Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot First QUARTER 2009 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product BU) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product BU) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7 7. Temperature Humidity Bias & HAST 8 8. Steam Pressure Pot 9 9. Technology List 10 10. Failure Rate Calculations 11 11. Definitions 12 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: April 8, 2009 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process, package or business unit and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C; 0 failures) Failure Rate: 3 FITS (2,868K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. All failures were inconclusive. 2. Data Retention Bake (150°C; 0 failures) Failure Rate: 7 FITS (1,138K device-hours) Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 117 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * Failure Rate: 0.00% (0 failures out of 1,184 units) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * Failure Rate: 0.00% (0 failures out of 1498K device-hours) Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * Failure Rate: 0.00% (0 failures out of 1,091 units) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 High Temperature Operating Life (sorted by FAMILY) BU QTR 48 Hours 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS APG 4 LAST 4Q 0 0 636 3,115 0 0 636 3,115 0 0 182 944 0 0 182 944 258,272 1,308,728 38 40 0 0 95 18 ASIC 4 LAST 4Q 0 0 1,329 9,907 0 2 1,129 9,106 0 26 665 7,244 0 0 282 1,161 561,052 4,553,764 72 91 0 0 23 28 MEMORY 4 LAST 4Q 0 0 1,300 6,098 0 0 880 4,079 0 0 380 1,779 0 0 380 1,779 484,160 2,262,312 63 78 0 0 30 5 MCU 4 LAST 4Q 0 0 2,846 19,309 0 0 305 1,296 0 0 230 1,144 0 0 230 989 364,568 1,956,660 13 16 0 0 199 28 RFA 4 LAST 4Q 0 0 1,123 3,899 0 0 1,123 3,899 0 0 1,123 3,899 0 0 1,123 3,429 1,200,000 3,817,000 156 158 0 0 5 2 ATMEL 4 LAST 4Q 0 0 7,234 42,328 0 2 4,073 21,495 0 26 2,580 15,010 0 0 2,197 8,302 2,868,052 13,898,464 95 92 0 0 3 9 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 0 49,588 4 0 4,537 0 274 274,000 112 0 741 779,500 95 0 0 30 12 77 0 0 38,500 21 0 1,132 0 135 0 45 90,000 4 0 2,652 199 0 199 0 154 176,500 103 0 51 0 157 0 157 0 157 157,000 176 0 33 80 238 0 0 80 238 0 0 80 238 0 0 80 238 80,000 238,000 117 117 0 0 98 33 0 153 0 153 0 153 0 153 230,000 206 0 153 0 153 0 153 0 153 230,000 206 0 0 19 19 0 158 0 158 0 158 0 158 158,000 117 0 49 4 LAST 4Q 0 616 0 616 0 616 0 616 616,000 161 0 1,493 0 1,493 0 1,493 0 1,493 1,569,000 220 0 0 9 3 4 LAST 4Q 0 600 0 180 0 180 0 180 200,160 84 0 1,800 0 580 0 580 0 580 638,560 59 0 0 55 24 4 LAST 4Q 0 231 0 231 0 0 0 0 38,808 117 0 2,610 0 2,610 1 2,138 0 0 1,148,296 117 0 0 202 15 4 LAST 4Q 0 1,806 0 150 0 75 0 75 167,088 4 0 3,548 0 466 0 391 0 226 469,036 13 0 0 1,445 153 4 LAST 4Q 0 308 0 308 0 231 0 0 128,436 117 0 1,230 1 1,229 2 844 0 0 486,728 117 0 0 61 73 4 LAST 4Q 0 182 0 182 0 182 0 182 182,000 23 0 462 0 462 0 462 0 417 439,500 15 0 0 222 135 4 LAST 4Q 0 390 0 390 0 100 0 100 148,720 48 0 1,125 0 1,125 0 380 0 380 505,160 48 0 0 127 37 4 