Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot FIRST QUARTER 2005 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product family) 2 3. HTOL (sorted by technology) 3-5 4. Data Retention Bake (sorted by product family) 6 5. Data Retention Bake (sorted by technology) 7 6. Temperature Cycle 7. Temperature Humidity Bias & HAST 8. Steam Pressure Pot 8-9 10 11-12 9. Failure Description Detail 13 10. Technology List 14 11. Failure Rate Calculations 15 12. Definitions 16 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: March 30, 2005 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process or package family and performing a series of reliability tests to ensure that the reliability has maintained over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C)1 3 Failure Rate: 5 FITS (4.7M device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. 2. Data Retention Bake (150°C) 3 Failure Rate: 7 FITS (473K device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 259 for all groupings. 3. Temperature Cycle (-65°C to 150°C, 500 cycles) * 3 Failure Rate: 0.00% (0 failure(s) out of 1,317) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * 3 Failure Rate: 0.00% (0 failure(s) out of 1.2M device-hours) 3 Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * 3 Failure Rate: 0.00% (0 failure(s) out of 1,076) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 junction temperatures may reach up to 200° C. 1 High Temperature Operating Life (sorted by FAMILY) FAMILY QTR 48 Hours REJ 168 Hours 500 Hours 1K Hours SS REJ SS REJ SS REJ Device-Hours* WAF EFR PPM FITS SS ASIC 4 LAST 4Q 1 1 5,044 11,031 0 2 634 0 3,277 0 557 2,640 0 1 557 2,639 781,616 3,118,708 84 80 198 91 31 21 CCD 4 LAST 4Q 0 0 83 124 0 0 83 0 149 0 44 70 0 0 44 70 50,552 86,072 78 55 0 0 232 193 D-FLASH 4 LAST 4Q 0 0 300 900 0 0 100 0 300 0 100 300 0 0 100 300 109,600 328,800 21 21 0 0 395 132 DSP 4 LAST 4Q 0 45 0 45 0 45 0 45 0 45,000 3 0 8,021 EEPROM 4 LAST 4Q 0 0 2,524 10,801 0 0 700 0 2,800 0 699 2,799 0 0 698 2,798 786,220 3,182,716 121 99 0 0 10 3 EPLD 4 LAST 4Q 0 0 300 1,200 0 0 100 0 400 0 100 400 0 0 100 400 109,600 438,400 78 145 0 0 108 14 EPROM 4 LAST 4Q 0 0 300 1,200 0 0 100 0 399 0 100 398 0 0 100 398 109,600 436,616 348 185 0 0 24 11 FLASH 4 LAST 4Q 0 0 300 1,500 0 0 100 0 490 0 100 490 0 0 100 490 109,600 538,480 21 21 0 0 395 80 RF & Auto 4 LAST 4Q 0 0 3,295 15,932 0 3,295 0 0 13,019 0 1,282 7,328 0 0 1,282 7,251 1,777,184 9,940,412 296 283 0 0 2 0 MICRO 4 LAST 4Q 0 1 1,733 11,978 0 0 453 0 1,236 0 453 1,231 0 0 299 977 437,440 1,620,456 65 86 0 83 32 15 S-CARD 4 LAST 4Q 0 0 0 0 0 0 0 0 0 SRAM 4 LAST 4Q 0 0 644 945 0 0 140 1 275 1 140 275 