TS32101 Datasheet

TS32101
High Efficiency DC/DC
Boost Converter for USB, 2Mhz
TRIUNE PRODUCTS
Features
Description
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The TS32101 is a DC/DC synchronous switching Boost
Converter with fully integrated power switches, internal PWM
current mode compensation, and full fault protection. The
switching frequency of 2 MHz was chosen to enable the use
of small external components for portable applications. The
device also has a constant output current limit loop to provide
a sharp output current limit that doesn’t move significantly
with input voltage and output voltage.
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•
•
•
•
•
•
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Output up to 1.5A at 5.0V with 1.8V input
Wide input voltage range: 1.75V – 5.5V
Output current up to 2A
Robust operation during hot-load disconnect and hotload disable
Adjustable output voltage up to 5.5V
Adjustable output current limit
Includes full output isolation/reverse current blocking
when disabled
2 MHz ± 10% fixed switching frequency
Low power mode
High efficiency – up to 95%
Full protection for over-current, over-temperature, VOUT
over-voltage, and VIN under-voltage
Power good/fault indication
Summary Specifications
•
•
Applications
•
•
•
•
USB power
Portable products
Wireless remote sensors
Emergency chargers
Ambient operating temperature -40C to 85C
Packaged in a 16pin QFN (3x3)
Typical Application Circuit
VSW
VIN
TS32101
CIN
ISEN
LOUT
1 uH
RSENSE
VOUT2
RTOP
COUT
2 x 22 uF
GND
CFF
COUT2
RBOT
EN
VOUT
FB
VDD
RPULLUP
PG
(optional)
PGND
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Pinout
ISEN
VOUT
PGND
2
VSW
ISEN
PGND
1
ISEN
ISEN
16
15
14
13
12
VSW
11
VIN
3
10
NC
4
9
NC
TS32101
5
6
7
8
FB
GND
EN
PG
Pin Description
Pin #
Pin Name
Pin Function
Description
1
ISEN
Boot Power Stage Output
Connects to current sense resistor becoming current sense
(Pin 1,2,3,16 are internally connected)
2
ISEN
Boot Power Stage Output
Connects to current sense resistor becoming current sense
3
ISEN
Boot Power Stage Output
Connects to current sense resistor becoming current sense
4
VOUT
Output Voltage
Connect to the other terminal of current sense resistor, which is the
output of the boost regulator
5
FB
Output Voltage Feedback
Feedback point for output voltage
6
GND
GND
Primary ground for the majority of the device except the low-side power FET
7
EN
Enable Input
Tie EN pin high to enable device
8
PG
PG Output
Open-drain output for Power Good
9
N/C
Not Used
Connect to GND
10
N/C
Not Used
Connect to GND
11
VIN
Input Voltage
Connect to input supply and input capacitor.
12
VSW
Switching Voltage Node
Connected to 1.0uH (typical) inductor
13
PGND
Power GND
GND supply for internal low-side FET
14
VSW
Switching Voltage Node
Connected to 1.0uH (typical) inductor
15
PGND
Power GND
GND supply for internal low-side FET
16
ISEN
Boot Power Stage Output
Connects to current sense resistor becoming current sense
TS32101
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Functional Block Diagram
EN
VIN
CIN
PG
VIN
VIN Under
Voltage
Protection
VSW
LOUT
VOUT Under
Voltage
Detection
Current Limit
Bulk
Control
Σ
Vref
Gate
Drive
Compensation
Network
FB
RBOT
Comparator
VOUT
RSENSE
Gate
Drive
Gate Drive
Control
Error Amp
ISEN
COUT2
Ramp
CFF
Ramp
Generator
VOUT
RTOP
Oscillator
COUT
MONITOR
&
CONTROL
1.8 – 3.5V
VIN
Comparator
Iref
Compensation
Network
Ramp
GND
PGND
VOUT
Figure 1: TS32101 Block Diagram
TS32101
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Absolute Maximum Ratings
Over operating free–air temperature range unless otherwise noted(1, 2)
Parameter
Value
Unit
VIN
-0.3 to 6.0
V
EN, PG, FB
-0.3 to 5.5
V
-1 to 6.0
V
-0.3 to 6.0
V
VSW
VOUT, ISEN
Continuous total power dissipation
See Dissipation Rating Table
Electrostatic Discharge – Human Body Model
Electrostatic Discharge – Charged Device Model
±2k
V
+/-500
V
260
°C
Lead Temperature (soldering, 10 seconds)
Notes:
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
Thermal Characteristics
Symbol
Parameter
Value
Units
θJA
Thermal Resistance Junction to Air (Note 1)
50
°C/W
TSTG
Storage Temperature Range
-65 to 150
°C
Operating Ambient Temperature Range
-40 to 85
°C
Maximum Junction Temperature
150
°C
Operating Junction Temperature Range
-40 to 125
°C
TJ
TJ MAX
TJ
Note 1: Assumes TQFN-16 in 1 in2 area of 2 oz copper and 25C ambient temperature.
