SOT363 plastic surface-mounted package; 6 leads 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code TSSOP6 Package type industry code TSSOP6 Package style descriptive code SOT (small outline transistor) Package style suffix code NA (not applicable) Package body material type P (plastic) JEITA package outline code SC-88; SC-70-6 Mounting method type S (surface mount) Issue date 16-3-2006 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 1.8 - 2 2.2 mm E package width 1.15 - 1.25 1.35 mm A seated height 0.8 - 0.95 1.1 mm e nominal pitch - - [tbd] - mm n2 actual quantity of termination - - 6 - SOT363 NXP Semiconductors plastic surface-mounted package; 6 leads 2. Package outline Plastic surface-mounted package; 6 leads SOT363 D B E y A X HE 6 5 v M A 4 Q pin 1 index A 1 2 e1 A1 3 bp c Lp w M B e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 max bp c D E e e1 HE Lp Q v w y mm 1.1 0.8 0.1 0.30 0.20 0.25 0.10 2.2 1.8 1.35 1.15 1.3 0.65 2.2 2.0 0.45 0.15 0.25 0.15 0.2 0.2 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT363 JEITA EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 SC-88 Fig. 1. Package outline TSSOP6 (SOT363) SOT363 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT363 NXP Semiconductors plastic surface-mounted package; 6 leads 3. Soldering 2.65 solder lands 2.35 1.5 0.4 (2×) 0.6 0.5 (4×) (4×) solder resist solder paste 0.5 (4×) 0.6 (2×) occupied area 0.6 (4×) Dimensions in mm 1.8 sot363_fr Fig. 2. Reflow soldering footprint for TSSOP6 (SOT363) 1.5 solder lands 0.3 2.5 4.5 solder resist occupied area 1.5 Dimensions in mm 1.3 preferred transport direction during soldering 1.3 2.45 5.3 sot363_fw Fig. 3. Wave soldering footprint for TSSOP6 (SOT363) SOT363 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT363 NXP Semiconductors plastic surface-mounted package; 6 leads 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT363 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT363 NXP Semiconductors plastic surface-mounted package; 6 leads 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT363 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5