Q1 2009 (2008 data) Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
First QUARTER 2009
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product BU)
2
3. HTOL (sorted by technology)
3-4
4. Data Retention Bake (sorted by product BU)
5
5. Data Retention Bake (sorted by technology)
6
6. Temperature Cycle
7
7. Temperature Humidity Bias & HAST
8
8. Steam Pressure Pot
9
9. Technology List
10
10. Failure Rate Calculations
11
11. Definitions
12
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
April 8, 2009
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process, package or business unit and performing a series of reliability
tests to ensure that the reliability has maintained over time. Listed below are the overall
results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C; 0 failures)
Failure Rate: 3 FITS (2,868K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours. All failures were inconclusive.
2.
Data Retention Bake (150°C; 0 failures)
Failure Rate: 7 FITS (1,138K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 117 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
Failure Rate: 0.00% (0 failures out of 1,184 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
Failure Rate: 0.00% (0 failures out of 1498K device-hours)
Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
Failure Rate: 0.00% (0 failures out of 1,091 units)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
* indicates that preconditioning is performed prior to the stress test.
1
High Temperature Operating Life
(sorted by FAMILY)
BU
QTR
48 Hours
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
REJ
SS
Device-Hours*
WAF
EFR PPM
FITS
APG
4
LAST 4Q
0
0
636
3,115
0
0
636
3,115
0
0
182
944
0
0
182
944
258,272
1,308,728
38
40
0
0
95
18
ASIC
4
LAST 4Q
0
0
1,329
9,907
0
2
1,129
9,106
0
26
665
7,244
0
0
282
1,161
561,052
4,553,764
72
91
0
0
23
28
MEMORY
4
LAST 4Q
0
0
1,300
6,098
0
0
880
4,079
0
0
380
1,779
0
0
380
1,779
484,160
2,262,312
63
78
0
0
30
5
MCU
4
LAST 4Q
0
0
2,846
19,309
0
0
305
1,296
0
0
230
1,144
0
0
230
989
364,568
1,956,660
13
16
0
0
199
28
RFA
4
LAST 4Q
0
0
1,123
3,899
0
0
1,123
3,899
0
0
1,123
3,899
0
0
1,123
3,429
1,200,000
3,817,000
156
158
0
0
5
2
ATMEL
4
LAST 4Q
0
0
7,234
42,328
0
2
4,073
21,495
0
26
2,580
15,010
0
0
2,197
8,302
2,868,052
13,898,464
95
92
0
0
3
9
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
0
49,588
4
0
4,537
0
274
274,000
112
0
741
779,500
95
0
0
30
12
77
0
0
38,500
21
0
1,132
0
135
0
45
90,000
4
0
2,652
199
0
199
0
154
176,500
103
0
51
0
157
0
157
0
157
157,000
176
0
33
80
238
0
0
80
238
0
0
80
238
0
0
80
238
80,000
238,000
117
117
0
0
98
33
0
153
0
153
0
153
0
153
230,000
206
0
153
0
153
0
153
0
153
230,000
206
0
0
19
19
0
158
0
158
0
158
0
158
158,000
117
0
49
4
LAST 4Q
0
616
0
616
0
616
0
616
616,000
161
0
1,493
0
1,493
0
1,493
0
1,493
1,569,000
220
0
0
9
3
4
LAST 4Q
0
600
0
180
0
180
0
180
200,160
84
0
1,800
0
580
0
580
0
580
638,560
59
0
0
55
24
4
LAST 4Q
0
231
0
231
0
0
0
0
38,808
117
0
2,610
0
2,610
1
2,138
0
0
1,148,296
117
0
0
202
15
4
LAST 4Q
0
1,806
0
150
0
75
0
75
167,088
4
0
3,548
0
466
0
391
0
226
469,036
13
0
0
1,445
153
4
LAST 4Q
0
308
0
308
0
231
0
0
128,436
117
0
1,230
1
1,229
2
844
0
0
486,728
117
0
0
61
73
4
LAST 4Q
0
182
0
182
0
182
0
182
182,000
23
0
462
0
462
0
462
0
417
439,500
15
0
0
222
135
4
LAST 4Q
0
390
0
390
0
100
0
100
148,720
48
0
1,125
0
1,125
0
380
0
380
505,160
