CM1244 4-Channel ESD Array in CSP Features • Four Channels of ESD Protection • ±15 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) http://onsemi.com • ±30 kV ESD Protection on Each Channel (HBM) • Chip Scale Package Features Extremely Low Lead Inductance for Optimum ESD Protection • 5−bump, 0.760 mm x 1.053 mm Footprint, Devices A1 • Can be Used for EMI Filtering when Combined with External Series • • • • • • Resistance Wireless Handsets Handheld PCs/PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs GND A3 C1 ESD_4 ESD_1 • ESD Protection for Sensitive Electronic Equipment • I/O Port and Keypad and Button Circuitry Protection for Portable ESD_3 BLOCK DIAGRAM Applications ESD_2 • • WLCSP5 CP SUFFIX CASE 567AX 0.4 mm Pitch, Chip Scale Package (CSP) OptiGuardt Coating for Improved Reliability at Assembly These Devices are Pb−Free and are RoHS Compliant C3 B2 MARKING DIAGRAM 04 MG G 04 = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† CM1244−04CP CSP−5 (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 February, 2011 − Rev. 4 1 Publication Order Number: CM1244/D CM1244 PACKAGE / PINOUT DIAGRAMS Table 1. PIN DESCRIPTIONS 5−bump CSP Package Pin Name A1 ESD_1 ESD Channel 1 A3 ESD_2 ESD Channel 2 B2 GND Device Ground C1 ESD_3 ESD Channel 3 C3 ESD_4 ESD Channel 4 Top View (Bumps Down View) 1 2 3 Orientation Marking (see Note) Description A B + 04 C Bottom View (Bumps Up View) ESD_3 ESD_4 C1 GND C3 Orientation Marking ESD_1 B2 A1 A1 ESD_2 A3 CM1244 CSP Package Note: The “+” orientation marking indicates that the package is lead−free. SPECIFICATIONS Table 2. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Range DC Package Power Rating Rating Units –65 to +150 °C 200 mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 3. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units –40 to +85 °C Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol VDIODE Parameter Conditions Diode Reverse Breakdown Voltage IDIODE = 10 mA ILEAK Diode Leakage Current TA = 25°C; VIN = 3.3 V VSIG Signal Voltage Positive Clamp Negative Clamp IDIODE = 10 mA VESD In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 (Note 2) Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients (Note 2) Diode Capacitance At 2.5 VDC Reverse Bias, 1 MHz, 30 mVAC VCL CDIODE Min Typ Max 5.5 V 100 5.6 −1.5 Units 6.8 –0.8 9.0 −0.4 nA V kV ±30 ±15 V +15 –8 1. TA = –40°C to +85°C unless otherwise specified. 2. ESD applied to input and output pins with respect to GND, one at a time. http://onsemi.com 2 22 27 32 pF CM1244 APPLICATION INFORMATION Refer to Application Note “The Chip Scale Package,” for a detailed description of Chip Scale Packages offered by ON Semiconductor. PERFORMANCE INFORMATION Diode Characteristics (nominal conditions unless specified otherwise) Figure 1. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5 VDC) Figure 2. Frequency Response (single channel vs. GND, in 50 system) http://onsemi.com 3 CM1244 PACKAGE DIMENSIONS WLCSP5, 0.76x1.05 CASE 567AX−01 ISSUE O D È È PIN A1 REFERENCE 2X 0.05 C 2X A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B E DIM A A1 A2 b D E eD eE 0.05 C TOP VIEW ÉÉ A2 OptiGuard Option 0.05 C RECOMMENDED SOLDERING FOOTPRINT* A 0.05 C NOTE 3 A1 SIDE VIEW C A1 SEATING PLANE eD/2 5X b 0.05 C A B 0.03 C eD MILLIMETERS MIN MAX 0.69 0.54 0.17 0.24 0.42 REF 0.24 0.29 0.76 BSC 1.05 BSC 0.400 BSC 0.347 BSC PACKAGE OUTLINE 0.35 0.35 0.40 PITCH eE C B 5X 0.25 DIMENSIONS: MILLIMETERS A *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 1 2 3 BOTTOM VIEW OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative CM1244/D