0 0 45 180 116,692 259,660 6 5 0 0 2,872 1,584 TX RF Total 4 LAST 4Q 0 0 279 398 1 1 279 0 398 0 278 397 0 0 278 397 278,168 397,168 31 41 0 0 124 4 LAST 4Q 0 1,763 0 460 0 415 0 340 0 447,604 4 0 572 4 LAST 4Q 1 2 14,802 57,817 0 3,603 1 16,285 4,666,272 20,840,092 167 178 68 35 5 2 VAN DLC ATMEL 1 5,984 1 3,853 3 23,248 1 16,788 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours REJ 168 Hours SS REJ 500 Hours 1K Hours SS REJ SS REJ SS Device-Hours* WAF EFR PPM FITS 4 LAST 4Q 0 1,577 0 177 0 100 0 100 0 180,136 259 0 20 4 LAST 4Q 0 385 0 385 0 308 0 308 0 320,936 432 0 7 Z94 4 LAST 4Q 0 0 308 408 0 0 77 177 0 0 77 177 0 0 77 77 88,088 138,088 5 4 0 0 2,080 1,515 Z92 4 LAST 4Q 0 1 380 9,542 0 0 122 514 0 0 122 509 0 0 45 357 95,884 867,184 6 8 0 105 1,593 288 Z91 4 LAST 4Q 0 0 554 900 0 0 50 230 0 0 50 230 0 0 0 180 49,192 237,160 4 4 0 0 4,983 1,052 Z86 4 LAST 4Q 0 888 0 285 0 240 0 240 0 276,504 3 0 981 UHF 4 LAST 4Q 0 0 864 3,569 0 0 864 3,569 0 0 293 1,973 0 0 293 1,973 465,928 2,553,128 304 260 0 0 6 1 TSC6 4 LAST 4Q 0 0 45 45 0 0 45 45 0 0 45 45 0 0 45 45 45,000 45,000 78 78 0 0 261 261 SIGE 4 LAST 4Q 0 0 307 1,237 0 0 307 1,237 0 0 0 699 0 0 0 699 51,576 1,023,384 275 505 0 0 65 2 4 0 0 243 1,544 0 0 243 1,621 0 0 163 1,221 0 0 163 1,221 176,440 1,751,504 273 227 0 19 LAST 4Q 0 2 4 LAST 4Q 0 0 83 124 0 0 83 149 0 0 44 70 0 0 44 70 50,552 86,072 78 55 0 0 232 193 Z96 Z95 I2L HCCD RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours REJ 168 Hours SS REJ 500 Hours SS REJ 1K Hours SS REJ Device-Hours* WAF EFR PPM FITS SS CMOS 4 LAST 4Q 0 0 117 162 0 0 117 162 0 0 117 162 0 0 117 162 117,000 162,000 274 215 0 0 29 26 BCDMOS 4 LAST 4Q 0 0 1,049 1,585 0 0 1,049 1,585 0 0 231 465 0 0 231 465 368,424 730,160 210 180 0 0 12 7 BICMOS 4 LAST 4Q 0 0 2,847 6,619 0 0 792 3,687 0 0 555 2,192 0 0 555 2,192 773,456 2,974,896 281 250 0 0 4 1 61 K 4 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 100 400 0 0 100 400 109,600 438,400 21 21 0 0 395 99 58K 4 LAST 4Q 0 0 200 999 0 1 200 998 0 0 200 696 0 1 200 695 200,000 746,284 78 78 0 0 59 54 57K 4 LAST 4Q 0 0 45 45 0 0 45 45 1 1 45 45 0 0 0 0 22,500 22,500 2 2 0 0 40,291 40,291 56K 4 LAST 4Q 1 1 3,380 7,974 0 1 434 1,851 0 0 434 1,728 0 0 357 1,651 536,908 2,004,068 77 86 296 125 49 18 55K 4 LAST 4Q 0 270 0 270 0 135 0 135 0 157,680 78 0 75 46K 4 LAST 4Q 0 0 177 2,235 1 1 177 645 0 0 99 333 0 0 99 333 112,104 535,736 50 215 0 0 359 18 43 K 4 LAST 4Q 0 0 179 578 0 0 179 498 0 0 179 498 0 0 179 498 179,000 501,840 36 37 0 0 142 49 39K 4 LAST 4Q 0 0 300 1,200 0 0 100 390 0 0 100 390 0 0 100 390 109,600 428,880 21 21 0 0 395 101 RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours