Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot FIRST QUARTER 2001 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product family) 2 3. HTOL (sorted by technology) 3 4. Data Retention Bake (sorted by product family) 4 5. Data Retention Bake (sorted by technology) 5 6. Temperature Cycle 6-7 7. Temperature Humidity Bias & HAST 8-9 8. Steam Pressure Pot 10-11 9. Failure Description Detail 12 10. Failure Rate Calculations 13 11. Definitions 14 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report From: Date: Pete Cannon March 16, 2001 Data reporting: Lovia Gomulia Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process or package family and performing a series of reliability tests to ensure that the reliability has not deteriorated over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C) 3 Failure Rate: 17 FITS (2.2M device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking a weighted average of each device’s AF multiplied by the corresponding sample size. See page 10 for a more detailed description of the FIT rate calculation methodology. 2. Data Retention Bake (150°C) 3 Failure Rate: 3 FITS (1.2M device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 259 for all groupings. 3. Temperature Cycle (-65°C to 150°C) 3 Failure Rate: 0.0% (0 failures out of 1,320) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) 3 Failure Rate: 0.0% (1.8M device-hours) 3 Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) 3 Failure Rate: 0.0% (0 failures out of 1,480) RELIABILITY MONITOR -- ATMEL PROPRIETARY 1 High Temperature Operating Life (sorted by FAMILY) FAMILY QTR 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS Device-Hours WAF EFR PPM FITS ASIC 4 LAST 4Q 0 0 967 5,946 1 1 567 3,834 0 0 521 3,688 0 2 176 2,149 375,428 3,044,404 71 98 0 0 76 14 D-FLASH 4 LAST 4Q 0 300 0 90 0 90 0 90 100,080 71 0 129 EEPROM 4 LAST 4Q 0 0 8,376 47,982 0 0 800 3,599 0 0 800 3,098 0 0 800 3,098 1,163,648 5,312,552 50 50 0 0 16 3 EPLD 4 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 100 400 0 0 100 400 109,600 438,400 28 137 0 0 299 15 EPROM 4 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 100 400 0 0 100 400 109,600 438,400 60 125 0 0 139 17 FLASH 4 LAST 4Q 0 0 900 2,100 0 0 300 690 0 0 300 690 0 0 300 690 328,800 757,680 67 105 0 0 42 12 MICRO 4 LAST 4Q 0 0 223 1,123 0 0 100 418 0 0 100 408 0 0 100 391 105,904 435,020 76 144 0 0 114 15 ATMEL 4 LAST 4Q 0 0 11,066 59,851 1 1 1,967 9,431 0 0 1,921 8,774 0 2 1,576 7,218 2,192,980 10,526,536 54 62 0 0 17 6 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 56K 4 LAST 4Q 0 0 300 1,425 0 0 100 621 0 0 100 621 0 1 100 621 109,600 659,592 55K 4 LAST 4Q 0 0 77 816 1 1 77 815 0 0 76 814 0 1 76 814 42K 4 LAST 4Q 0 0 100 1,300 0 0 100 793 0 0 100 793 0 37K 4 LAST 4Q 0 0 600 1,800 0 0 200 580 0 0 200 580 34K 4 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 26K 4 LAST 4Q 0 0 300 1,200 0 0 100 400 4 LAST 4Q 0 0 100 400 0 0 4 LAST 4Q 0 400 19K 4 LAST 4Q 0 0 15K 4 LAST 4Q ATMEL 4 LAST 4Q 25K 24K 