Q3 2010 Reliability Monitor Report

Reliability
Monitor
Report
High Temperature Operating Life
Data Retention Bake
Temperature Cycle
Temperature & Humidity Bias/ HAST
Steam Pressure Pot
Third QUARTER 2010
ATMEL PROPRIETARY
Table of Contents
1. Executive Summary
1
2. HTOL (sorted by product BU)
2
3. HTOL (sorted by technology)
3-4
4. Data Retention Bake (sorted by product BU)
5
5. Data Retention Bake (sorted by technology)
6
6. Temperature Cycle
7
7. Temperature Humidity Bias & HAST
8
8. Steam Pressure Pot
9
9. Technology List
10
10. Failure Rate Calculations
11
11. Definitions
12
RELIABILITY MONITOR -- ATMEL PROPRIETARY
Reliability Monitor Report
Date:
Jan 26, 2011
Executive Summary
The intent of the Reliability Monitor Program is to measure the reliability of previously
qualified devices on a quarterly basis. This is achieved by selecting representative
devices within a process, package or business unit and performing a series of reliability
tests to ensure that the reliability has maintained over time. Listed below are the overall
results for the last quarter.
1.
High Temperature Operating Life (125° - 150°C; 0 failures)
Failure Rate: 5 FITS (1,801K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Also, Thermal and Voltage Acceleration are used to compute the overall
acceleration factor. Weighted acceleration factors (WAF) for a group of products are
calculated by taking the weighted average of each device’s acceleration factor multiplied
by its corresponding device hours. All failures were inconclusive.
2.
Data Retention Bake (150°C; 0 failures)
Failure Rate: 6 FITS (1,217K device-hours)
Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6
eV). Since there is no bias applied during testing and the stress temperature is fixed for
all devices at 150°C, the acceleration factor is 117 for all groupings.
3.
Temperature Cycle (-65°C to 150°C, 500 cycles) *
Failure Rate: 0.00% (0 failures out of 1,282 units)
4.
Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) *
Failure Rate: 0.00% (0 failures out of 1,321K device-hours)
Note: A 20:1 Acceleration Factor is used to combine HAST results with THB).
5.
Steam Pressure Pot (121°C/100%RH) *
Failure Rate: 0.00% (0 failures out of 1,309 units)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
* indicates that preconditioning is performed prior to the stress test.
1
High Temperature Operating Life
(sorted by FAMILY)
BU
QTR
48 Hours
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
REJ
SS
Device-Hours*
WAF
EFR PPM
FITS
APG
2
LAST 4Q
0
0
162
648
0
0
162
648
0
0
162
648
0
0
162
648
162,000
648,000
35
35
0
0
160
40
ASIC
2
LAST 4Q
0
0
100
3,035
0
0
100
1,150
0
0
100
1,150
0
0
100
1,045
100,000
1,187,980
23
20
0
0
403
38
MEMORY
2
LAST 4Q
0
0
200
2,500
0
0
200
1,500
0
0
200
1,500
0
0
200
1,500
200,000
1,548,000
48
51
0
0
95
12
MCU
2
LAST 4Q
0
0
2,843
7,997
0
0
497
1,447
0
0
497
1,447
0
0
343
1,139
532,608
1,607,400
17
16
0
0
103
36
RFA
2
LAST 4Q
0
0
692
3,233
0
0
692
3,233
0
0
692
3,233
0
0
615
3,002
806,500
3,501,500
178
127
0
0
6
2
ATMEL
2
LAST 4Q
0
0
3,997
17,413
0
0
1,651
7,978
0
0
1,651
7,978
0
0
1,420
7,334
1,801,108
8,492,880
95
70
0
0
5
2
RELIABILITY MONITOR -- ATMEL PROPRIETARY
2
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
0
22,500
3
0