REJ 168 Hours 500 Hours 1K Hours SS REJ SS REJ SS REJ Device-Hours* WAF EFR PPM FITS SS 4 LAST 4Q 0 231 0 231 0 77 0 0 0 64,372 498 0 29 4 LAST 4Q 0 300 0 100 0 100 0 100 0 109,600 348 0 24 35K 4 LAST 4Q 0 0 964 4,859 0 0 300 1,298 0 0 300 1,298 0 0 300 1,298 331,872 1,468,928 123 123 0 0 22 5 34K 4 LAST 4Q 0 0 300 1,200 0 0 100 399 0 0 100 398 0 0 100 398 109,600 436,616 348 185 0 0 24 11 26K 4 LAST 4Q 0 100 0 100 0 100 0 100 0 100,000 52 0 178 24 4 LAST 4Q 0 0 100 100 0 0 100 100 0 0 100 100 0 0 100 100 100,000 100,000 93 93 0 0 98 98 19K 4 LAST 4Q 0 0 2,060 7,641 0 0 500 1,800 0 0 499 1,799 0 0 498 1,798 573,548 2,079,036 133 117 0 0 12 4 15K 4 LAST 4Q 0 300 0 300 0 300 0 300 0 300,000 93 0 33 4 LAST 4Q 1 14,802 2 57,817 0 3,603 1 16,285 4,666,272 20,840,092 167 178 68 35 5 2 38 K 37K ATMEL 1 5,984 3 23,248 1 3,853 1 16,788 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 5 Data Retention Bake (sorted by FAMILY) FAMILY QTR 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS ASIC 4 LAST 4Q 0 0 50 100 0 0 50 100 0 0 50 100 50,000 100,000 259 259 71 253 CCD 4 LAST 4Q 0 10 0 10 0 10 10,000 259 354 D-FLASH 4 LAST 4Q 0 0 50 250 0 0 50 250 0 0 50 250 50,000 250,000 259 259 71 14 EEPROM 4 LAST 4Q 0 0 50 700 0 0 50 700 0 0 50 700 50,000 700,000 259 259 71 5 EPLD 4 LAST 4Q 0 0 50 300 0 0 50 300 0 0 50 300 50,000 300,000 259 259 71 12 EPROM 4 LAST 4Q 0 0 50 300 0 0 50 299 0 0 50 299 50,000 299,168 259 259 71 12 FLASH 4 LAST 4Q 0 0 50 250 0 0 50 250 0 0 50 250 50,000 250,000 259 259 71 14 MICRO 4 LAST 4Q 0 0 232 532 0 0 232 532 0 0 114 414 173,000 473,000 259 259 20 7 ATMEL 4 LAST 4Q 0 0 532 2,442 0 0 532 2,441 0 0 414 2,323 473,000 2,382,168 259 259 7 1 RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Data Retention Bake (sorted by TECHNOLOGY) TECH 168 Hours 500 Hours REJ SS REJ SS REJ SS 4 LAST 4Q 0 10 0 10 0 10 61 K 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 56K 4 LAST 4Q 0 0 232 382 0 0 232 382 39K 4 LAST 4Q 0 0 50 300 0 0 37K 4 LAST 4Q 0 50 35K 4 LAST 4Q 0 0 34K 4 LAST 4Q 19K 15K HCCD ATMEL QTR 1K Hours Device-Hours AF FITS 10,000 259 354 50 200 50,000 259 200,000 259 71 18 0 0 114 264 173,000 259 323,000 259 20 11 50 300 0 0 50 300 50,000 259 300,000 259 71 12 0 50 0 50 50 450 0 0 50 450 0 0 0 0 50 300 0 0 50 299 4 LAST 4Q 0 0 100 650 0 0 4 LAST 4Q 0 100 4 LAST 4Q 0 0 532 2,442 50,000 259 71 50 450 50,000 259 450,000 259 71 8 0 0 50 299 50,000 259 299,168 259 71 12 100 650 0 0 100 650 100,000 259 650,000 259 35 5 0 100 0 100 100,000 259 35 0 0 532 2,441 0 0 414 2,323 473,000 259 2,382,168 259 7 1 RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Cycle PACKAGE QTR 200 Cycles REJ SS 500 Cycles 1K