Reliability Monitor Report High Temperature Operating Life Data Retention Bake Temperature Cycle Temperature & Humidity Bias/ HAST Steam Pressure Pot FIRST QUARTER 2004 ATMEL PROPRIETARY Table of Contents 1. Executive Summary 1 2. HTOL (sorted by product family) 2 3. HTOL (sorted by technology) 3-4 4. Data Retention Bake (sorted by product family) 5 5. Data Retention Bake (sorted by technology) 6 6. Temperature Cycle 7. Temperature Humidity Bias & HAST 8. Steam Pressure Pot 9. Failure Description Detail 7-8 9 10 11-12 10. Technology List 13 11. Failure Rate Calculations 14 12. Definitions 15 RELIABILITY MONITOR -- ATMEL PROPRIETARY Reliability Monitor Report Date: March 15, 2004 Executive Summary The intent of the Reliability Monitor Program is to measure the reliability of previously qualified devices on a quarterly basis. This is achieved by selecting representative devices within a process or package family and performing a series of reliability tests to ensure that the reliability has not deteriorated over time. Listed below are the overall results for the last quarter. 1. High Temperature Operating Life (125° - 150°C)1 3 Failure Rate: 2 FITS (4.9M device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Also, Thermal and Voltage Acceleration are used to compute the overall acceleration factor. Weighted acceleration factors (WAF) for a group of products are calculated by taking the weighted average of each device’s acceleration factor multiplied by its corresponding device hours. 2. Data Retention Bake (150°C) 3 Failure Rate: 12 FITS (304K device-hours) 3 Note: The Exponential Model is used to derive FIT rates (60% Confidence; EA = 0.7 eV). Since there is no bias applied during testing and the stress temperature is fixed for all devices at 150°C, the acceleration factor is 259 for all groupings. 3. Temperature Cycle (-65°C to 150°C) * 3 Failure Rate: 0.17% (3 failure out of 1,729) 4. Temperature Humidity Bias (85°C/85%RH) and HAST (130°C/85%RH) * 3 Failure Rate: 0.00% (0 failures out of 1.3M device-hours) 3 Note: A 20:1 Acceleration Factor is used to combine HAST results with THB). 5. Steam Pressure Pot (121°C/100%RH) * 3 Failure Rate: 0.00% (0 failures out of 822) RELIABILITY MONITOR -- ATMEL PROPRIETARY * indicates that preconditioning is performed prior to the stress test. 1 junction temperatures may reach up to 200° C. 1 High Temperature Operating Life (sorted by FAMILY) FAMILY 48 Hours QTR REJ ASIC CCD D-FLASH DSP EEPROM EPLD EPROM FLASH RF & Auto MICRO S-CARD SRAM VAN DLC ATMEL 168 Hours SS REJ 500 Hours SS REJ 1K Hours SS REJ Device-Hours* WAF EFR PPM FITS SS 4 0 787 0 603 0 501 0 335 443,968 28 0 75 LAST 4Q 0 7,377 0 3,495 0 2,516 0 2,216 4,134,644 53 0 4 4 0 44 0 44 0 44 0 44 44,000 78 0 267 LAST 4Q 0 101 0 101 0 81 0 81 111,812 77 0 106 4 0 300 0 100 0 100 0 99 109,100 21 0 397 LAST 4Q 0 1,199 0 400 0 400 0 399 652,652 72 0 19 4 0 45 0 