48
0
0
127
37
4
LAST 4Q
0
154
0
154
0
0
0
0
25,872
117
0
2,852
1
2,467
0
1,926
0
82
1,113,368
110
0
0
302
16
REJ
SS
REJ
SS
REJ
SS
REJ
SS
0
308
0
77
0
77
0
0
274
0
274
0
274
0
818
0
818
0
818
4
LAST 4Q
0
77
0
77
0
4
LAST 4Q
0
135
0
135
4
LAST 4Q
0
199
0
4
LAST 4Q
0
157
BICMOS2
4
LAST 4Q
0
0
BICMOS
4
LAST 4Q
Z92
UHF
SMD
SCMOS2
SCMOS3
BCDMOS
UHF5
75K
63K
58.8K
58K
57.5K
57K
56.9K
56.8K
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
201
328,936
57
0
613
0
0
76,336
603,016
117
117
0
0
102
44
0
82
109,552
23
0
485
595,208
39
0
0
368
39
154
0
154
283,360
48
0
67
0
355
0
355
481,480
37
0
1,939
0
1,939
3,035,056
35
0
0
52
9
300
0
300
0
300
328,752
187
0
15
0
0
201
27
0
0
3
9
REJ
SS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
508
0
508
21
431
0
55K
4
LAST 4Q
0
0
154
1,463
0
0
154
1,463
0
2
152
1,076
0
0
46K
4
LAST 4Q
0
246
0
246
0
82
0
1,141
0
1,141
0
485
0
924
0
924
0
0
1,740
0
855
0
18,831
0
4,316
0
899
0
56K
44K
35K
34K
19K
ATMEL
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
4
LAST 4Q
0
300
0
100
0
100
0
100
109,600
42
0
1,199
0
399
0
399
0
399
437,400
78
4
LAST 4Q
0
7,234
0
4,073
0
2,580
0
2,197
2,868,052
95
0
42,328
2
21,495
26
15,010
0
8,302
13,898,464
92
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by FAMILY)
BU
ASIC
QTR
168 Hours
4
LAST 4Q
REJ
0
0
500 Hours
SS
154
531
REJ
0
0
1K Hours
SS
154
531
REJ
0
0
SS
154
531
Device-Hours
AF
FITS
154,000
531,000
117
117
51
15
4
0
646
0
646
0
646
646,000
0
1,348
0
1,348
0
1,348
1,348,000
117
117
12
LAST 4Q
MCU
4
LAST 4Q
0
0
377
1,870
0
0
377
1,793
0
0
300
1,360
338,500
1,589,436
117
117
23
5
ATMEL
4
LAST 4Q
0
0
1,177
3,749
0
0
1,177
3,672
0
0
1,100
3,239
1,138,500
3,468,436
117
117
7
2
MEMORY
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
5
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
168 Hours
500 Hours
1K Hours
Device-Hours AF
FITS
REJ
SS
REJ
SS
REJ
SS
4
LAST 4Q
0
77
0
77
0
0
38,500
117
203
63 K
4
LAST 4Q
0
0
154
542
0
0
154
542
0
0
154
542
154,000
542,000
117
117
51
14
56K
4
LAST 4Q
0
0
77
223
0
0
77
223
0
0
77
223
77,000
223,000
117
117
102
35
35K
4
LAST 4Q
0
0
644
2,062
0
0
644
1,985
0
0
644
1,781
644,000
1,895,936
117
117
12
4
34K
4
LAST 4Q
0
234
0
234
0
234
234,000
117
33
19K
4
LAST 4Q
0
0
77
311
0
0
77
311
0
0
77
311
77,000
311,000
117
117
102
25
58K
4
LAST 4Q
0
0
225
300
0
0
225
300
0
0
148
148
186,500
224,000
117
117
42
35
ATMEL
4
LAST 4Q
0
0
1,177
3,749
0
0
1,177
3,672
0
0
1,100
3,239
1,138,500
3,468,436
117
117
7
2
Z92
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
100 Cycles
200 Cycles
500 Cycles
1K Cycles
REJ
SS
REJ
SS
REJ
SS
REJ
SS
% Defective
CBGA
4
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
0
0
70
70
0.00%
0.00%
BGA
4
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
LGA
4
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
0
0
77
77
0.00%
0.00%
MLF / QFN
4
LAST 4Q
0
0
159
939
0
0
159
939
0
0
159
939
0
0
77
507
0.00%
0.00%
QFP
4
LAST 4Q
0
0
77
847
0
0
77
847
0
0
77
847
0
0
77
663
0.00%
0.00%
PDIP
4
LAST 4Q
0
384
0
384
0
384
0
384
0.00%
PLCC
4
LAST 4Q
0
0
77
307
0
0
77
307
0
0
77
307
0
0
77
307
0.00%
0.00%
SOIC
4
LAST 4Q
0
0
395
857
0
0
395
857
0
0
395
857
0
0
149
606
0.00%
0.00%
TSOP / VSOP
4
LAST 4Q
0
0
76
76
0
0
76
76
0
0
76
76
0
0
76
76
0.00%
0.00%
TSSOP
4
LAST 4Q
0
0
246
246
0
0
246
246
0
0
246
246
0
0
0.00%
0.00%
4
LAST 4Q
0
0
1,184
3,887
0
0
1,184
3,887
0
0
1,184
3,887
0
0
603
2,767
0.00%
0.00%