Recommended Operating Conditions
Symbol
Parameter
Min
Typ
Max
Unit
VIN
Input Operating Voltage
1.8
2.4
5.5
V
LOUT
Output Filter Inductor Typical Value (Note 1)
COUT
Output Filter Capacitor Typical Value (Note 2)
33
47
COUT2
VOUT2 Filter Capacitor Typical Value (Note 2)
0.1
1
uF
CBYPASS
Input Supply Bypass Capacitor Typical Value (Note 3)
8
10
uF
1.0
uH
100
uF
RTOP
Feedback Divider Resistor Typical Value (Note 4)
1000
kΩ
RBOT
Feedback Divider Resistor Typical Value (Note 4)
330
kΩ
Note 1: For best performance, an inductor with a saturation current rating higher than the maximum input current requirement plus the
inductor current ripple. See Inductor Selection section to determine input current and ripple current.
Note 2: For best performance, a low ESR ceramic capacitor should be used.
Note 3: For best performance, a low ESR ceramic capacitor should be used. If CBYPASS is not a low ESR ceramic capacitor, a 0.1uF ceramic
capacitor should be added in parallel to CBYPASS.
Note 4: Values shown for 5V output.
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Characteristics
Electrical Characteristics, TA = -40C to 85C, VIN =2.4V (unless otherwise noted)
Symbol
Parameter
Condition
Min
Typ
Max
Unit
5.5
V
10
uA
VIN Supply Voltage
VIN
Voltage Input
Quiescent current
Standby Mode
Operating Low Power Mode Input Current
IIN-STBY
IIN-LPM
1.75
EN = Low, VOUT=0V
5
Iout = 0 uA
50
uA
VOUT Supply Current
IOUT
Quiescent current
Normal Mode (Note 1)
EN = High, Switching
3
mA
EN = High, Non-switching
500
uA
IOUT-STBY
Quiescent current, stby
EN = Low, Vout=5V
25
uA
Output current
EN = High, VIN > 0.7 * Vout
2
A
Increasing Vin
1.5
V
150
mV
IOUT
VIN Under Voltage Lockout (UVLO)
VIN_UV
VIN Under Voltage Detect Threshold
VIN-UV_HYST
VIN Under Voltage Detect Hysteresis
OSC
fOSC
Oscillator Frequency
1.8
2
2.2
MHz
PG Open Drain Output
VPG_THRESH
Power Good Voltage Detect Threshold
VPG_HYST
Power Good Voltage Detect Hysteresis
Vout Increasing
IOH-PG
High-Level Output Leakage
VPG = 5.0 V
VOL-PG
Low-Level Output Voltage
IPG = -1mA
90
% VOUT
1
% VOUT
0.1
uA
0.4
V
EN Input
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
VHYST
Input Hysteresis
IIN-EN
Input Leakage
1.5
V
0.6
V
150
mV
VEN=VIN
0.1
uA
VEN=0V
0.1
uA
170
C
10
C
Thermal Shutdown
TSD
TSDHYST
Thermal Shutdown Junction
Temperature
150
TSD Hysteresis
Note 1: large percentage of supply current due to power FET gate switching losses.
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Boost Converter Characteristics
Electrical Characteristics, TA = -40C to 85C, VIN = 2.4V, VOUT = 5.0V (unless otherwise noted)
Symbol
Parameter
Condition
Min
Typ
Max
Unit
5.5
V
1.225
V
Boost Regulator: L=1.0uH and C=44uF
VOUT
Output Voltage
3.0
VFB
Feedback Voltage
1.175
1.2
High Side Switch On Resistance
ISW = -1A, TJ=25C
120
mΩ
Low Side Switch On Resistance
ISW = -1A, TJ=25C
50
mΩ
IOCD
Over Current Detect
LS switch current
VISEN
Output Current Threshold Voltage
RDSON
VOUT-OV
101
Max Duty Cycle
Adjustable Output Voltage
The TS32101 is a fully-integrated, low-voltage synchronous
boost converter IC based on a highly-efficient switching
topology. It is optimized to be powered from NiMH or LiIon batteries and includes features to make it suitable for
powering portable equipment as an emergency power/
charging source. A 2MHz internal switching frequency yields a
good balance between efficiency and the ability to use small,
low-cost LC filter components.