LAST 4Q 0 154 0 154 0 0 0 0 25,872 117 0 2,852 1 2,467 0 1,926 0 82 1,113,368 110 0 0 302 16 REJ SS REJ SS REJ SS REJ SS 0 308 0 77 0 77 0 0 274 0 274 0 274 0 818 0 818 0 818 4 LAST 4Q 0 77 0 77 0 4 LAST 4Q 0 135 0 135 4 LAST 4Q 0 199 0 4 LAST 4Q 0 157 BICMOS2 4 LAST 4Q 0 0 BICMOS 4 LAST 4Q Z92 UHF SMD SCMOS2 SCMOS3 BCDMOS UHF5 75K 63K 58.8K 58K 57.5K 57K 56.9K 56.8K 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 201 328,936 57 0 613 0 0 76,336 603,016 117 117 0 0 102 44 0 82 109,552 23 0 485 595,208 39 0 0 368 39 154 0 154 283,360 48 0 67 0 355 0 355 481,480 37 0 1,939 0 1,939 3,035,056 35 0 0 52 9 300 0 300 0 300 328,752 187 0 15 0 0 201 27 0 0 3 9 REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 508 0 508 21 431 0 55K 4 LAST 4Q 0 0 154 1,463 0 0 154 1,463 0 2 152 1,076 0 0 46K 4 LAST 4Q 0 246 0 246 0 82 0 1,141 0 1,141 0 485 0 924 0 924 0 0 1,740 0 855 0 18,831 0 4,316 0 899 0 56K 44K 35K 34K 19K ATMEL 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 4 LAST 4Q 0 300 0 100 0 100 0 100 109,600 42 0 1,199 0 399 0 399 0 399 437,400 78 4 LAST 4Q 0 7,234 0 4,073 0 2,580 0 2,197 2,868,052 95 0 42,328 2 21,495 26 15,010 0 8,302 13,898,464 92 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) BU ASIC QTR 168 Hours 4 LAST 4Q REJ 0 0 500 Hours SS 154 531 REJ 0 0 1K Hours SS 154 531 REJ 0 0 SS 154 531 Device-Hours AF FITS 154,000 531,000 117 117 51 15 4 0 646 0 646 0 646 646,000 0 1,348 0 1,348 0 1,348 1,348,000 117 117 12 LAST 4Q MCU 4 LAST 4Q 0 0 377 1,870 0 0 377 1,793 0 0 300 1,360 338,500 1,589,436 117 117 23 5 ATMEL 4 LAST 4Q 0 0 1,177 3,749 0 0 1,177 3,672 0 0 1,100 3,239 1,138,500 3,468,436 117 117 7 2 MEMORY RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours Device-Hours AF FITS REJ SS REJ SS REJ SS 4 LAST 4Q 0 77 0 77 0 0 38,500 117 203 63 K 4 LAST 4Q 0 0 154 542 0 0 154 542 0 0 154 542 154,000 542,000 117 117 51 14 56K 4 LAST 4Q 0 0 77 223 0 0 77 223 0 0 77 223 77,000 223,000 117 117 102 35 35K 4 LAST 4Q 0 0 644 2,062 0 0 644 1,985 0 0 644 1,781 644,000 1,895,936 117 117 12 4 34K 4 LAST 4Q 0 234 0 234 0 234 234,000 117 33 19K 4 LAST 4Q 0 0 77 311 0 0 77 311 0 0 77 311 77,000 311,000 117 117 102 25 58K 4 LAST 4Q 0 0 225 300 0 0 225 300 0 0 148 148 186,500 224,000 117 117 42 35 ATMEL 4 LAST 4Q 0 0 1,177 3,749 0 0 1,177 3,672 0 0 1,100 3,239 1,138,500 3,468,436 117 117 7 2 Z92 RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 100 Cycles 200 Cycles 500 Cycles 1K Cycles REJ SS REJ SS REJ SS REJ SS % Defective CBGA 4 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 70 70 0.00% 0.00% BGA 4 LAST 4Q 0 77 0 77 0 77 0 77 0.00% LGA 4 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77 77 0.00% 0.00% MLF / QFN 4 LAST 4Q 0 0 159 939 0 0 159 939 0 0 159 939 0 0 77 507 0.00% 0.00% QFP 4 LAST 4Q 0 0 77 847 0 0 77 847 0 0 77 847 0 0 77 663 0.00% 0.00% PDIP 4 LAST 4Q 0 384 0 384 0 384 0 384 0.00% PLCC 4 LAST 4Q 0 0 77 307 0 0 77 307 0 0 77 307 0 0 77 307 0.00% 0.00% SOIC 4 LAST 4Q 0 0 395 857 0 0 395 857 0 0 395 857 0 0 149 606 0.00% 0.00% TSOP / VSOP 4 LAST 4Q 0 0 76 76 0 0 76 76 0 0 76 76 0 0 76 76 0.00% 0.00% TSSOP 4 LAST 4Q 0 0 246 246 0 0 246 246 0 