Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot FIRST QUARTER 2003 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product family) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product family) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7. Temperature Humidity Bias & HAST 7-8 9 8. Steam Pressure Pot 10-11 9. Failure Description Detail 12-13 10. Technology List 14 11. Failure Rate Calculations 15 12. Definitions 16 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: March 31, 2003 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process or package family and performing a series of reliability tests to ensure that the reliability has not deteriorated over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C) 3 Failure Rate: 89 FITS (3.1M device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking a weighted average of each device’s AF multiplied by the corresponding sample size. See page 10 for a more detailed description of the FIT rate calculation methodology. 2. Data Retention Bake (150°C) 3 Failure Rate: 2 FITS (1.5M device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.6 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 259 for all groupings. 3. Temperature Cycle (-65°C to 150°C) 3 Failure Rate: 0.0% (0 failures out of 1,984) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) 3 Failure Rate: 0.0% (2.0M device-hours) 3 Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) 3 Failure Rate: 0.04% (1 failure out of 2,377) RELIABILITY MONITOR -- ATMEL PROPRIETARY 1 High Temperature Operating Life (sorted by FAMILY) FAMILY QTR ASIC 4 LAST 4Q 0 0 1,200 5,415 2 2 1,000 4,343 1 2 200 3,064 1 3 200 2,233 344,000 2,914,828 D-FLASH 4 LAST 4Q 0 600 0 200 0 200 0 198 4 LAST 4Q 0 11 0 11 0 11 0 EEPROM 4 LAST 4Q 0 0 22,282 31,386 0 0 700 2,500 0 0 700 2,500 EPLD 4 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 EPROM 4 LAST 4Q 0 0 300 1,200 0 0 100 400 FLASH 4 LAST 4Q 0 0 600 2,650 0 0 MICRO 4 LAST 4Q 1 3 5,600 43,556 S-CARD 4 LAST 4Q 0 4 LAST 4Q VAN DLC ATMEL DSP SRAM 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS Device-Hours WAF EFR PPM FITS 45 68 0 0 338 42 218,200 141 0 30 11 11,000 149 0 559 0 0 500 2,000 1,635,936 3,636,528 25 42 0 0 22 6 99 399 0 0 99 399 108,768 437,568 24 38 0 0 351 55 0 0 100 400 0 0 100 400 109,600 438,400 146 251 0 0 57 8 200 1,099 0 0 200 897 0 0 200 897 219,200 1,005,384 139 153 0 0 30 6 0 0 267 2,886 0 0 267 2,416 0 0 97 1,839 437,984 4,158,620 17 116 179 69 272 9 360 0 360 0 224 0 180 224,848 115 0 35 0 0 200 1,513 0 0 50 590 0 0 50 470 0 419 32,200 508,964 3 102 0 0 9,485 18 4 LAST 4Q 1 1 594 1,523 0 0 150 630 0 0 150 475 0 0 145 470 168,812 541,404 3 32 1,684 657 3,993 116 4 LAST 4Q 2 4 31,076 89,414 2 2 2,567 13,419 1 2 1,766 11,056 1 3 1,341 9,046 3,056,500 14,095,744 27 87 64 45 89 9 RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR Z94 4 LAST 4Q 0 449 0 245 0 245 0 145 204,792 Z92 4 LAST 4Q 2 3 5,190 39,420 0 0 100 1,119 0 0 100 909 0 0 100 905 Z91 4 LAST 4Q 0 0 200 1,224 0 0 50 501 0 0 50 381 0 Z86 4 LAST 4Q 0 0 347 1,067 0 0 50 520 0 0 50 365 Z83 4 LAST 4Q 0 300 0 100 0 4 LAST 4Q 0 0 600 1,896 2 2 600 1,894 4 LAST 4Q 0 582 0 56K 4 LAST 4Q 0 1 870 4,789 55K 4 LAST 4Q 0 0 4 LAST 4Q 37K 35K 58K 57K 39K 34K 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS Device-Hours WAF EFR PPM FITS 395 0 11 344,320 2,780,728 7 115 