Cycles % Defective REJ SS REJ SS 4 LAST 4Q 0 526 0 526 0 521 0.00% LCC 4 LAST 4Q 0 0 300 300 0 0 300 300 0 0 150 150 0.00% 0.00% MLF / QFN 4 LAST 4Q 0 268 0 268 0 268 0.00% PDIP 4 LAST 4Q 0 0 50 408 0 0 50 408 0 0 50 408 0.00% 0.00% PGA 4 LAST 4Q 0 0 246 246 0 0 246 246 0 0 246 246 0.00% 0.00% PLCC 4 LAST 4Q 0 0 204 531 0 0 204 531 0 0 204 531 0.00% 0.00% SOIC 4 LAST 4Q 0 0 77 684 0 0 77 684 0 0 77 679 0.00% 0.00% SSOP 4 LAST 4Q 0 0 199 845 0 0 199 845 0 0 77 723 0.00% 0.00% TQFP / LQFP / VQFP 4 LAST 4Q 0 0 141 368 0 0 141 368 0 0 64 291 0.00% 0.00% CBGA RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Temperature Cycle PACKAGE QTR 200 Cycles REJ 500 Cycles SS 1K Cycles % Defective REJ SS REJ SS TSOP 4 LAST 4Q 0 0 100 475 0 0 100 475 0 0 100 475 0.00% 0.00% TSSOP 4 LAST 4Q 0 77 0 77 0 77 0.00% 4 LAST 4Q 0 0 1,317 4,728 0 0 1,317 4,728 0 0 968 4,369 0.00% 0.00% ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Temperature Humidity Bias / HAST HAST Temperature Humidity Bias 168 Hours 500 Hours 1K Hours 100 Hours Device-Hours* % Defective REJ SS REJ SS REJ SS REJ SS PACKAGE QTR CBGA 4 LAST 4Q 0 416 0 416 0 416 0 0 416,000 0.00% LCC 4 LAST 4Q 0 0 300 300 0 0 300 300 0 0 150 150 0 0 0 0 225,000 225,000 0.00% 0.00% MLF / QFN 4 LAST 4Q 0 271 0 197 0 197 0 74 357,432 0.00% PDIP 4 LAST 4Q 0 0 0 300 0 0 0 300 0 0 0 300 0 0 50 150 100,000 600,000 0.00% 0.00% PGA 4 LAST 4Q 0 0 246 246 0 0 246 246 0 0 246 246 0 0 0 0 246,000 246,000 0.00% 0.00% PLCC 4 LAST 4Q 0 0 77 304 0 0 77 304 0 0 77 304 0 0 100 200 277,000 704,000 0.00% 0.00% SOIC 4 LAST 4Q 0 352 0 352 0 275 0 204 721,500 0.00% SSOP 4 LAST 4Q 0 0 198 240 0 0 198 240 0 0 44 86 0 0 0 462 121,000 1,087,000 0.00% 0.00% LQFP / TQFP / VQFP 4 LAST 4Q 0 0 77 154 0 0 77 154 0 0 77 154 0 0 0 100 77,000 354,000 0.00% 0.00% TSOP / VSOP 4 LAST 4Q 0 0 0 0 0 0 0 0 0 0 0 0 0 0 100 449 200,000 898,000 0.00% 0.00% 0 250 0 1,639 1,246,000 5,608,932 0.00% 0.00% ATMEL 4 LAST 4Q 0 898 0 2,583 0 898 0 2,509 0 594 0 2,128 RELIABILITY MONITOR -- ATMEL PROPRIETARY 10 Steam Pressure Pot PACKAGE QTR 96 Hours 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 4 LAST 4Q 0 520 0 520 0 50 0.0% LCC 4 LAST 4Q 0 0 150 150 0 0 150 150 0 0 0 0 0.0% 0.0% TQFP / LQFP / VQFP 4 LAST 4Q 0 0 77 380 0 0 0 150 0 0 0 150 0.0% 0.0% PDIP 4 LAST 4Q 0 0 50 477 0 0 50 477 0 0 50 177 0.0% 0.0% PGA 4 LAST 4Q 0 0 246 246 0 0 246 246 0 0 0 0 0.0% 0.0% PLCC 4 LAST 4Q 0 0 177 504 0 0 100 200 0 0 100 200 0.0% 0.0% SOIC 4 LAST 4Q 0 0 77 607 0 0 77 177 0 0 76 176 0.0% 0.0% SSOP 4 LAST 4Q 0 0 199 241 0 0 45 45 0 0 0 0 0.0% 0.0% TSOP 4 LAST 4Q 0 0 100 477 0 0 100 477 0 0 100 477 0.0% 0.0% CBGA RELIABILITY MONITOR -- ATMEL PROPRIETARY 11 