0 246 246 0 0 0.00% 0.00% 4 LAST 4Q 0 0 1,184 3,887 0 0 1,184 3,887 0 0 1,184 3,887 0 0 603 2,767 0.00% 0.00% ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias HAST 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS PACKAGE QTR CBGA 4 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77,000 77,000 0.00% 0.00% 4 LAST 4Q 0 0 159 939 0 0 159 939 0 0 159 631 0 0 159,000 785,000 0.00% 0.00% 4 LAST 4Q 0 0 77 770 0 0 77 770 0 0 77 616 0 77 77,000 847,000 0.00% 0.00% SOIC 4 LAST 4Q 0 0 323 400 0 0 323 400 0 0 323 323 0 0 77 462 477,000 1,285,500 0.00% 0.00% TSSOP 4 LAST 4Q 0 0 246 246 0 0 246 246 0 0 246 246 0 0 246,000 246,000 0.00% 0.00% 4 LAST 4Q 0 0 882 2,432 0 0 882 2,432 0 0 882 1,893 0 0 308 1,386 1,498,000 4,934,500 0.00% 0.00% MLF / QFN QFP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours SS 4 LAST 4Q 0 0 77 77 0 0 0 0 0.0% 0.0% 4 LAST 4Q 0 77 0 77 0 77 0.0% LGA 4 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0.0% 0.0% MLF / QFN 4 LAST 4Q 0 0 77 539 0 0.0% 0.0% 4 LAST 4Q 0 0 60 744 0 77 0 77 0.0% 0.0% 4 LAST 4Q 0 385 0 385 0 385 0.0% PLCC 4 LAST 4Q 0 0 77 308 0 0 77 308 0 0 77 308 0.0% 0.0% SOIC 4 LAST 4Q 0 0 400 862 0 0 77 462 0 0 77 462 0.0% 0.0% TSOP / VSOP 4 0 77 0 77 0 77 0.0% LAST 4Q 0 77 0 77 0 77 0.0% 4 LAST 4Q 0 0 246 246 0 0 0 0 0.0% 0.0% 4 LAST 4Q 0 0 1,091 3,392 0 0 308 1,463 0 0 308 1,463 0.00% 0.00% BGA QFP PDIP TSSOP ATMEL 0 SS 0 REJ % Defective REJ CBGA REJ 240 Hours 0 SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µm] TYPICAL PRODUCTS / APPLICATIONS 5 15.3 EEPROM 1.8 - 2.3 sEEPROM 5 19.3 EEPROM 1.1 sEEPROM 5 19.5 Embedded Memory Configurator 1.0 Configurator 5 19.6 Embedded Memory 0.7 EEPROM, MC (Intel core), MC (AVR core) PLD 5 19.7 EPLD 0.5 5 19.76 EPLD 0.5 PLD 5 19.8 CMOS 0.7 ASIC 5 19.8 Embedded Memory Configurator 0.7 5 19.9 Embedded Memory 0.7 sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC 5 25 BiCMOS 1.0 ASIC 5 26 Logic 0.7 ASIC 5 33.5 FLASH 0.5 EPROM 0.5 5 34 NTO 35 5 35.5 Embedded Memory Configurator 0.35 EEPROM, FLASH, MICRO, EPLD 5 37 EEPROM 0.35 FLASH, PEROM, DATA FLASH, sEEPROM 5 39 EEPROM 0.25 DATA FLASH 5 39.1 EEPROM 0.25 FLASH, DATA FLASH BiCMOS 0.6 5 42 GFO / CSO 43 HNO 46 5 55 Logic 5 55.8 5 56 5 EPROM ASIC ASIC, TX RF RFA 0.5 ASIC CMOS 0.5 ASIC Logic 0.35 ASIC 56.8 Embedded Memory 0.35 ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC / RFA 7 58.0 CMOS 0.18 ASIC / RFA SJO 61 CMOS 0.18 FLASH SJO 63 HNO 75 RFA HNO 6UH6+BICMOS RFA HNO BCDMOS HNO BICMOS HNO BICMOS2 GFO HCCD1 NMOS 2.5 6BD1 0.8 ASIC / RFA ASIC / RFA RFA CCD GFO HCCD3 NMOS 1.5 CCD HNO I²L 6IL4 2 ASIC HNO SCMOS3 HNO SIGE2 6SG1 0.8 RFA HNO UHF 6UH6 0.5 ASIC / RFA HNO UNI3 NTO Z86 CMOS Digital 0.8 SRAM,MICRO, VAN DLC RFA RFA NTO Z91 CMOS Digital 0.6 SRAM, ASIC, MICRO NTO Z92 CMOS Digital 0.5 ASIC, MICRO,VAN DLC CMOS + EPROM 0.5 OTP MICRO NTO Z94 HNO Z95 RFA HNO Z96 RFA RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Failure Rate Calculations Failure Rate: χ2 λ = where, λ χ2 α n AF DH = = = = = = (1 − α 100 , 2⋅n + 2 ) ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = eZ ⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12