385 76 1288 13 330 32,200 410,364 3 127 0 0 9485 18 0 0 45 360 61,756 414,796 2 57 0 0 7419 39 100 0 100 109,600 3 0 2787 0 1,090 0 693 100,800 1,026,668 51 83 0 0 604 36 582 0 582 1 579 580,500 99 0 35 0 0 470 2,197 1 2 270 1,860 1 2 200 1,444 287,800 1,833,032 35 33 0 209 308 104 100 1,065 0 0 100 1,065 0 0 100 531 0 200 50,000 455,212 35 114 0 0 524 18 0 600 0 200 0 200 0 198 218,200 141 0 30 4 LAST 4Q 0 0 300 1,200 0 0 100 599 0 0 100 400 0 0 100 400 109,600 462,280 139 132 0 0 60 15 4 LAST 4Q 0 0 2,456 3,756 0 0 200 500 0 0 200 500 0 0 208,288 406,288 26 48 0 0 169 47 4 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 100 400 0 0 100 400 109,600 438,400 146 251 0 0 57 8 RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 33K 4 LAST 4Q 0 550 0 200 0 197 0 196 213,804 4 LAST 4Q 0 300 0 100 0 100 0 0 4 LAST 4Q 0 100 0 100 0 100 0 19K 4 LAST 4Q 0 0 15,989 24,500 0 0 597 2,597 0 0 596 2,596 15K 4 LAST 4Q 0 0 4,724 6,416 0 0 200 500 0 0 ATMEL 4 LAST 4Q 2 4 31,076 89,414 2 2 2,567 13,419 1 2 26K 25K 48 Hours REJ SS 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS Device-Hours WAF EFR PPM FITS 172 0 25 59,600 41 0 375 0 50,000 41 0 447 0 0 596 2,596 1,334,984 3,647,512 29 56 0 0 24 4 200 500 0 0 200 500 417,152 783,968 24 30 0 0 92 39 1,766 11,056 1 3 1,341 9,046 3,056,500 14,095,744 27 87 64 45 89 9 RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) FAMILY QTR 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS Device-Hours AF FITS D-FLASH 4 LAST 4Q 0 0 50 249 0 0 50 249 0 0 50 249 50,000 249,000 259 259 71 14 EEPROM 4 LAST 4Q 0 0 900 3,300 0 0 900 3,300 0 0 900 3,300 900,000 3,300,000 259 259 4 1 EPLD 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 199 50,000 199,500 259 259 71 18 EPROM 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 FLASH 4 LAST 4Q 0 0 200 550 0 0 200 549 0 0 200 549 200,000 549,168 259 259 18 6 MICRO 4 LAST 4Q 0 0 150 587 0 0 150 587 0 0 150 498 150,000 542,500 259 259 24 7 RF 4 LAST 4Q 0 0 100 100 0 0 100 100 0 0 100 100 100,000 100,000 259 259 35 35 ATMEL 4 LAST 4Q 0 0 1,500 5,186 0 0 1,500 5,185 0 0 1,500 5,095 1,500,000 5,140,168 259 259 2 1 RELIABILITY MONITOR -- ATMEL PROPRIETARY 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR Device-Hours AF FITS 56K 4 LAST 4Q 0 0 150 337 0 0 150 337 0 0 150 250 150,000 293,500 259 259 24 12 55K 4 LAST 4Q 0 0 50 50 0 0 50 50 0 0 50 50 50,000 50,000 259 259 71 71 39K 4 LAST 4Q 0 0 50 249 0 0 50 249 0 0 50 249 50,000 249,000 259 259 71 14 37K 4 LAST 4Q 0 0 150 300 0 0 150 300 0 0 150 300 150,000 300,000 259 259 24 12 35K 4 LAST 4Q 0 0 300 500 0 0 300 500 0 0 300 500 300,000 500,000 259 259 12 7 34K 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 33K 4 LAST 4Q 0 150 0 149 0 149 149,168 259 24 19K 4 LAST 4Q 0 0 550 2,600 0 0 550 2,600 0 0 550 2,597 550,000 2,598,500 259 259 6 1 15K 4 LAST 4Q 0 0 200 800 0 0 200 800 0 0 200 800 200,000 800,000 259 259 18 4 ATMEL 4 LAST 4Q 0 0 1,500 5,186 0 0 1,500 5,185 0 0 1,500 5,095 1,500,000 5,140,168 259 259 2 1 168 Hours REJ SS 500 Hours REJ SS 1K Hours REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 200 Cycles REJ SS 1K Cycles REJ SS % Defective BQFP 4 LAST 4Q 0 0 77 77 0 0 77 77 0.0% 0.0% CBGA 4 LAST 4Q 0 0 308 358 0 0 308 358 0.0% 0.0% CPGA 4 LAST 4Q 0 0 77 154 0 0 77 154 0.0% 0.0% CQFP 4 LAST 4Q 0 0 77 154 0 0 77 154 0.0% 0.0% DBGA 4 LAST 4Q 0 154 0 77 0.0% ICMOD 4 