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS Device-Hours WAF EFR PPM FITS 41 53 0 0 204 58 76,168 814,216 109 111 0 0 244 34 0 50,000 420,836 204 204 0 0 90 11 0 0 200 580 219,200 638,560 66 82 0 0 63 17 100 400 0 0 100 400 109,600 438,400 60 125 0 0 139 17 0 0 100 400 0 100 59,600 288,400 41 41 0 0 375 77 100 400 0 0 100 400 0 100 50,000 250,000 41 41 0 0 447 89 0 400 0 300 0 200 266,800 103 0 33 5,493 22,738 0 0 990 4,322 0 0 945 3,766 0 0 900 3,703 1,146,204 4,711,876 61 71 0 0 13 3 0 0 3,796 28,572 0 0 200 700 0 0 200 700 0 0 200 700 372,608 2,037,856 38 44 0 0 65 10 0 0 11,066 59,851 1 1 1,967 9,431 0 0 1,921 8,774 0 2 1,576 7,218 2,192,980 10,526,536 54 62 0 0 17 6 RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 Data Retention Bake (sorted by FAMILY) FAMILY QTR ASIC 4 LAST 4Q 0 231 0 231 0 4 LAST 4Q 0 100 0 100 EEPROM 4 LAST 4Q 0 0 850 3,000 0 0 EPLD 4 LAST 4Q 0 0 50 300 EPROM 4 LAST 4Q 0 0 FLASH 4 LAST 4Q MICRO ATMEL D-FLASH Device-Hours AF FITS 100 165,500 259 21 0 100 100,000 259 35 850 3,000 0 0 850 3,000 850,000 3,000,000 259 259 4 1 0 0 50 300 0 0 50 300 50,000 300,000 259 259 71 12 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 0 0 200 500 0 0 198 498 0 0 198 498 198,336 498,336 259 259 18 7 4 LAST 4Q 0 0 100 250 0 0 100 250 0 0 100 250 100,000 250,000 259 259 35 14 4 LAST 4Q 0 0 1,250 4,581 0 0 1,248 4,579 0 0 1,248 4,448 1,248,336 4,513,836 259 259 3 1 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR Device-Hours AF FITS 42K 4 LAST 4Q 0 231 0 231 0 100 165,500 259 21 37K 4 LAST 4Q 0 0 150 500 0 0 149 499 0 0 149 499 149,168 499,168 259 259 24 7 34K 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 19K 4 LAST 4Q 0 0 850 3,050 0 0 849 3,049 0 0 849 3,049 849,168 3,049,168 259 259 4 1 15K 4 LAST 4Q 0 0 200 600 0 0 200 600 0 0 200 600 200,000 600,000 259 259 18 6 ATMEL 4 LAST 4Q 0 0 1,250 4,581 0 0 1,248 4,579 0 0 1,248 4,448 1,248,336 4,513,836 259 259 3 1 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 5 Temperature Cycle PACKAGE QTR BCC 4 LAST 4Q 0 0 231 693 0 0 231 693 0.0% 0.0% BQFP 4 LAST 4Q 0 100 0 100 0.0% CBGA 4 LAST 4Q 0 0 50 100 0 0 50 100 0.0% 0.0% DBGA 4 LAST 4Q 0 0 77 77 0 0 77 77 0.0% 0.0% DIP 4 LAST 4Q 0 0 77 154 0 0 77 154 0.0% 0.0% LAP 4 LAST 4Q 0 150 0 150 0.0% PDIP 4 LAST 4Q 0 0 150 427 0 0 150 427 0.0% 0.0% PLCC 4 LAST 4Q 0 0 177 730 0 0 177 730 0.0% 0.0% PQFP 4 LAST 4Q 0 50 0 50 0.0% 4 LAST 4Q 0 77 0 77 0.0% SOIC 4 LAST 4Q 0 0 408 1,016 0 0 408 1,016 0.0% 0.0% TQFP 4 LAST 4Q 0 0 50 350 0 0 50 350 0.0% 0.0% TSOP 4 LAST 4Q 0 0 100 350 0 0 100 350 0.0% 0.0% TSSOP 4 LAST 4Q 0 127 0 127 0.0% SBDIP 200 Cycles REJ SS 1K Cycles REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR VQFP 4 LAST 4Q 0 50 0 50 0.0% 4 LAST 4Q 0 50 0 50 0.0% 4 LAST 4Q 0 0 1,320 4,501 0 0 1,320 4,501 0.0% 0.0% VSOP ATMEL 200 Cycles REJ SS 1K Cycles REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Humidity Bias / HAST Temperature Humidity Bias PACKAGE QTR BCC 4 LAST 4Q 0 0 231 924 0 0 231 924 0 0 231 924 0 4 LAST 4Q 0 100 0 100 0 100 4 LAST 4Q 0 0 