14,833
0
0
77
231
77,000
269,500
117
117
0
0
102
29
578
0
578
655,000
91
0
15
0
0
77
231
0
0
77
231
77,000
231,000
117
117
0
0
102
34
77
0
77
0
77
77,000
117
0
102
0
77
0
77
0
77
77,000
206
0
58
77
154
0
0
77
154
0
0
77
154
0
0
0
0
38,500
77,000
117
117
0
203
0
102
0
230
0
230
0
230
0
230
230,000
146
0
27
2
LAST 4Q
0
0
461
1,154
0
0
461
1,154
0
0
461
1,154
0
0
461
1,154
614,000
1,384,000
197
153
0
0
8
4
2
LAST 4Q
0
900
0
300
0
300
0
300
328,800
60
0
47
58K
2
LAST 4Q
0
0
347
2,286
0
0
112
420
0
0
112
420
0
0
112
343
123,280
471,068
3
3
0
0
2,827
737
57K
2
LAST 4Q
0
241
0
241
0
241
0
241
241,000
19
0
196
56.9K
2
LAST 4Q
0
0
80
320
0
0
80
320
0
0
80
320
0
0
80
320
80,000
320,000
48
48
0
0
237
59
56K
2
LAST 4Q
0
0
100
2,050
0
0
100
552
0
0
100
552
0
0
100
552
100,000
623,904
23
16
0
0
403
94
46K
2
LAST 4Q
0
0
82
328
0
0
82
328
0
0
82
328
0
0
82
328
82,000
328,000
23
23
0
0
492
123
REJ
SS
REJ
SS
REJ
SS
REJ
SS
2
LAST 4Q
0
45
0
45
0
45
0
UNI3
2
LAST 4Q
0
0
77
308
0
0
77
308
0
0
77
308
UHF
2
LAST 4Q
0
578
0
578
0
SCMOS3
2
LAST 4Q
0
0
77
231
0
0
77
231
SIGE1
2
LAST 4Q
0
77
0
2
LAST 4Q
0
77
LAST 4Q
0
0
2
LAST 4Q
75K
63K
Z92
SIGE2
I2L
BICMOS2
2
RELIABILITY MONITOR -- ATMEL PROPRIETARY
3
High Temperature Operating Life
(sorted by TECHNOLOGY)
TECH
QTR
48 Hours
168 Hours
500 Hours
1K Hours
Device-Hours*
WAF
EFR PPM
FITS
308
308,000
117
0
25
0
0
431
1,964
609,328
2,411,332
30
34
0
0
50
11
100
0
100
109,600
11
0
736
0
300
0
300
328,176
56
0
50
0
0
1,651
7,978
0
0
1,420
7,334
1,801,108
8,492,880
95
70
0
0
5
2
REJ
SS
REJ
SS
REJ
SS
REJ
SS
2
LAST 4Q
0
308
0
308
0
308
0
35K
2
LAST 4Q
0
0
2,696
6,939
0
0
585
2,255
0
0
585
2,255
34K
2
LAST 4Q
0
300
0
100
0
2
LAST 4Q
0
887
0
300
2
LAST 4Q
0
0
3,997
17,413
0
0
1,651
7,978
38.6 K
19K
ATMEL
* The Device-Hours computation includes additional read-outs not detailed in the report.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
4
Data Retention Bake
(sorted by FAMILY)
BU
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours
AF
FITS
APG
2
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
117
117
ASIC
2
LAST 4Q
0
0
0
308
0
0
0
308
0
0
0
308
0
308,000
117
117
2
0
154
0
154
0
154
154,000
51
LAST 4Q
0
616
0
616
0
616
616,000
117
117
MCU
2
LAST 4Q
0
0
1,128
2,075
0
0
1,051
1,998
0
0
1,051
1,844
1,063,936
1,933,936
117
117
7
4
RFA
2
LAST 4Q
0
0
0
0
0
0
0
0
0
0
0
0
0
0
117
117
ATMEL
2
LAST 4Q
0
0
1,282
2,999
0
0
1,205
2,922
0
0
1,205
2,768
1,217,936
2,857,936
117
117
MEMORY
RELIABILITY MONITOR -- ATMEL PROPRIETARY
25
13
6
3
5
Data Retention Bake
(sorted by TECHNOLOGY)
TECH
QTR
168 Hours
500 Hours
1K Hours
REJ
SS
REJ
SS
REJ
SS
Device-Hours AF
FITS
63 K
2
LAST 4Q
0
0
154
462
0
0
154
462
0
0
154
462
154,000
462,000
117
117
51
17
58K
2
LAST 4Q
0
0
77
462
0
0
77
462
0
0
77
385
77,000
423,500
117
117
102
18
56K
2
LAST 4Q
0
154
0
154
0
154
154,000
117
51
35K
2
LAST 4Q
0
0
1,051
1,613
0
0
974
1,536
0
0
974
1,459
986,936
1,510,436
117
117
8
5
34K
2
LAST 4Q
0
77
0
77
0
77
77,000
117
102
2
LAST 4Q
0
231
0
231
0
231
231,000
117
34
2
LAST 4Q
0
0
1,282
2,999
0
0
1,205
2,922
0
0
1,205
2,768
1,217,936
2,857,936
117
117
6
3
19K
ATMEL
RELIABILITY MONITOR -- ATMEL PROPRIETARY
6
Temperature Cycle
PACKAGE
QTR
100 Cycles
200 Cycles
500 Cycles
1K Cycles
REJ
SS
REJ
SS
REJ
SS
REJ
SS
% Defective
CASON