Steam Pressure Pot PACKAGE TSSOP ATMEL QTR 96 Hours 168 Hours 240 Hours % Defective REJ SS REJ SS REJ SS 4 LAST 4Q 0 76 0 76 0 76 0.0% 4 LAST 4Q 0 0 1,076 3,678 0 0 768 2,518 0 0 326 1,306 0.00% 0.00% RELIABILITY MONITOR -- ATMEL PROPRIETARY 12 Failure Description Detail Q4-2004 a. High Temperature Operating Life, 1 failure, 48 hour read point, ASIC, AT8402, SSOP-28. Root Cause: This was a static fail (Iddq). Corrective Action: To be declared. b. High Temperature Operating Life, 1 failure, 168 hour read point, TX RF, AT84RF211S, TQFP-48. Root Cause: This was a static fail (Iddq). Corrective Action: To be declared. c. High Temperature Operating Life, 1 failure, 500 hour read point, SRAM, AT60142E, MQFP-36. Root Cause: This was caused by resistive contact VIA1 to M2. Corrective Action: We have improved the CMP process to ensure this failure will not repeat. RELIABILITY MONITOR -- ATMEL PROPRIETARY 13 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µ µ m] TYPICAL PRODUCTS / APPLICATIONS 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 GFO / CSO HNO 5 5 5 5 15.3 19.3 19.5 19.6 19.7 19.76 19.8 19.8 19.9 25 26 33.5 34 35.5 37 39 39.1 42 43 46 55 55.8 56 56.8 EEPROM EEPROM Embedded Memory Configurator Embedded Memory EPLD EPLD CMOS Embedded Memory Configurator Embedded Memory BiCMOS Logic FLASH EPROM Embedded Memory Configurator EEPROM EEPROM EEPROM BiCMOS 1.8 - 2.3 1.1 1.0 0.7 0.5 0.5 0.7 0.7 0.7 1.0 0.7 0.5 0.5 0.35 0.35 0.25 0.25 0.6 sEEPROM sEEPROM Configurator sEEPROM, MC (Intel core), MC (AVR core) PLD PLD ASIC sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC ASIC ASIC Logic CMOS Logic Embedded Memory 0.5 0.5 0.35 0.35 EPROM Configurators, sEEPROM, FLASH, Microcontroller, EPLD FLASH, PEROM, DATA FLASH, sEEPROM DATA FLASH FLASH, DATA FLASH ASIC ASIC, TX RF RF & Auto ASIC ASIC ASIC ASIC 7 57.0 CMOS 0.25 ASIC 7 57.5 CMOS 0.21 ASIC 7 CMOS CMOS 0.18 ASIC SJO 58.0 61 0.18 FLASH HNO BCDMOS 6BD1 0.8 HNO GFO GFO HNO HNO HNO NTO NTO NTO NTO HNO HNO BICMOS HCCD1 HCCD3 I²L SIGE1 UHF Z86 Z91 Z92 Z94 Z95 Z96 NMOS NMOS 6IL4 6SG1 6UH6 CMOS Digital CMOS Digital CMOS Digital CMOS + EPROM 2.5 1.5 2 0.8 0.5 0.8 0.6 0.5 0.5 ASIC RF & Auto CCD CCD ASIC ASIC ASIC SRAM,MICRO, VAN DLC SRAM, ASIC, MICRO ASIC, MICRO,VAN DLC OTP MICRO RF & Auto RF & Auto RELIABILITY MONITOR -- ATMEL PROPRIETARY 14 Failure Rate Calculations Failure Rate: χ2 λ where, λ χ2 α n AF DH = = = = = = = α (1 − , 2⋅n + 2 ) 100 ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θJAf ) Ts + ( Ps ⋅θJAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = e Z⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 15 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 16