LAST 4Q 0 0 77 231 0 0 77 231 0.0% 0.0% LQFP / VQFP 4 LAST 4Q 0 0 154 358 0 0 154 279 0.0% 0.0% PDIL 4 LAST 4Q 0 0 50 199 0 0 50 199 0.0% 0.0% PDIP 4 LAST 4Q 0 0 177 681 0 0 173 599 0.0% 0.0% PLCC 4 LAST 4Q 0 0 200 1,175 0 1 150 997 0.0% 0.1% PQFP 4 LAST 4Q 0 0 154 308 0 0 154 308 0.0% 0.0% SOIC 4 LAST 4Q 0 0 429 1,418 0 0 379 1,291 0.0% 0.0% SSOP 4 LAST 4Q 0 0 50 249 0 1 50 249 0.0% 0.4% RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Cycle PACKAGE QTR TQFP 4 LAST 4Q 0 50 0 50 0.0% 4 LAST 4Q 0 250 0 249 0.0% TSSOP 4 LAST 4Q 0 0 154 308 0 0 154 308 0.0% 0.0% ATMEL 4 LAST 4Q 0 0 1,984 6,124 0 2 1,880 5,580 0.00% 0.03% TSOP 200 Cycles REJ SS 1K Cycles REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Temperature Humidity Bias / HAST Temperature Humidity Bias 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS HAST 100 Hours REJ SS PACKAGE QTR Device-Hours % Defective BQFP 4 LAST 4Q 0 0 77 77 0 0 77 77 0 0 77 77 0 0 77,000 77,000 0.0% 0.0% 4 LAST 4Q 0 0 308 308 0 0 308 308 0 0 308 308 0 0 308,000 308,000 0.0% 0.0% 4 LAST 4Q 0 177 0 177 0 177 0 0 177,000 0.0% 4 LAST 4Q 0 0 77 277 0 0 77 277 0 0 77 277 0 0 77,000 277,000 0.0% 0.0% 4 LAST 4Q 0 0 154 404 0 0 154 404 0 0 154 403 0 0 154,000 403,500 0.0% 0.0% 4 LAST 4Q 0 145 0 145 0 145 0 0 145,000 0.0% PDIP 4 LAST 4Q 0 0 100 300 0 0 100 300 0 0 100 300 0 0 100 450 300,000 1,200,000 0.0% 0.0% PLCC 4 LAST 4Q 0 0 50 791 0 0 50 791 0 691 0 0 150 400 325,000 1,541,000 0.0% 0.0% 4 LAST 4Q 0 0 154 354 0 0 154 354 0 0 154 354 0 0 154,000 354,000 0.0% 0.0% SOIC 4 LAST 4Q 0 0 352 1,402 0 0 352 1,402 0 0 302 1,352 0 0 50 98 427,000 1,573,000 0.0% 0.0% SSOP 4 LAST 4Q 0 0 50 250 0 0 50 250 0 0 50 250 0 0 50,000 250,000 0.0% 0.0% 4 LAST 4Q 0 0 0 0 0 0 0 248 496,000 0.0% 4 LAST 4Q 0 0 154 354 0 0 154 354 0 0 154 354 0 0 154,000 354,000 0.0% 0.0% 4 LAST 4Q 0 0 1,476 4,839 0 0 1,476 4,839 0 0 1,376 4,688 0 0 300 1,196 2,026,000 7,155,500 0.0% 0.0% CBGA DBGA ICMOD LQFP / VQFP PDIL PQFP TSOP TSSOP ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Steam Pressure Pot PACKAGE QTR 96 Hours REJ SS 168 Hours REJ SS % Defective BQFP 4 LAST 4Q 0 0 100 100 0 0 100 100 0.0% 0.0% CBGA 4 LAST 4Q 0 0 400 450 0 0 400 450 0.0% 0.0% CPGA 4 LAST 4Q 0 0 100 100 0 0 100 100 0.0% 0.0% CQFP 4 LAST 4Q 0 0 100 100 0 0 100 100 0.0% 0.0% DBGA 4 LAST 4Q 0 154 0 77 0.0% ICMOD 4 LAST 4Q 0 0 100 100 0 0 100 100 0.0% 0.0% LQFP / VQFP 4 LAST 4Q 0 0 200 427 0 0 200 277 0.0% 0.0% PDIL 4 LAST 4Q 0 0 50 200 0 0 0.0% 0.0% PDIP 4 LAST 4Q 0 0 177 681 0 0 177 604 0.0% 0.0% PLCC 4 LAST 4Q 0 3 200 1,100 0 0 150 650 0.0% 0.3% PQFP 4 LAST 4Q 0 0 200 400 0 0 200 400 0.0% 0.0% SOIC 4 LAST 4Q 1 1 500 1,426 0 0 350 927 0.2% 0.1% SSOP 4 LAST 4Q 0 0 50 100 0 0 0.0% 0.0% RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Steam Pressure Pot PACKAGE QTR TQFP 4 LAST 4Q 0 50 0 50 0.0% 4 LAST 4Q 0 250 0 250 0.0% TSSOP 4 LAST 4Q 0 0 200 354 0 0 200 354 0.0% 0.0% ATMEL 4 LAST 4Q 1 4 2,377 5,992 0 0 2,077 4,439 0.04% 0.07% TSOP 96 Hours REJ SS 168 Hours REJ SS % Defective RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Failure Description Detail Q1 - 2002 a. b. High Temperature Operating Life, 1 failure, 48-hour read point, MICRO, Z92, PLCC 44: Passivation crack. High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 57K, CBGA 280: Root cause investigation currently in progress. Q2 - 2002 a. b. c. d. e. High Temperature