2
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
0
0
77
77
0.00%
0.00%
CBGA
2
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
2
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
MLF / QFN
2
LAST 4Q
0
0
308
667
0
0
308
667
0
0
308
667
0
0
307
661
0.00%
0.00%
QFP
2
LAST 4Q
0
34
0
34
0
34
0
0
0.00%
2
LAST 4Q
0
154
0
154
0
154
0
154
0.00%
2
LAST 4Q
0
154
0
154
0
154
0
154
0.00%
SOIC
2
LAST 4Q
0
0
385
539
0
0
385
539
0
0
385
539
0
0
380
534
0.00%
0.00%
TQFP
2
LAST 4Q
0
0
231
308
0
0
231
308
0
0
231
385
0
0
154
303
0.00%
0.00%
TSOP / VSOP
2
LAST 4Q
0
77
0
77
0
77
0
77
0.00%
TSSOP
2
LAST 4Q
0
0
281
281
0
0
281
281
0
0
281
281
0
0
204
204
0.00%
0.00%
ATMEL
2
LAST 4Q
0
0
1,282
2,445
0
0
1,282
2,445
0
0
1,282
2,522
0
0
1,122
2,318
0.00%
0.00%
LGA
PDIP
PLCC
RELIABILITY MONITOR -- ATMEL PROPRIETARY
7
Temperature Humidity Bias / HAST
Temperature Humidity Bias
HAST
168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective
REJ SS REJ SS REJ SS REJ SS
PACKAGE
QTR
CBGA
2
LAST 4Q
0
77
0
77
0
77
0
0
77,000
0.00%
MLF / QFN
2
LAST 4Q
0
0
231
437
0
0
231
437
0
0
231
437
0
0
77
231
385,000
899,000
0.00%
0.00%
SOIC
2
LAST 4Q
0
0
385
385
0
0
385
385
0
0
385
385
0
0
0
77
385,000
539,000
0.00%
0.00%
TQFP
2
LAST 4Q
0
0
231
308
0
0
154
231
0
0
154
231
0
0
0
0
166,936
243,936
0.00%
0.00%
TSSOP
2
LAST 4Q
0
0
231
231
0
0
231
231
0
0
231
231
0
0
0
0
231,000
231,000
0.00%
0.00%
ATMEL
2
LAST 4Q
0
0
1,078
1,438
0
0
1,001
1,361
0
0
1,001
1,361
0
0
154
847
1,321,936
3,067,936
0.00%
0.00%
RELIABILITY MONITOR -- ATMEL PROPRIETARY
8
Steam Pressure Pot
PACKAGE
QTR
96 Hours
168 Hours
240 Hours
REJ
SS
REJ
SS
REJ
SS
% Defective
CASON
2
LAST 4Q
0
0
77
77
0
0
77
77
0
0
77
77
0.0%
0.0%
CBGA
2
LAST 4Q
0
77
0
0
0
0
0.0%
2
LAST 4Q
0
77
0
77
0
77
0.0%
MLF / QFN
2
LAST 4Q
0
0
308
667
0
0
77
231
0
0
77
231
0.0%
0.0%
PDIP
2
LAST 4Q
0
154
0
154
0
154
0.0%
2
LAST 4Q
0
154
0
154
0
154
0.0%
SOIC
2
LAST 4Q
0
0
385
539
0
0
0
154
0
0
0
154
0.0%
0.0%
TQFP
2
LAST 4Q
0
0
308
420
0
0
0
0
0
0
0
0
0.0%
0.0%
TSOP / VSOP
2
LAST 4Q
0
77
0
77
0
77
0.0%
TSSOP
2
LAST 4Q
0
0
231
231
0
0
0
0
0
0
0
0
0.0%
0.0%
ATMEL
2
LAST 4Q
0
0
1,309
2,473
0
0
154
924
0
0
154
924
0.00%
0.00%
LGA
PLCC
RELIABILITY MONITOR -- ATMEL PROPRIETARY
9
Technology List
FAB
TECH
TYPE CMOS / BIP
LITHOGRAPHY [µm]
TYPICAL PRODUCTS / APPLICATIONS
5
15.3
EEPROM
1.8 - 2.3
sEEPROM
5
19.3
EEPROM
1.1
sEEPROM
5
19.5
Embedded Memory Configurator
1.0
Configurator
5
19.6
Embedded Memory
0.7
EEPROM, MC (Intel core), MC (AVR core)
PLD
5
19.7
EPLD
0.5
5
19.76
EPLD
0.5
PLD
5
19.8
CMOS
0.7
ASIC
5
19.8
Embedded Memory Configurator
0.7
5
19.9
Embedded Memory
0.7
sEEPROM, PEROM, EEPROM, Configurator
Smartcard, AVR, µC
5
25
BiCMOS
1.0
ASIC
5
26
Logic
0.7
ASIC
5
33.5
FLASH
0.5
EPROM
0.5
5
34
NTO
35
5
35.5
Embedded Memory Configurator
0.35
EEPROM, FLASH, MICRO, EPLD
5
37
EEPROM
0.35
FLASH, PEROM, DATA FLASH, sEEPROM
5
39
EEPROM
0.25
DATA FLASH
5
39.1
EEPROM
0.25
FLASH, DATA FLASH
BiCMOS
0.6
5
42
CSO
43
HNO
46
5
55
Logic
5
55.8
5
56
5
EPROM
ASIC
ASIC, TX RF
RFA
0.5
ASIC
CMOS
0.5
ASIC
Logic
0.35
ASIC
56.8
Embedded Memory
0.35
ASIC
7
57.0
CMOS
0.25
ASIC
7
57.5
CMOS
0.21
ASIC / RFA
7
58.0
CMOS
0.18
ASIC / RFA
SJO
61
CMOS
0.18
FLASH
SJO
63
HNO
75
RFA
HNO
6UH6+BICMOS
RFA
HNO
BCDMOS
HNO
BICMOS
HNO
BICMOS2
HNO