Power Good
Internal Protection Details
Internal Current Limit
The current through the low side switch is sensed on a cycle by
cycle basis and if current limit is reached, it will abbreviate the
cycle. Current limit is always active when the boost converter
is enabled. Adjustable Output Current Limit
The TS32101 has an adjustable output current limit that
is implemented by sensing the voltage across an external
resistor placed in series with the output. The voltage across
this resistor is continuously monitored with no output current
limit occurring until the output current is large enough to
produce a voltage drop of 23mV across the sense resistor. If
the voltage drop across the sense resistor reaches 23mV the
TS32101 will reduce the duty cycle to limit the output current
and result in a constant output current limit. This feature can
be disabled by connecting the ISEN to VOUT and removal of
the sense resistor.
Rev 2.1
102
85
Functional Description
TS32101
Final Datasheet
January 26, 2016
A
23
VOUT Over Voltage Threshold
DUTYMAX
3
mV
103
%VOUT
%
The TS32101 has an adjustable output voltage selected by an
external resistor divider in the feedback loop. To change the
output voltage, replace resistors RTOP and RBOT with values
from the following equation: VOUT = 1.2 * (1 + RTOP / RBOT )
The PG signal provides the ability to monitor fault conditions
and power supply sequencing. The PG output is valid high
when the TS32101 is enabled, the input voltage is above the
VIN under-voltage threshold, the output voltage is above
90% of the desired value, and the device is not in thermal
shutdown.
The PG output can be utilized for power supply sequencing. When the device is operating normally and the output voltage
is above 90% of the desired value, the PG output will be high. A 100us deglitch timer is used to insure that the PG signal does
not respond to noise or transients.
Thermal Shutdown
If the temperature of the die exceeds 150C (typical), the VSW
outputs will tri-state to protect the device from damage. The
PG and all other protection circuitry will stay active to inform
the system of the failure mode. Once the device cools to
140C (typical), the device will attempt to start up again. If
the device reaches 150C, the shutdown/restart sequence will
repeat. The PG output will be pulled low in this condition.
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Output Over Voltage Protection
The TS32101 has an output over voltage protection circuit
which prevents the device from reaching a dangerously
high voltage under sudden light load conditions. The typical
Overvoltage detection threshold is 102% of Vout.
Output Voltage Disable
When the enable pin of the TS32101 is low, not only is
switching disabled, but the output is isolated from the input.
This functionality is maintained whether the output node is at
a higher or a lower potential than the input voltage.
Low Power Mode
When the output current is low the TS32101 will detect
and automatically enter low power mode. In low power
mode, switching stops when the output is slightly above
the regulation point and the device enters a sleep state. The
sleep state continues until the output drops slightly below the
regulation point. At this point, switching will resume and if the
load current is increased enough to prevent the output from
going above the regulation point, low power mode is exited.
External Components
The internal compensation is optimized for a 47uF output
capacitor and a 1.0uH inductor. To keep the output ripple
low, a low ESR (less than 35mOhm) ceramic capacitor is
recommended. TS32101
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Functional
Package
Mechanical
Description
Drawings
(continued)
(all dimensions in mm)
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Units
Dimension Limits
N
e
A
A1
A3
D
E2
E
D2
b
L
K
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TS32101
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January 26, 2016
Rev 2.1
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MIN
0.80
0.00
1.55
1.55
0.20
0.20
0.20
MILLIMETERS
NOM
16
0.50 BSC
0.90
0.02
0.20 REF
3.00 BSC
1.70
3.00 BSC
1.70
0.25
0.30
-
MAX
1.00
0.05
1.80
1.80
0.30
0.40
-
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TS32101
Version 2.0
RecommendedPCB
PCBLAND
LandPATTERN
Pattern
RECOMMEDED
Si l k Sc re e n
R ECO MMEN DED
LA ND PATTER N
DIMENSIONS IN MILLIMETERS Units MILLIMETERS Dimension Limits NOM MAX Units MIN MILLIMETERS
Contact Pitch 0.50 BSC Dimension E Limits
MIN
NOM
-­‐ -­‐ 1.70 Contact Pitch Optional Center Pad Width E W2 0.50 BSC
Optional Center
Pad
Width
W2
Optional Center Pad Length T2 -­‐ -­‐ 1.70 Optional Center
Pad Length
T2C1 - 3.00 Contact Pad Spacing -­‐ -­‐ Contact Pad Spacing
C1C2 - 3.00 Contact Pad Spacing -­‐ -­‐ 3.00
Contact Pad Spacing
C2
Contact Pad Width (X16) X1 -­‐ -­‐ 0.35 3.00
Contact Pad Width
(X16)
X1Y1 - -­‐ Contact Pad Length (X16) -­‐ 0.65 Contact Pad Length (X16)
Y1
Distance Between Pads G 0.15 -­‐ -­‐ Distance Between Pads
G
0.15
Notes:
Notes: Dimensions and tolerances per ASME Y14.5M.
