CM1420 D

CM1420, CM1422
LCD EMI Filter Array with
ESD Protection
Description
The CM1420 and CM1422 are EMI filter arrays with ESD
protection, which integrate six and eight Pi−filters (C−R−C),
respectively. The CM1420/22 has component values of 15 pF −
100 − 15 pF. These devices include ESD protection diodes on every
pin, which provide a very high level of protection for sensitive
electronic components that may be subjected to electrostatic discharge
(ESD). The ESD diodes connected to the filter ports safely dissipate
ESD strikes of ±15 kV, well beyond the maximum requirement of the
IEC 61000−4−2 international standard. Using the MIL−STD−883
(Method 3015) specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater than ±30 kV.
This device is particularly well suited for portable electronics (e.g.
wireless handsets, PDAs, notebook computers) because of its small
package format and easy−to−use pin assignments. In particular, the
CM1420/22 is ideal for EMI filtering and protecting data lines from
ESD for the LCD display in clamshell handsets.
The CM1420 and CM1422 incorporate OptiGuardt coating which
results in improved reliability at assembly. The CM1420 and CM1422
are available in space−saving, low−profile chip scale packages with
RoHS compliant lead−free finishing.
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WLCSP15
CP SUFFIX
CASE 567BS
WLCSP20
CP SUFFIX
CASE 567BZ
MARKING DIAGRAM
N203
N223
CM1420
15−Bump CSP Package
CM1422
20−Bump CSP Package
N203
N223
= CM1420−03CP
= CM1422−03CP
Features
• Functionally and Pin Compatible with CSPEMI606 (CM1420) and
•
•
•
•
•
•
•
•
•
CSPEMI608 (CM1422) Devices
OptiGuardtCoated for Improved Reliability at Assembly
Six and Eight Channels of EMI Filtering
±15 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
±30 kV ESD Protection on Each Channel (HBM)
Better than 30 dB of Attenuation at 1 GHz to 3 GHz
Chip Scale Package Features Extremely Low Lead Inductance for
Optimum Filter and ESD Performance
15−Bump, 2.960 mm x 1.330 mm Footprint Chip Scale Package
(CM1420)
20−Bump, 4.000 mm x 1.458 mm Footprint Chip Scale Package
(CM1422)
These Devices are Pb−Free and are RoHS Compliant
ORDERING INFORMATION
Device
Package
Shipping†
CM1420−03CP
CSP−15
(Pb−Free)
3500/Tape & Reel
CM1422−03CP
CSP−20
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Applications
•
•
•
•
•
•
LCD Data Lines in Clamshell Wireless Handsets
EMI Filtering & ESD Protection for High−Speed I/O Data Ports
Wireless Handsets / Cell Phones
Notebook Computers
PDAs / Handheld PCs
EMI Filtering for High−Speed Data Lines
© Semiconductor Components Industries, LLC, 2011
March, 2011 − Rev. 4
1
Publication Order Number:
CM1420/D
CM1420, CM1422
BLOCK DIAGRAM
100 FILTERn*
FILTERn*
15 pF
15 pF
GND
(Pins B1−Bn)
1 of n EMI Filtering + ESD Channels
(n = 6 for CM1420, 8 for CM1422)
*See Package/Pinout Diagrams for expanded pin information.