45 0 45 0 45 45,000 3 0 8,021 LAST 4Q 0 45 0 45 0 45 0 45 45,000 3 0 8,021 4 0 2,650 0 700 0 700 0 700 793,600 85 0 14 LAST 4Q 0 29,754 0 2,500 0 2,500 0 2,400 4,996,992 43 0 4 4 0 300 0 100 0 100 0 100 109,600 348 0 24 LAST 4Q 0 1,200 0 400 0 400 0 400 653,200 80 0 18 4 0 300 0 100 0 100 0 100 109,600 21 0 395 LAST 4Q 0 1,200 0 400 0 400 0 400 653,200 111 0 13 4 0 600 0 200 0 200 0 200 219,200 348 0 12 LAST 4Q 0 1,500 0 500 0 500 0 500 762,800 197 0 6 4 0 2,297 0 2,297 0 1,112 0 1,112 2,265,080 290 0 1 LAST 4Q 0 10,824 0 10,354 0 4,961 0 4,961 12,996,224 318 0 0 4 1 7,600 0 190 0 145 0 145 508,240 14 132 295 LAST 4Q 1 10,306 0 978 0 905 0 790 1,795,512 60 97 19 LAST 4Q 0 45 0 45 0 0 0 0 9,720 66 0 1,428 4 4 0 256 0 90 0 90 0 90 97,968 5 0 1,997 LAST 4Q 0 642 0 190 0 185 0 135 225,796 4 0 1,071 4 0 1,011 0 145 0 145 0 145 186,568 4 0 1,332 LAST 4Q 0 3,206 0 570 0 565 0 365 793,328 3 0 378 4 1 16,190 0 4,614 0 3,282 0 3,115 4,931,924 176 62 2 LAST 4Q 1 67,399 0 19,978 0 13,458 0 12,692 27,830,880 73 15 1 * The Device-Hours computation includes additional read-outs not detailed in the report. RELIABILITY MONITOR -- ATMEL PROPRIETARY 2 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 308 385,000 600 0 4 0 0 290 560 867,240 1,477,908 119 71 121 95 20 19 135 290 0 0 135 240 142,968 373,756 4 3 0 0 1,599 708 0 0 45 290 0 0 45 90 52,968 300,868 4 3 0 0 4,865 1,059 461 0 76 0 76 392,936 133 0 18 0 0 691 2,254 0 0 267 1,034 0 0 267 1,034 605,232 3,272,132 259 341 0 0 6 1 150 1,045 0 0 150 1,045 0 0 75 433 0 0 75 433 162,600 1,445,104 258 321 0 0 22 2 0 45 0 45 0 45 0 45 77,220 78 0 152 0 0 317 1,258 0 0 317 1,098 0 0 80 390 0 0 80 390 199,816 994,192 258 323 0 18 LAST 4Q 0 3 4 LAST 4Q 0 273 0 273 0 273 0 273 468,468 111 0 18 HCCD 4 LAST 4Q 0 0 44 101 0 0 44 101 0 0 44 81 0 0 44 81 44,000 111,812 78 77 0 0 267 107 CMOS 4 LAST 4Q 0 0 45 120 0 0 45 120 0 0 45 45 0 0 45 45 45,000 61,200 8 26 0 0 2,545 576 BCDMOS 4 LAST 4Q 0 0 338 1,613 0 0 338 1,613 0 0 158 953 0 0 158 953 188,240 2,416,240 600 398 0 0 8 1 BICMOS 4 LAST 4Q 0 0 713 3,412 0 0 713 3,102 0 0 342 1,607 0 0 342 1,607 746,328 3,792,628 263 353 0 0 5 1 REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 539 0 539 0 308 0 Z92 4 LAST 4Q 1 1 8,245 10,479 0 0 335 809 0 0 290 605 Z91 4 LAST 4Q 0 0 301 747 0 0 135 295 0 0 Z86 4 LAST 4Q 0 0 211 1,011 0 0 45 295 UNI 4 LAST 4Q 0 461 0 UHF 4 LAST 4Q 0 0 691 2,254 SIGE 4 LAST 4Q 0 0 NMOS 4 LAST 4Q Z95 I2L HCMOS 4 RELIABILITY MONITOR -- ATMEL PROPRIETARY 3 High Temperature Operating Life (sorted by TECHNOLOGY) TECH QTR 48 Hours 168 Hours 500 Hours 1K Hours Device-Hours* WAF EFR PPM FITS 300 757,104 70 0 17 0 0 135 435 135,000 649,800 1 26 0 0 6,787 54 366 1,023 0 0 200 742 291,832 1,447,572 36 44 0 0 87 14 0 133 0 44 151,396 62 0 98 90 0 60 0 60 60,000 259 0 59 0 400 0 400 0 400 686,400 95 0 14 300 1,199 0 0 100 400 0 0 100 400 0 0 99 399 109,100 652,652 21 