Operating Life, 1 failure, 500-hour read point, ASIC, 56K, FBGA 280: Root cause investigation currently in progress. High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 56K, FBGA 280: Root cause investigation currently in progress. Temperature Cycle, 1 failure, 1000-cycle read point, SRAM, Z91, SSOP 44: Passivation crack. Temperature Cycle, 1 failure, 1000-cycle read point, MICRO, 56K, PLCC 44: Lifted ball bond with cratering. Wiring process optimized. Steam Pressure Pot, 1 failure, 96-hour read point, MICRO, 56K, PLCC 44: Lifted ball bond with cratering. Dry packing (downgrading from MSL1 to MSL3). Q3 - 2002 a. b. High Temperature Operating Life, 1 failure, 48-hour read point, MICRO, 56K, SOIC 28: Metal scratch. Inspection reinforced. Steam Pressure Pot, 2 failures, 96-hour read point, MICRO, 56K, PLCC 44: Lifted ball bond (metal peeling). Dry packing (downgrading from MSL1 to MSL3). RELIABILITY MONITOR -- ATMEL PROPRIETARY 12 Failure Description Detail Q4 - 2002 a. b. c. d. e. f. High Temperature Operating Life, 1 failure, 48-hour read point, MICRO, Z92, PLCC 44: Poly spacer defect. Process modul optimized. High Temperature Operating Life, 1 failure, 48-hour read point, VAN DLC, Z92, SOIC 28: Implant damage. Implant tilt angle modified from 7° to 0° and N+ PR strip optimized. High Temperature Operating Life, 2 failures, 168-hour read point, ASIC, 58K, LQFP 100: Root cause investigation currently in progress. High Temperature Operating Life, 1 failure, 500-hour read point, ASIC, 56K, FBGA 280: Root cause investigation currently in progress. High Temperature Operating Life, 1 failure, 1000-hour read point, ASIC, 56K, FBGA 280: Root cause investigation currently in progress. Steam Pressure Pot, 1 failure, 96-hour read point, MICRO, 56K, SOIC 28: Lifted ball bond (metal peeling). Dry packing (downgrading from MSL1 to MSL3). RELIABILITY MONITOR -- ATMEL PROPRIETARY 13 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µ µ m] TYPICAL PRODUCTS / APPLICATIONS 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 15.3 19.3 19.5 19.6 19.7 EEPROM EEPROM Embedded Memory Configurator Embedded Memory EPLD 19.76 19.8 19.9 25 26 33.5 34 35.5 37 39 39.1 EPLD Embedded Memory Configurator Embedded Memory BiCMOS Logic FLASH EPROM Embedded Memory Configurator EEPROM EEPROM EEPROM sEEPROM sEEPROM Configurator sEEPROM, MC (Intel core), MC (AVR core) PLD PLD sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC ASIC ASIC 42 55 BiCMOS Logic 56 56.8 57.5 Z86 Z92 Logic Embedded Memory CMOS CMOS Digital CMOS Digital Z94 CMOS + EPROM 1.8 - 2.3 1.1 1.0 0.7 0.5 0.5 0.7 0.7 1.0 0.7 0.5 0.5 0.35 0.35 0.25 0.25 0.6 0.5 0.35 0.35 0.21 0.8 0.5 0.5 5 5 5 5 7 NTO NTO NTO EPROM Configurators, sEEPROM, FLASH, Microcontroller, EPLD FLASH, PEROM, DATA FLASH, sEEPROM DATA FLASH FLASH, DATA FLASH ASIC ASIC ASIC ASIC Watchdog, Processor Memories, Microcontrollers Micro OTP, EPROM RELIABILITY MONITOR -- ATMEL PROPRIETARY 14 Failure Rate Calculations Failure Rate: χ2 λ where, λ χ2 α n AF DH = = = = = = = α (1 − , 2⋅n + 2 ) 100 ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θJAf ) Ts + ( Ps ⋅θJAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = e Z⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 15 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage (commonly 30% above nominal), and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 16