9 SO T8 SOT89 plastic surface-mounted package; die pad for good heat transfer; 3 leads 8 February 2016 Package information 1. Package summary Terminal position code S (single) Package type descriptive code SOT89 Package type industry code SOT89 Package style descriptive code SOT (small outline transistor) Package style suffix code NA (not applicable) Package body material type P (plastic) JEDEC package outline code TO-243 JEITA package outline code SC-62 Mounting method type S (surface mount) Issue date 29-8-2006 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 4.4 - 4.5 4.6 mm E package width 2.4 - 2.5 2.6 mm A seated height 1.4 - 1.5 1.6 mm e nominal pitch - - 1.5 - mm n2 actual quantity of termination - - 3 - SOT89 NXP Semiconductors plastic surface-mounted package; die pad for good heat transfer; 3 leads 2. Package outline Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 B D A bp3 E 1 2 HE Lp 3 c bp2 w M B bp1 e1 e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp1 bp2 bp3 c D E mm 1.6 1.4 0.48 0.35 0.53 0.40 1.8 1.4 0.44 0.23 4.6 4.4 2.6 2.4 OUTLINE VERSION e 3.0 e1 HE Lp w 1.5 4.25 3.75 1.2 0.8 0.13 REFERENCES IEC SOT89 JEDEC JEITA TO-243 SC-62 EUROPEAN PROJECTION ISSUE DATE 06-03-16 06-08-29 Fig. 1. Package outline SOT89 SOT89 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT89 NXP Semiconductors plastic surface-mounted package; die pad for good heat transfer; 3 leads 3. Soldering 4.75 2.25 2 1.9 1.2 0.2 0.85 solder lands 1.7 1.2 4.6 solder resist 0.5 1 (3×) 4.85 occupied area 1.1 (2×) 1.5 solder paste Dimensions in mm 1.5 0.6 (3×) 0.7 (3×) 3.95 sot089_fr Fig. 2. Reflow soldering footprint for SOT89 6.6 2.4 3.5 solder lands 7.6 0.5 solder resist occupied area 1.8 (2×) Dimensions in mm preferred transport direction during soldering 1.9 1.5 (2×) 1.9 0.7 5.3 sot089_fw Fig. 3. Wave soldering footprint for SOT89 SOT89 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT89 NXP Semiconductors plastic surface-mounted package; die pad for good heat transfer; 3 leads 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT89 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT89 NXP Semiconductors plastic surface-mounted package; die pad for good heat transfer; 3 leads 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT89 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5