92 0 0 397 15 0 0 400 1,100 0 0 200 500 0 0 200 500 0 0 200 500 209,600 743,600 223 153 0 0 20 8 4 LAST 4Q 0 0 1,400 7,444 0 0 300 1,000 0 0 300 977 0 0 300 877 352,800 1,676,012 142 61 0 0 18 9 34K 4 LAST 4Q 0 0 300 1,200 0 0 100 400 0 0 100 400 0 0 100 400 109,600 653,200 21 111 0 0 395 13 26K 4 LAST 4Q 0 100 0 100 0 100 0 100 171,600 33 0 162 19K 4 LAST 4Q 0 0 1,950 21,082 0 0 500 2,100 0 0 500 2,100 0 0 500 2,100 569,600 4,156,736 136 69 0 0 12 3 15K 4 LAST 4Q 0 100 0 100 0 100 0 100 100,000 93 0 4,028 0 200 0 200 0 200 455,344 38 0 0 98 54 4 LAST 4Q 1 1 16,190 67,399 0 0 4,614 19,978 0 0 3,282 13,458 0 0 3,115 12,692 4,931,924 27,830,880 176 73 62 15 2 1 REJ SS REJ SS REJ SS REJ SS 4 LAST 4Q 0 4,298 0 600 0 300 0 57K 4 LAST 4Q 0 0 135 435 0 0 135 435 0 0 135 435 56K 4 LAST 4Q 0 0 550 2,282 0 0 366 1,569 0 0 55K 4 LAST 4Q 0 383 0 134 4 LAST 4Q 0 90 0 4 LAST 4Q 0 400 39K 4 LAST 4Q 0 0 37K 4 LAST 4Q 35K 58K 46K 42K ATMEL * The Device-Hours computation includes a few 5,000-hour read-outs. RELIABILITY MONITOR -- ATMEL PROPRIETARY 4 Data Retention Bake (sorted by FAMILY) FAMILY 168 Hours QTR 500 Hours 1K Hours REJ SS REJ SS REJ SS Device-Hours AF FITS D-FLASH 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 EEPROM 4 LAST 4Q 0 1,500 0 1,500 0 1,500 1,500,000 259 2 EPLD 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 EPROM 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 FLASH 4 LAST 4Q 0 0 100 250 0 0 100 250 0 0 100 250 100,000 250,000 259 259 35 14 MICRO 4 LAST 4Q 0 0 50 277 0 0 50 277 0 0 50 200 50,000 238,500 259 259 71 15 VAN DLC 4 LAST 4Q 0 127 0 127 0 77 102,000 259 35 4 LAST 4Q 0 0 304 2,758 0 0 304 2,758 0 0 304 2,631 304,000 2,694,500 259 259 12 1 ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 5 Data Retention Bake (sorted by TECHNOLOGY) TECH QTR 168 Hours 500 Hours 1K Hours Device-Hours AF FITS REJ SS REJ SS REJ SS 4 LAST 4Q 0 204 0 204 0 77 140,500 259 25 39K 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 37K 4 LAST 4Q 0 0 50 250 0 0 50 250 0 0 50 250 50,000 250,000 259 259 71 14 35K 4 LAST 4Q 0 0 100 700 0 0 100 700 0 0 100 700 100,000 700,000 259 259 35 5 34K 4 LAST 4Q 0 0 50 200 0 0 50 200 0 0 50 200 50,000 200,000 259 259 71 18 19K 4 LAST 4Q 0 0 50 1,100 0 0 50 1,100 0 0 50 1,100 50,000 1,100,000 259 259 71 3 15K 4 LAST 4Q 0 100 0 100 0 100 100,000 259 35 4 LAST 4Q 0 0 304 2,758 0 0 304 2,758 0 0 304 2,631 304,000 2,694,500 259 259 12 1 Z92 ATMEL RELIABILITY MONITOR -- ATMEL PROPRIETARY 6 Temperature Cycle PACKAGE QTR 200 Cycles 500 Cycles 1K Cycles % Defective REJ SS REJ SS REJ SS 4 LAST 4Q 0 308 0 308 0 308 0.00% CASON 4 LAST 4Q 0 0 50 50 0 0 50 50 0 0 50 50 0.00% 0.00% CBGA 4 LAST 4Q 0 77 0 77 0 77 0.00% CERQUAD 4 LAST 4Q 0 0 35 35 0 0 35 35 0 0 0 0 0.00% 0.00% CPGA 4 LAST 4Q 0 77 0 77 0 77 0.00% 4 LAST 4Q 0 77 0 77 0 77 0.00% MLF / QFN 4 LAST 4Q 0 0 481 558 0 0 442 519 3 3 442 519 0.62% 0.54% PBGA 4 LAST 