I²L
HNO
SCMOS3
HNO
6BD1
0.8
ASIC / RFA
ASIC / RFA
RFA
6IL4
2
SIGE2
6SG1
0.8
RFA
HNO
UHF
6UH6
0.5
ASIC / RFA
HNO
UNI3
NTO
Z86
CMOS Digital
0.8
SRAM,MICRO, VAN DLC
ASIC
RFA
RFA
NTO
Z91
CMOS Digital
0.6
SRAM, ASIC, MICRO
NTO
Z92
CMOS Digital
0.5
ASIC, MICRO,VAN DLC
CMOS + EPROM
0.5
OTP MICRO
NTO
Z94
HNO
Z95
RFA
HNO
Z96
RFA
RELIABILITY MONITOR -- ATMEL PROPRIETARY
10
Failure Rate Calculations
Failure Rate:
χ2
λ =
where,
λ
χ2
α
n
AF
DH
=
=
=
=
=
=
(1 −
α
100
, 2⋅n + 2 )
⋅ 109
2 ⋅ AF ⋅ DH
Failure Rate (FITS)
Failure Estimate
Confidence Level (60% or 90%)
Number of Failures
Overall Acceleration Factor (TAF x VAF)
Device Hours
Thermal Acceleration:
TAF
where,
TAF
EA
k
T
f
s
P
θJA
=
=
=
=
=
=
=
=
= e

ea 
1
1
⋅
−

k  Tf + ( Pf ⋅θ JAf ) Ts + ( Ps ⋅θ JAs ) 
Thermal Acceleration Factor
Activation Energy (eV)
Boltzman’s Constant (8.617 x 10-5 eV/°K)
Temperature (°K)
Field Conditions
Stress Conditions
Power Dissipation (W)
Thermal Resistance Coefficient - Junction to Ambient (°C/W)
Voltage Acceleration:
VAF
where,
VAF
Vs
Vn
Z
=
=
=
=
= eZ ⋅
[ VS − Vn ]
Voltage Acceleration Factor
Stress Voltage (V)
Nominal Voltage (V)
Voltage Acceleration Constant (typically, 0.5 < Z < 1.0)
RELIABILITY MONITOR -- ATMEL PROPRIETARY
11
Definitions
Data Retention Bake (DRB): This test is used to measure a device’s ability to
retain a charge for extended periods of time without applying voltage bias.
Stressing at high temperatures (150°C for plastic packages) accelerates any
discharge causing the memory state to change.
Failures In Time (FITS): This is the unit measure for expressing failure rates and
is identical to the expression PPM/K hours. For example, three failures out
of a million components tested for one thousand hours equates to 3 FITS.
High Temperature Operating Life (HTOL): The purpose of this test is to
accelerate thermally activated failure mechanisms through the use of high
temperatures (typically between 125°C and 150°C), increased voltage, and
dynamic bias conditions. Readouts at various time points are taken to
determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR
is expressed in defective parts per million (DPPM) and IFR is expressed in
Failures in Time (FITS at 55°C).
Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a
plastic packaged component’s ability to withstand harsh environmental
conditions with extreme temperature and humidity levels. The parts are
stressed to high temperature (130°C) and relative humidity (85%RH)
conditions in a biased state to achieve maximum acceleration.
Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged
component’s ability to withstand severe conditions of pressure (15 psig),
temperature (121°C), and humidity (100%RH).
Temperature Cycle (TC): This test is used to measure a product’s sensitivity to
thermal stresses due to differences in expansion and contraction
characteristics of the die and mold compound by repeated alternating
temperature dwells between high and low temperature extremes.
Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is
identical to HAST. The only difference is that HAST accelerates THB by a
factor of 20:1 due to the increase in temperature during test.
RELIABILITY MONITOR -- ATMEL PROPRIETARY
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