test.
1
High Temperature Operating Life
(sorted by FAMILY)
BU
QTR
48 Hours
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
REJ
SS
Device-Hours*
WAF
EFR PPM
FITS
APG
2
LAST 4Q
0
0
82
408
0
0
82
408
0
0
82
408
0
0
82
408
82,000
408,000
23
28
0
0
492
81
ASIC
2
LAST 4Q
0
0
590
1,250
0
0
390
1,050
0
0
390
1,050
0
0
300
915
354,600
992,100
31
25
0
0
84
37
MEMORY
2
LAST 4Q
0
0
200
1,200
0
0
200
1,000
0
0
200
1,000
0
0
200
1,000
200,000
1,009,600
48
51
0
0
95
18
MCU
2
LAST 4Q
0
0
2,085
70,335
0
0
408
2,028
0
0
408
1,797
0
0
100
796
334,496
4,614,044
25
6
0
0
112
34
RFA
2
LAST 4Q
0
0
693
3,000
0
0
693
3,000
0
0
693
3,000
0
0
539
2,001
616,000
2,500,500
99
112
0
0
15
3
ATMEL
2
LAST 4Q
0
0
3,650
76,193
0
0
1,773
7,486
0
0
1,773
7,255
0
0
1,221
5,120
1,587,096
9,524,244
58
42
0
0
10
2
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
230
230,000
117
0
34
0
0
22,500
3
0
14,017
45
275
0
0
0
0
22,500
137,500
3
112
0
0
13,610
59
0
461
0
77
269,000
81
0
42
77
0
77
0
77
77,000
206
0
58
0
154
0
154
0
154
154,000
117
0
51
154
0
154
0
154
0
154
154,000
117
0
51
0
0
77
77
0
0
77
77
0
0
77
77
0
0
77
77
77,000
77,000
142
142
0
0
84
84
2
LAST 4Q
0
0
308
1,232
0
0
308
1,232
0
0
308
1,232
0
0
308
1,001
308,000
1,116,500
117
116
0
0
25
7
2
LAST 4Q
0
300
0
100
0
100
0
100
109,600
76
0
110
58K
2
LAST 4Q
0
0
1,522
3,376
0
0
276
738
0
0
276
661
0
0
0
385
197,808
662,560
12
5
0
0
399
259
57K
2
LAST 4Q
0
0
100
400
0
0
100
400
0
0
100
400
0
0
100
400
100,000
400,000
23
23
0
403
101
2
LAST 4Q
0
80
0
80
0
80
0
80
80,000
48
0
237
56K
2
LAST 4Q
0
0
177
477
0
0
177
477
0
0
177
477
0
0
177
477
177,000
477,000
20
22
0
0
258
88
46K
2
LAST 4Q
0
246
0
246
0
246
0
246
246,000
23
0
164
2
LAST 4Q
0
0
82
159
0
0
82
159
0
0
82
159
0
0
82
159
82,000
159,000
23
80
0
492
72
2
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
0
0
77
77
77,000
77,000
142
142
0
0
84
84
REJ
SS
REJ
SS
REJ
SS
REJ
SS
2
LAST 4Q
0
230
0
230
0
230
0
2
LAST 4Q
0
45
0
45
0
45
SCMOS3
2
LAST 4Q
0
0
45
275
0
0
45
275
0
0
SAC2NV
2
LAST 4Q
0
461
0
461
2
LAST 4Q
0
77
0
2
LAST 4Q
0
154
2
LAST 4Q
0
40009
2
LAST 4Q
75K
63K
UHF
SCMOS2
BCDMOS
BICMOS2
0.5UMSPDMEE
56.9K
45.6K
45201
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
REJ
SS
Device-Hours*
WAF
EFR PPM
FITS
35K
2
LAST 4Q
0
0
962
68,073
0
0
531
2,404
0
0
531
2,250
0
0
300
1,326
436,188
4,965,984
44
14
0
0
48
13
19K
2
LAST 4Q
0
0
300
300
0
0
100
100
0
0
100
100
0
0
100
100
109,600
109,600
42
42
0
0
201
201
ATMEL
2
LAST 4Q
0
0
3,650
76,193
0
0
1,773
7,486
0
0
1,773
7,255
0
0
1,221
5,120
1,587,096
9,524,244
58
42
0
0
10
2
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by FAMILY)
BU
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours
AF
FITS
APG
2
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
117
117
ASIC
2
LAST 4Q
0
1
80
80
0
0
80
80
0
0
80
80
80,000
80,000
117
117
98
216
MEMORY
2
0
80
0
80
0
80
80,000
98
LAST 4Q
0
317
0
317
0
317
317,000
117
117
MCU
2
LAST 4Q
0
0
622
2,680
0
0
622
2,449
0
0
622
2,141
622,000
2,333,808
117
117
13
3
RFA
2
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
117
117
ATMEL
2
LAST 4Q
0
1
782
3,077
0
0
782
2,846
0
0
782
2,538
782,000
2,730,808
117
117
RELIABILITY MONITOR -- ATMEL PROPRIETARY
25
10
6
5
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours AF
FITS
63 K
2
LAST 4Q
0
0
80
317
0
0
80
317
0
0
80
317
80,000
317,000
117
117
98
25
58K
2
LAST 4Q
0
0
385
1,309
0
0
385
1,309
0
0
385
1,155
385,000
1,232,000
117
117
20
6
35K
2
LAST 4Q
0
0
237
1,371
0
0
237
1,140
0
0
237
986
237,000
1,101,808
117
117
33
7
19K
2
LAST 4Q
0
0
80
80
0
0
80
80
0
0
80
80
80,000
80,000
117
117
98
98
ATMEL
2
LAST 4Q
0
0
782
3,077
0
0
782
2,846
0
0
782
2,538
782,000
2,730,808
117
117
10
3