PACKAGE / PINOUT DIAGRAMS
Orientation
Marking
Top View
(Bumps Down View)
+
A
1
2
3
4
5
Bottom View
(Bumps Up View)
6
C1
N203
B
C3
B1
Orientation
Marking
C
C2
C4
C5
B2
C6
B3
A1
A1
A2
A3
A4
A5
A6
C2
C3
C4
C5
C6
C7
CM1420 CSP Package
Orientation
Marking
+
A
1
2
4
3
5
6
7
8
C1
N223
B
Orientation
Marking
C
B1
A1
A1
B2
A2
A3
B3
A4
A5
C8
B4
A6
A7
A8
CM1422 CSP Package
Table 1. PIN DESCRIPTIONS
CM1420
CM1422
CM1420
CM1422
Pin(s)
Pin(s)
Name
Pin(s)
Pin(s)
Name
A1
A1
FILTER1
Filter Channel 1
C1
C1
FILTER1
Filter Channel 1
A2
A2
FILTER2
Filter Channel 2
C2
C2
FILTER2
Filter Channel 2
A3
A4
A3
FILTER3
Filter Channel 3
C3
C3
FILTER3
Filter Channel 3
A4
FILTER4
Filter Channel 4
C4
C4
FILTER4
Filter Channel 4
A5
A5
FILTER5
Filter Channel 5
C5
C5
FILTER5
Filter Channel 5
A6
A6
FILTER6
Filter Channel 6
C6
C6
FILTER6
Filter Channel 6
−
A7
FILTER7
Filter Channel 7
−
C7
FILTER7
Filter Channel 7
−
A8
FILTER8
Filter Channel 8
−
C8
FILTER8
Filter Channel 8
B1−B3
B1−B4
GND
Device Ground
Description
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2
Description
CM1420, CM1422
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
−65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
500
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
−40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
R
Resistance
C
Capacitance
At 2.5 V DC, 1 MHz,
30 mV AC
VDIODE
Min
Typ
Max
80
100
120
12
15
18
pF
nA
Diode Standoff Voltage
IDIODE = 10 A
6.0
ILEAK
Diode Leakage Current (reverse bias)
VDIODE = 3.3 V
100
200
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
(Note 3)
6.8
−0.8
9.0
−0.4
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
(Note 2)
RDYN
Dynamic Resistance
Positive
Negative
fC
5.6
−1.5
R = 100 , C = 15 pF
V
V
kV
±30
±15
2.30
0.90
Cut−off Frequency
ZSOURCE = 50 , ZLOAD = 50 Units
120
MHz
1. TA = 25 °C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping
voltage is measured at Pin C1.
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3
CM1420, CM1422
PERFORMANCE INFORMATION
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B1)
Figure 2. Insertion Loss vs. Frequency (A2−C2 to GND B1)
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4
CM1420, CM1422
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 3. Insertion Loss vs. Frequency (A3−C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4−C4 to GND B2)
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5
CM1420, CM1422
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 5. Insertion Loss vs. Frequency (A5−C5 to GND B3)
Figure 6. Insertion Loss vs. Frequency (A6−C6 to GND B3)
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6
CM1420, CM1422
PERFORMANCE INFORMATION (Cont’d)
Typical Filter Performance (TA = 255C, DC Bias = 0 V, 50 W Environment)
Figure 7. Insertion Loss vs. Frequency
(A7−C7 to GND B4, CM1422 Only)
Figure 8. Insertion Loss vs. Frequency
(A8−C8 to GND B4, CM1422 Only)
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7
CM1420, CM1422
PERFORMANCE INFORMATION (Cont’d)
Figure 9. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5 VDC and 255C)
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8
CM1420, CM1422
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 m
Solder Ball Side Coplanarity
±20 m
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 10. Recommended Non−Solder Mask Defined Pad Illustration
Temperature (5C)
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 11. Lead−free (SnAgCu) Solder Ball Reflow Profile
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9
CM1420, CM1422
PACKAGE DIMENSIONS
WLCSP15, 2.96x1.33
CASE 567BS−01
ISSUE O
PIN A1
REFERENCE
2X
D
ÈÈ
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
B
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
A2
0.05 C
A
0.05 C
NOTE 3
A1
C
SIDE VIEW
SEATING
PLANE
eD/2
15X
eD
b
0.05 C A B
0.03 C
eE
C
B
A
1 2 3
4 5 6
7 8 9
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.87
0.44
15X
0.50
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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10
MILLIMETERS
MIN
MAX
0.65
0.56
0.21
0.27
0.40 REF
0.29
0.35
2.96 BSC
1.33 BSC
0.50 BSC
0.435 BSC
CM1420, CM1422
PACKAGE DIMENSIONS
WLCSP20, 4.00x1.46
CASE 567BZ−01
ISSUE O
PIN A1
REFERENCE
2X
D
ÈÈ
ÈÈ
A
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
A2
0.05 C
MILLIMETERS
MIN
MAX
0.56
0.65
0.21
0.27
0.40 REF
0.29
0.35
4.00 BSC
1.46 BSC
0.50 BSC
0.435 BSC
A
0.05 C
NOTE 3
A1
C
SIDE VIEW
SEATING
PLANE
eD/2
20X
eD
b
0.05 C A B
0.03 C
eE
C
B
A
1 2 3
4 5 6
7 8 9
10 11 12
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.87
0.44
20X
0.50
PITCH
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
OptiGuardt is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative
CM1420/D