4Q 0 77 0 77 0 77 0.00% PDIP 4 LAST 4Q 0 0 50 431 0 0 50 428 0 0 50 428 0.00% 0.00% PLCC 4 LAST 4Q 0 0 204 604 0 0 204 604 0 0 127 527 0.00% 0.00% SOIC 4 LAST 4Q 0 0 563 1,451 0 0 524 1,226 0 0 524 1,226 0.00% 0.00% BCC FBGA RELIABILITY MONITOR -- ATMEL PROPRIETARY 7 Temperature Cycle PACKAGE QTR 200 Cycles 500 Cycles 1K Cycles REJ SS REJ SS REJ SS % Defective SSOP 4 LAST 4Q 0 0 119 291 0 0 119 245 0 0 119 245 0.00% 0.00% TQFP 4 LAST 4Q 0 50 0 50 0 50 0.00% TSOP 4 LAST 4Q 0 0 150 450 0 0 150 450 0 0 150 450 0.00% 0.00% VQFP 4 LAST 4Q 0 0 77 77 0 0 77 77 0 0 0 0 0.00% 0.00% ATMEL 4 LAST 4Q 0 0 1,729 4,613 0 0 1,651 4,300 3 3 1,462 4,111 0.17% 0.07% RELIABILITY MONITOR -- ATMEL PROPRIETARY 8 Temperature Humidity Bias / HAST Temperature Humidity Bias 168 Hours 500 Hours 1K Hours REJ SS REJ SS REJ SS HAST 100 Hours REJ SS PACKAGE QTR BCC 4 LAST 4Q 0 308 0 308 0 308 0 0 0 308,000 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 0 50 50 100,000 100,000 0.00% 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 0 0 77,000 0.00% 0 77 0 77 0 77 0 0 0 77,000 0.00% 0 0 0 0 0 0 0 0 75 152 150,000 304,000 0.00% 0.00% 4 LAST 4Q 0 77 0 77 0 77 0 0 0 77,000 0.00% 4 LAST 4Q 0 300 0 300 0 300 0 0 50 200 100,000 700,000 0.00% 0.00% PLCC 4 LAST 4Q 0 0 177 277 0 0 177 277 0 0 100 150 0 0 50 350 238,500 913,500 0.00% 0.00% SOIC 4 LAST 4Q 0 0 149 853 0 0 149 853 0 0 149 649 0 177 149,000 1,105,000 0.00% 0.00% SSOP 4 LAST 4Q 0 0 42 92 0 0 42 92 0 0 42 92 0 0 77 154 196,000 400,000 0.00% 0.00% TQFP 4 LAST 4Q 0 0 0 0 0 0 0 50 0 100,000 0.00% 4 LAST 4Q 0 0 0 0 0 0 0 0 150 350 300,000 700,000 0.00% 0.00% 4 LAST 4Q 0 0 77 77 0 0 77 77 0 0 0 0 0 0 38,500 38,500 0.00% 0.00% 4 LAST 4Q 0 0 445 2,138 0 0 445 2,138 0 0 291 1,730 0 0 452 1,483 1,272,000 4,900,000 0.00% 0.00% CASON CBGA FBGA MLF / QFN PBGA PDIP TSOP VQFP ATMEL 4 LAST 4Q 4 LAST 4Q Device-Hours* % Defective * The Device-Hours computation includes a few 500-hour read-outs. RELIABILITY MONITOR -- ATMEL PROPRIETARY 9 Steam Pressure Pot PACKAGE QTR BCC 4 LAST 4Q 0 562 0 331 0 0 0.0% 4 LAST 4Q 0 100 0 100 0 0 0.0% CASON 4 LAST 4Q 0 0 50 50 0 0 50 50 0 0 50 50 0.0% 0.0% CBGA 4 LAST 4Q 0 154 0 477 0 0 0.0% 4 LAST 4Q 0 200 0 200 0 0 0.0% 4 LAST 4Q 0 100 0 100 0 0 0.0% 4 LAST 4Q 0 154 0 77 0 0 0.0% 4 LAST 4Q 0 100 0 100 0 0 0.0% 4 LAST 4Q 0 200 0 200 0 0 0.0% 4 LAST 4Q 0 154 0 77 0 0 0.0% 4 LAST 4Q 0 0 50 477 0 0 50 604 0 0 50 50 0.0% 0.0% BQFP CPGA CQFP FBGA ICMOD LQFP / VQFP PBGA PDIP 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY % Defective 10 Steam Pressure Pot PACKAGE QTR PLCC 4 LAST 4Q 0 0 227 727 0 0 150 500 0 0 50 50 0.0% 0.0% PQFP 4 LAST 4Q 0 200 0 200 0 0 0.0% 4 LAST 4Q 0 0 226 1,007 0 604 0 0 0.0% 0.0% 4 LAST 4Q 0 0 42 87 0 0 0 0 0.0% 0.0% 4 LAST 4Q 0 50 0 0 0 0 0.0% TSOP 4 LAST 4Q 0 0 150 346 0 0 150 346 0 0 149 149 0.0% 0.0% TSSOP 4 LAST 4Q 0 200 0 200 0 0 0.0% 4 LAST 4Q 0 0 77 77 0 0 0 0 0.0% 0.0% 4 