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Humidity Bias / HAST
Temperature Humidity Bias
HAST
168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective
REJ SS REJ SS REJ SS REJ SS
PACKAGE
QTR
CBGA
4
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
0
0
77,000
77,000
0.00%
0.00%
4
LAST 4Q
0
0
159
939
0
0
159
939
0
0
159
631
0
0
159,000
785,000
0.00%
0.00%
4
LAST 4Q
0
0
77
770
0
0
77
770
0
0
77
616
0
77
77,000
847,000
0.00%
0.00%
SOIC
4
LAST 4Q
0
0
323
400
0
0
323
400
0
0
323
323
0
0
77
462
477,000
1,285,500
0.00%
0.00%
TSSOP
4
LAST 4Q
0
0
246
246
0
0
246
246
0
0
246
246
0
0
246,000
246,000
0.00%
0.00%
4
LAST 4Q
0
0
882
2,432
0
0
882
2,432
0
0
882
1,893
0
0
308
1,386
1,498,000
4,934,500
0.00%
0.00%
MLF / QFN
QFP
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Steam Pressure Pot
PACKAGE
QTR
96 Hours
168 Hours
SS
4
LAST 4Q
0
0
77
77
0
0
0
0
0.0%
0.0%
4
LAST 4Q
0
77
0
77
0
77
0.0%
LGA
4
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
0.0%
0.0%
MLF / QFN
4
LAST 4Q
0
0
77
539
0
0.0%
0.0%
4
LAST 4Q
0
0
60
744
0
77
0
77
0.0%
0.0%
4
LAST 4Q
0
385
0
385
0
385
0.0%
PLCC
4
LAST 4Q
0
0
77
308
0
0
77
308
0
0
77
308
0.0%
0.0%
SOIC
4
LAST 4Q
0
0
400
862
0
0
77
462
0
0
77
462
0.0%
0.0%
TSOP / VSOP
4
0
77
0
77
0
77
0.0%
LAST 4Q
0
77
0
77
0
77
0.0%
4
LAST 4Q
0
0
246
246
0
0
0
0
0.0%
0.0%
4
LAST 4Q
0
0
1,091
3,392
0
0
308
1,463
0
0
308
1,463
0.00%
0.00%
BGA
QFP
PDIP
TSSOP
ATMEL
0
SS
0
REJ
% Defective
REJ
CBGA
REJ
240 Hours
0
SS
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µm]
TYPICAL PRODUCTS / APPLICATIONS
5
15.3
EEPROM
1.8 - 2.3
sEEPROM
5
19.3
EEPROM
1.1
sEEPROM
5
19.5
Embedded Memory Configurator
1.0
Configurator
5
19.6
Embedded Memory
0.7
EEPROM, MC (Intel core), MC (AVR core)
PLD
5
19.7
EPLD
0.5
5
19.76
EPLD
0.5
PLD
5
19.8
CMOS
0.7
ASIC
5
19.8
Embedded Memory Configurator
0.7
5
19.9
Embedded Memory
0.7
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
5
25
BiCMOS
1.0
ASIC
5
26
Logic
0.7
ASIC
5
33.5
FLASH
0.5
EPROM
0.5
5
34
NTO
35
5
35.5
Embedded Memory Configurator
0.35
EEPROM, FLASH, MICRO, EPLD
5
37
EEPROM
0.35
FLASH, PEROM, DATA FLASH, sEEPROM
5
39
EEPROM
0.25
DATA FLASH
5
39.1
EEPROM
0.25
FLASH, DATA FLASH
BiCMOS
0.6
5
42
GFO / CSO
43
HNO
46
5
55
Logic
5
55.8
5
56
5
EPROM
ASIC
ASIC, TX RF
RFA
0.5
ASIC
CMOS
0.5
ASIC
Logic
0.35
ASIC
56.8
Embedded Memory
0.35
ASIC
7
57.0
CMOS
0.25
ASIC
7
57.5
CMOS
0.21
ASIC / RFA
7
58.0
CMOS
0.18
ASIC / RFA
SJO
61
CMOS
0.18
FLASH
SJO
63
HNO
75
RFA
HNO
6UH6+BICMOS
RFA
HNO
BCDMOS
HNO
BICMOS
HNO
BICMOS2
GFO
HCCD1
NMOS
2.5
6BD1
0.8
ASIC / RFA
ASIC / RFA
RFA
CCD
GFO
HCCD3
NMOS
1.5
CCD
HNO
I²L
6IL4
2
ASIC
HNO
SCMOS3
HNO
SIGE2
6SG1
0.8
RFA
HNO
UHF
6UH6
0.5
ASIC / RFA
HNO
UNI3
NTO
Z86
CMOS Digital
0.8
SRAM,MICRO, VAN DLC
RFA
RFA
NTO
Z91
CMOS Digital
0.6
SRAM, ASIC, MICRO
NTO
Z92
CMOS Digital
0.5
ASIC, MICRO,VAN DLC
CMOS + EPROM
0.5
OTP MICRO
NTO
Z94
HNO
Z95
RFA
HNO
Z96
RFA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ ⋅
[ VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
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Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage, and
dynamic bias conditions. Readouts at various time points are taken to
determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR
is expressed in defective parts per million (DPPM) and IFR is expressed in
Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
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