CM1205 8-Channel ESD Protection Array in Chip Scale Package Description The CM1205 transient voltage suppressor array provides a very high level of protection for sensitive electronic components that may be subjected to ESD. The CM1205 will safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000−4−2 international standard (Level 4, ±8 kV contact discharge). All I/Os are rated at ±25 kV using the IEC 61000−4−2 contact discharge method. Using the MIL−STD−883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than ±30 kV. The Chip Scale Package format of this device enables extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The CM1205 features OptiGuardt coating for improved reliability at assembly and is available with RoHS compliant lead−free finishing. http://onsemi.com WLCSP10 CP SUFFIX CASE 567BM BLOCK DIAGRAM B1 B2 B3 B4 B5 A2 A3 A4 A5 Features • Functionally and Pin Compatible with ON Semiconductor’s • • • • • • PACDN1408 ESD Protection Device 8 Transient Voltage Suppressors in a Single Package OptiguardTM Coated for Improved Reliability at Assembly In−system Electrostatic Discharge (ESD) Protection to ±25 kV Contact Discharge per IEC 61000−4−2 International Standard Compact Chip Scale Package (0.65 mm pitch) Format Saves Board Space and Eases Layout in Space Critical Applications Compared to Discrete Solutions and Traditional Wire Bonded Packages 10−bump CSP These Devices are Pb−Free and are RoHS Compliant Applications • • • • • • • • ESD Protection for Sensitive Electronic Equipment I/O Port, Keypad and Button Circuitry Protection for Portable Devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs © Semiconductor Components Industries, LLC, 2011 January, 2011 − Rev. 4 1 A1 CM1205−08CP MARKING DIAGRAM 120508 120508 = Specific Device Code ORDERING INFORMATION Device CM1205−08CP Package Shipping† CSP (Pb−Free) 3500/Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: CM1205/D CM1205 PACKAGE / PINOUT DIAGRAMS TOP VIEW (Bumps Down View) Orientation Marking + BOTTOM VIEW (Bumps Up View) 120508 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 CM1205−08 10−bump CSP Package SPECIFICATIONS Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Storage Temperature Range Rating Units −65 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 2. STANDARD OPERATING CONDITIONS Parameter Operating Temperature Range Rating Units −40 to +85 °C Table 3. ELECTRICAL OPERATING CHARACTERISTICS (Note 1) Symbol Parameter Conditions VREV Reverse Standoff Voltage IDIODE= 10 mA ILEAK Leakage Current VIN= 3.3 V DC VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD= 10mA In−system ESD Withstand Voltage a) Human Body Model, MIL−STD−883, Method 3015 b) Contact Discharge per IEC 61000−4−2 Level 4 Note 2 Clamping Voltage during ESD Discharge MIL−STD−883 (Method 3015), 8 kV Positive Transients Negative Transients Note 2 Channel Capacitance At 2.5 V DC, f = 1 MHz VESD VCL C Min Typ Max 6.0 5.6 −1.2 6.8 −0.8 Units V 100 nA 8.0 −0.4 V kV ±30 ±25 +12 −8 39 V 47 1. TA = 25 °C unless otherwise specified. GND in this document refers to the lower supply voltage. 2. ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. http://onsemi.com 2 pF CM1205 APPLICATION INFORMATION Refer to Application Note ”The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by ON Semiconductor. Table 4. PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter Value Pad Size on PCB 0.275 mm Pad Shape Round Pad Definition Non−Solder Mask defined pads Solder Mask Opening 0.350 mm Round Solder Stencil Thickness 0.125 − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330 mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance − Edge To Corner Ball ±50 mm Solder Ball Side Coplanarity ±20 mm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature 260°C ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ ÎÎÎÎÎ Non−Solder Mask Defined Pad 0.275 mm DIA. Solder Stencil Opening 0.330 mm DIA. Solder Mask Opening 0.325 mm DIA. Figure 1. Recommended Non−Solder Mask Defined Pad Illustration Figure 2. Lead−free (SnAgCu) Solder Ball Reflow Profile http://onsemi.com 3 CM1205 MECHANICAL SPECIFICATIONS The CM1205−08CP is offered in a 10−bump custom Chip Scale Package (CSP). Dimensions are presented below. Table 5. CSP TAPE AND REEL SPECIFICATIONS Pocket Size (mm) Tape Width Part Number Chip Size (mm) B0 X A0 X K0 W Reel Diameter Qty per Reel P0 P1 CM1205−08CP 3.104 X 1.154 X 0.682 3.28 X 1.32 X 0.81 8 mm 178 mm (7″) 3500 4 mm 4 mm Po Top Cover Tape Ao + Ko For Tape Feeder Reference Only Including Draft, Concerning around B. 10 Pitches Cumulative Tolerance On Tape ±0.2 mm Embossment Bo + P1 User Direction of Feed http://onsemi.com 4 + Center Lines of Cavity W CM1205 PACKAGE DIMENSIONS WLCSP10, 3.10x1.15 CASE 567BM−01 ISSUE O PIN A1 REFERENCE 2X 0.05 C 2X D ÈÈ ÈÈ A E 0.05 C DIM A A1 A2 b D E e TOP VIEW OptiGuard Option 0.05 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. B ÉÉÉÉÉÉÉÉ A2 RECOMMENDED SOLDERING FOOTPRINT* A A1 0.05 C NOTE 3 10X e b 0.05 C A B C SIDE VIEW A1 MILLIMETERS MIN MAX 0.60 0.75 0.23 0.29 0.40 REF 0.34 0.39 3.10 BSC 1.15 BSC 0.65 BSC SEATING PLANE e 0.65 PITCH B 0.03 C PACKAGE OUTLINE 10X 0.25 0.65 PITCH DIMENSIONS: MILLIMETERS A 1 2 3 4 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 5 BOTTOM VIEW OptiGuardt is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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