0 0 0 0 4 LAST 4Q 0 0 100 100 0 0 100 100 0 0 100 100 4 LAST 4Q 0 150 0 150 0 4 LAST 4Q 0 100 0 100 PLCC 4 LAST 4Q 0 0 100 350 0 0 PQFP 4 LAST 4Q 0 50 4 LAST 4Q 0 SOIC 4 LAST 4Q TQFP BQFP CBGA DBGA LAP PDIP SBDIP TSOP TSSOP UBGA 168 Hours REJ SS 500 Hours REJ SS HAST 1K Hours REJ SS 100 Hours REJ SS Device-Hours % Defective 0 231,000 924,000 0.0% 0.0% 0 0 100,000 0.0% 0 50 100,000 0.0% 0 0 100,000 100,000 0.0% 0.0% 150 0 0 150,000 0.0% 0 100 0 0 150 350 300,000 800,000 0.0% 0.0% 100 350 0 0 100 350 0 0 100 444 300,000 1,238,000 0.0% 0.0% 0 50 0 50 0 0 50,000 0.0% 200 0 200 0 200 0 0 200,000 0.0% 0 0 550 1,200 0 0 550 1,200 0 0 550 1,200 0 0 50 100 650,000 1,400,000 0.0% 0.0% 4 LAST 4Q 0 0 50 300 0 0 50 300 0 0 50 300 0 50 50,000 400,000 0.0% 0.0% 4 LAST 4Q 0 0 0 0 0 0 0 0 98 348 196,000 696,000 0.0% 0.0% 4 LAST 4Q 0 150 0 150 0 150 0 0 150,000 0.0% 4 LAST 4Q 0 0 0 0 0 0 0 50 100,000 0.0% RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Temperature Humidity Bias / HAST Temperature Humidity Bias PACKAGE QTR VQFP 4 LAST 4Q 0 0 0 0 0 0 0 4 LAST 4Q 0 0 0 0 0 0 4 LAST 4Q 0 0 1,031 3,624 0 0 1,031 3,624 0 0 1,031 3,624 VSOP ATMEL 168 Hours REJ SS 500 Hours REJ SS HAST 1K Hours REJ SS 100 Hours REJ SS Device-Hours % Defective 50 100,000 0.0% 0 50 100,000 0.0% 0 0 398 1,492 1,827,000 6,608,000 0.0% 0.0% RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Steam Pressure Pot PACKAGE QTR BCC 4 LAST 4Q 0 0 231 693 0.0% 0.0% BQFP 4 LAST 4Q 0 100 0.0% CBGA 4 LAST 4Q 0 0 50 99 0.0% 0.0% DBGA 4 LAST 4Q 0 0 100 100 0.0% 0.0% DIP 4 LAST 4Q 0 0 100 200 0.0% 0.0% LAP 4 LAST 4Q 0 150 0.0% PDIP 4 LAST 4Q 0 0 149 449 0.0% 0.0% PLCC 4 LAST 4Q 0 0 200 797 0.0% 0.0% PQFP 4 LAST 4Q 0 50 0.0% 4 LAST 4Q 0 100 0.0% SOIC 4 LAST 4Q 0 0 500 1,200 0.0% 0.0% TQFP 4 LAST 4Q 0 0 50 350 0.0% 0.0% TSOP 4 LAST 4Q 0 0 100 350 0.0% 0.0% TSSOP 4 LAST 4Q 0 150 0.0% SBDIP 168 Hours REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Steam Pressure Pot PACKAGE QTR VQFP 4 LAST 4Q 0 50 0.0% 4 LAST 4Q 0 50 0.0% 4 LAST 4Q 0 0 1,480 4,888 0.0% 0.0% VSOP ATMEL 168 Hours REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Failure Description Detail Q1 - 2000 a. High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 55K, DIL 48: Read1 and read boot failures. Q2 - 2000 a. High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 56K, FBGA 280: Root cause investigation currently in progress. Q4 - 2000 a. High Temperature Operating Life, 1 failure, 168-hour read point, ASIC, 55K, DIL 24: Root cause investigation currently in progress. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12 Failure Rate Calculations Failure Rate: χ2 λ where, λ χ2 α n AF DH = = = = = = = α (1 − , 2⋅n + 2 ) 100 ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θJAf ) Ts + ( Ps ⋅θJAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = e Z⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 13 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage (commonly 30% above nominal), and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 14