LAST 4Q 0 0 822 4,945 0 0 400 4,166 0 0 299 299 0.00% 0.00% SOIC SSOP TQFP VQFP ATMEL 96 Hours REJ SS 168 Hours REJ SS 240 Hours REJ SS RELIABILITY MONITOR -- ATMEL PROPRIETARY % Defective 11 Failure Description Detail Q4-2003 a. Temperature Cycle, 3 failures, 1000 cycle read point, RF & Auto, 6UH6, MLF/QFN 28. Root Cause: ground bonds were broken. Corrective Action: change bonding from normal wedge to “stitch on ball”. b. High Temperature Operating Life, 1 failure, 48 hour read point, Micro, Z92, SSOP 16: Root Cause: passivation scratch. Corrective Action: Implement high voltage burn in. RELIABILITY MONITOR -- ATMEL PROPRIETARY 12 Technology List FAB TECH TYPE CMOS / BIP LITHOGRAPHY [µ µ m] TYPICAL PRODUCTS / APPLICATIONS 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 7 7 15.3 19.3 19.5 19.6 19.7 19.76 19.8 19.8 19.9 26 33.5 34 35.5 37 39 39.1 42 55 55.8 56 56.8 57.0 58.0 EEPROM EEPROM Embedded Memory Configurator Embedded Memory EPLD EPLD CMOS Embedded Memory Configurator Embedded Memory Logic FLASH EPROM Embedded Memory Configurator EEPROM EEPROM EEPROM BiCMOS Logic CMOS Logic Embedded Memory CMOS CMOS 1.8 - 2.3 1.1 1.0 0.7 0.5 0.5 0.7 0.7 0.7 0.7 0.5 0.5 0.35 0.35 0.25 0.25 0.6 0.5 0.5 0.35 0.35 0.25 0.18 sEEPROM sEEPROM Configurator sEEPROM, MC (Intel core), MC (AVR core) PLD PLD ASIC sEEPROM, PEROM, EEPROM, Configurator Smartcard, AVR, µC ASIC EPROM Configurators, sEEPROM, FLASH, Microcontroller, EPLD FLASH, PEROM, DATA FLASH, sEEPROM DATA FLASH FLASH, DATA FLASH ASIC ASIC ASIC ASIC ASIC ASIC ASIC 7 57.5 BCDMOS CMOS 6BD1 0.21 ASIC HNO 0.8 ASIC HNO I²L 6IL4 2 ASIC HNO SIGE1 6SG1 0.8 ASIC HNO UHF 6UH6 0.5 ASIC GFO GFO NTO NTO NTO HCCD1 HCCD3 Z86 Z91 Z92 NMOS NMOS CMOS Digital CMOS Digital CMOS Digital 2.5 1.5 0.8 0.6 0.5 CCD CCD SRAM,MICRO, VAN DLC SRAM, ASIC, MICRO ASIC, MICRO,VAN DLC RELIABILITY MONITOR -- ATMEL PROPRIETARY 13 Failure Rate Calculations Failure Rate: χ2 λ where, λ χ2 α n AF DH = = = = = = = α (1 − , 2⋅n + 2 ) 100 ⋅ 109 2 ⋅ AF ⋅ DH Failure Rate (FITS) Failure Estimate Confidence Level (60% or 90%) Number of Failures Overall Acceleration Factor (TAF x VAF) Device Hours Thermal Acceleration: TAF where, TAF EA k T f s P θJA = = = = = = = = = e ea 1 1 ⋅ − k Tf + ( Pf ⋅θJAf ) Ts + ( Ps ⋅θJAs ) Thermal Acceleration Factor Activation Energy (eV) Boltzman’s Constant (8.617 x 10-5 eV/°K) Temperature (°K) Field Conditions Stress Conditions Power Dissipation (W) Thermal Resistance Coefficient - Junction to Ambient (°C/W) Voltage Acceleration: VAF where, VAF Vs Vn Z = = = = = e Z⋅ [ VS − Vn ] Voltage Acceleration Factor Stress Voltage (V) Nominal Voltage (V) Voltage Acceleration Constant (typically, 0.5 < Z < 1.0) RELIABILITY MONITOR -- ATMEL PROPRIETARY 14 Definitions Data Retention Bake (DRB): This test is used to measure a device’s ability to retain a charge for extended periods of time without applying voltage bias. Stressing at high