Dimensions and tolerances per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact values shown without tolerances.
Basic usually
Dimension. heoretically exact values REF: Reference BSC: Dimension,
withoutTtolerance,
for information
only.shown without tolerances. REF: Reference Dimension, usually without tolerance, for information only. DIMENSIONS IN MILLIMETERS
MAX
1.70
1.70
0.35
0.65
-
PACAKGING INFORMATION
Pb-Free (RoHS): The TS30011/12/13 devices are fully compliant for all materials covered by European Union Directive 2002/95/EC, and meet all IPC1752 Level 3 materials declaration requirements.
MSL, Peak Temp: The TS30011/12/13 family has a Moisture Sensitivity Level (MSL) 1 rating per JEDEC J-STD-020D. These devices also have a Peak
Profile Solder Temperature (Tp) of 260°C.
Specifications subject to change
TS32101
Final Datasheet
January 26, 2016
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Copyright © 2012, Triune Systems, LLC
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Functional
Description (continued)
Packaging Information
Pb-Free (RoHS): The TS32101 devices are fully compliant for all materials covered by European Union Directive 2002/95/EC, and
meet all IPC-1752 Level 3 materials declaration requirements.
MSL, Peak Temp: The TS32101 family has a Moisture Sensitivity Level (MSL) 1 rating per JEDEC J-STD-020D. These devices also
have a Peak Profile Solder Temperature (Tp) of 260°C.
Ordering Information
TS32101-QFNR
Application Using A Multi-Layer PCB
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be followed
when laying out this part on the PCB.
The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.
Solder Pad (Land Pattern)
Package Thermal Pad
Thermal Via's
Package Outline
Package and PCB Land Configuration
For a Multi-Layer PCB
JEDEC standard FR4 PCB Cross-section:
(square)
Package Solder Pad
1.5038 - 1.5748 mm
Component Trace
(2oz Cu)
2 Plane
4 Plane
1.5748mm
Component Traces
Thermal Via
1.0142 - 1.0502 mm
Ground Plane
(1oz Cu)
Thermal Isolation
Power plane only
0.5246 - 0.5606 mm
Power Plane
(1oz Cu)
Package Solder Pad
(bottom trace)
0.0 - 0.071 mm Board Base
& Bottom Pad
Multi-Layer Board (Cross-sectional View)
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Mold compound
Die
Epoxy Die attach
Exposed pad
Solder
5% - 10% Cu coverage
Single Layer, 2oz Cu
Ground Layer, 1oz Cu
Signal Layer, 1oz Cu
Thermal Vias with Cu plating
90% Cu coverage
20% Cu coverage
Bottom Layer, 2oz Cu
Note: NOT to Scale
In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to
the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias,
thickness of copper, etc.
The above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. Each
application will have different requirements and limitations and therefore the user should use sufficient copper to dissipate the
power in the system. The output current rating for the linear regulators may have to be de-rated for ambient temperatures above
85C. The de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in
the application.
Application Using A Single Layer PCB
Use as much Copper Area
as possible for heat spread
Package Thermal Pad
Package Outline
Layout recommendations for a Single Layer PCB: utilize as much Copper Area for Power Management. In a single layer board
application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method
(solder paste or thermal conductive epoxy).
In both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat.
IMPORTANT:
If the attachment method is NOT implemented correctly, the functionality of the product is not guaranteed. Power dissipation
capability will be adversely affected if the device is incorrectly mounted onto the circuit board.
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IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a
guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time
of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY, LOSS OF LIFE
OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE UNDERTAKEN
SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall
indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney
fees which could arise.
The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and
names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document
without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any
particular purpose. All rights reserved.
© Semtech 2015
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
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Final Datasheet
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