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
100 Cycles
200 Cycles
500 Cycles
1K Cycles
% Defective
REJ
SS
REJ
SS
REJ
SS
REJ
SS
2
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
BGA
2
LAST 4Q
0
0
77
308
0
0
77
308
0
0
77
308
0
0
0
226
0.00%
0.00%
LGA
2
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
MLF / QFN
2
LAST 4Q
0
0
311
468
0
0
311
468
0
0
311
468
0
0
311
463
0.00%
0.00%
PDIP
2
LAST 4Q
0
0
80
80
0
0
80
80
0
0
80
80
0
0
80
80
0.00%
0.00%
SOIC
2
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
TQFP
2
LAST 4Q
0
0
234
1,235
0
0
234
1,235
0
0
234
1,235
0
0
80
753
0.00%
0.00%
TSSOP
2
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
2
LAST 4Q
0
0
702
2,399
0
0
702
2,399
0
0
702
2,399
0
0
471
1,830
0.00%
0.00%
CASON
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Humidity Bias / HAST
Temperature Humidity Bias
HAST
PACKAGE
QTR
168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective
REJ SS REJ SS REJ SS REJ SS
BGA
2
LAST 4Q
0
0
77
308
0
0
77
308
0
0
77
308
0
0
0
0
77,000
308,000
0.00%
0.00%
MLF / QFN
2
LAST 4Q
0
0
154
231
0
0
154
231
0
0
154
231
0
0
160
240
474,000
711,000
0.00%
0.00%
TQFP
2
LAST 4Q
0
0
154
818
0
0
154
818
0
0
154
587
0
0
79
79
312,000
860,500
0.00%
0.00%
ATMEL
2
LAST 4Q
0
0
385
1,357
0
0
385
1,357
0
0
385
1,126
0
0
240
551
865,000
2,343,500
0.00%
0.00%
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Steam Pressure Pot
PACKAGE
96 Hours
QTR
168 Hours
240 Hours
% Defective
REJ
SS
REJ
SS
REJ
SS
2
LAST 4Q
0
77
0
77
0
77
0.0%
BGA
2
LAST 4Q
0
0
77
308
0
0
0
0
0
0
0
0
0.0%
0.0%
LGA
2
LAST 4Q
0
77
0
77
0
77
0.0%
2
LAST 4Q
0
0
314
471
0
0
160
240
0
0
160
240
0.0%
2
LAST 4Q
0
0
80
80
0
0
80
80
0
0
80
80
0.0%
2
LAST 4Q
0
0
0
77
0
0
0
77
0
0
0
77
0.0%
2
LAST 4Q
0
0
311
1,311
0
0
80
80
0
0
80
80
0.0%
2
LAST 4Q
0
0
782
2,401
0
0
320
631
0
0
320
631
0.00%
0.00%
CASON
MLF / QFN
PDIP
SOIC
TQFP
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µm]
TYPICAL PRODUCTS / APPLICATIONS
5
15.3
EEPROM
1.8 - 2.3
sEEPROM
5
19.3
EEPROM
1.1
sEEPROM
5
19.5
Embedded Memory Configurator
1.0
Configurator
5
19.6
Embedded Memory
0.7
EEPROM, MC (Intel core), MC (AVR core)
PLD
5
19.7
EPLD
0.5
5
19.76
EPLD
0.5
PLD
5
19.8
CMOS
0.7
ASIC
5
19.8
Embedded Memory Configurator
0.7
5
19.9
Embedded Memory
0.7
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
5
25
BiCMOS
1.0
ASIC
5
26
Logic
0.7
ASIC
5
33.5
FLASH
0.5
EPROM
0.5
5
34
NTO
35
5
35.5
Embedded Memory Configurator
0.35
EEPROM, FLASH, MICRO, EPLD
5
37
EEPROM
0.35
FLASH, PEROM, DATA FLASH, sEEPROM
5
39
EEPROM
0.25
DATA FLASH
5
39.1
EEPROM
0.25
FLASH, DATA FLASH
BiCMOS
0.6
5
42
CSO
43
HNO
46
5
55
Logic
5
55.8
5
56
5
EPROM
ASIC
ASIC, TX RF
RFA
0.5
ASIC
CMOS
0.5
ASIC
Logic
0.35
ASIC
56.8
Embedded Memory
0.35
ASIC
7
57.0
CMOS
0.25
ASIC
7
57.5
CMOS
0.21
ASIC / RFA
7
58.0
CMOS
0.18
ASIC / RFA
SJO
61
CMOS
0.18
FLASH
SJO
63
HNO
75
RFA
HNO
6UH6+BICMOS
RFA
HNO
BCDMOS
HNO
BICMOS
HNO
BICMOS2
HNO
I²L
HNO
SCMOS3
HNO
6BD1
0.8
ASIC / RFA
ASIC / RFA
RFA
6IL4
2
SIGE2
6SG1
0.8
RFA
HNO
UHF
6UH6
0.5
ASIC / RFA
HNO
UNI3
NTO
Z86
CMOS Digital
0.8
SRAM,MICRO, VAN DLC
ASIC
RFA
RFA
NTO
Z91
CMOS Digital
0.6
SRAM, ASIC, MICRO
NTO
Z92
CMOS Digital
0.5
ASIC, MICRO,VAN DLC
CMOS + EPROM
0.5
OTP MICRO
NTO
Z94
HNO
Z95
RFA
HNO
Z96
RFA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ ⋅
[ VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
11
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage, and
dynamic bias conditions. Readouts at various time points are taken to
determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR
is expressed in defective parts per million (DPPM) and IFR is expressed in
Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
12