temperatures (150°C for plastic packages) accelerates any discharge causing the memory state to change. Failures In Time (FITS): This is the unit measure for expressing failure rates and is identical to the expression PPM/K hours. For example, three failures out of a million components tested for one thousand hours equates to 3 FITS. High Temperature Operating Life (HTOL): The purpose of this test is to accelerate thermally activated failure mechanisms through the use of high temperatures (typically between 125°C and 150°C), increased voltage, and dynamic bias conditions. Readouts at various time points are taken to determine the Early Failure Rate (EFR) and Intrinsic Failure Rate (IFR). EFR is expressed in defective parts per million (DPPM) and IFR is expressed in Failures in Time (FITS at 55°C). Highly Accelerated Stress Test (HAST): The purpose of this test is to evaluate a plastic packaged component’s ability to withstand harsh environmental conditions with extreme temperature and humidity levels. The parts are stressed to high temperature (130°C) and relative humidity (85%RH) conditions in a biased state to achieve maximum acceleration. Steam Pressure Pot (SPP): The test is used to evaluate a plastic packaged component’s ability to withstand severe conditions of pressure (15 psig), temperature (121°C), and humidity (100%RH). Temperature Cycle (TC): This test is used to measure a product’s sensitivity to thermal stresses due to differences in expansion and contraction characteristics of the die and mold compound by repeated alternating temperature dwells between high and low temperature extremes. Temperature Humidity Bias (THB): The purpose of this test (85°C/85%RH) is identical to HAST. The only difference is that HAST accelerates THB by a factor of 20:1 due to the increase in temperature during test. RELIABILITY MONITOR -- ATMEL PROPRIETARY 15 Distribution SJO Engineering Cheung, Manton D'Souza, Gladwyn Do, To Nhi Hui, Ed Hwang, Tom Kuo, Wei-Yen Lim, Victor Louie, Carey Malik, Arun Mok, Tsung Pearce, Tim Phan, Alan Schumann, Steve Suciu, Paul Wong, Jason Wong, Will SJO Q & R Arquero, Felix Johnson, Jim Lin, Hao-Chou Sun, Larry Webb, Kory White, Kathy Woo, Brian Executive Management Perlegos, Gust SJO Sales / Marketing Bryant, John Franklin, Dirk Fulhorst, Paul Katz, Jeff Kwong, Ken Panfil, Jim Rosenberg, Joel Sidhu, Anup Tehrani, Abbas CSO Brown, Tom Johnson, Phil Streicher, Ray RFO Bissonnier, Christelle Blanchart, Jacques NFO Faes, Francois Houze, Pierre Lecuyer, Pascal SJO Operations Demas, Themi EUROPE Field Quality Sinha, Aloke SJO MFG Ly, Uyen-Chi Schleich, Chuck NORWAY Vegard, Wollan SJO Distribution Furman, Mike SJO Assembly Raoofi, Barry ASIA Marketing Skar, Haakon HNO Q&R Seiler, Josef Junesch, Otmar GFO Q&R Borel, Gerard Thiebaud, Claude Please contact Pete Cannon (x4122) if you would like to be added or removed from this distribution