ETC TS30012

TS30011/12/13
Version 1.6
High Efficiency 1A/2A/3A Current-Mode Synchronous Buck
DC/DC Converter, 1MHz
DESCRIPTION
FEATURES
The TS30011 (1A), TS30012 (2A) and TS30013
(3A) are DC/DC synchronous switching regulator
with fully integrated power switches, internal
compensation, and full fault protection.
The
switching frequency of 1MHz enables the use of
small filter components resulting in minimal board
space and reduced BOM costs.

The TS30011/12/13 utilizes current mode feedback
in normal regulation PWM mode. When the
regulator is placed in standby (EN is low), the device
draws less than 10uA quiescent current.






The TS30011/12/13 integrates a wide range of
protection circuitry including input supply undervoltage lockout, output voltage soft start, current
limit, and thermal shutdown.




The TS30011/12/13 includes supervisory reporting
through the PG (Power Good) open drain output to
interface other components in the system.


APPLICATIONS



Fixed output voltage choices: 1.5V, 1.8V, 2.5V,
3.3V, and 5V with +/- 2% output tolerance
Adjustable version output voltage range: 0.9V to
5.5V with +/- 1.5% reference
Wide input voltage range
TS30011/12: 4.5V to 24V (26.4V Abs Max)
TS30013: 4.5V to 18V (20V Abs Max)
1MHz +/- 10% fixed switching frequency
Continuous output current: 1A (TS30011), 2A
(TS30012) and 3A (TS30013)
High efficiency – up to 95%
Current mode PWM control with PFM mode for
improved light load efficiency
Voltage supervisor for VOUT reported at the PG pin
Input supply under voltage lockout
Soft start for controlled startup with no overshoot
Full protection for over-current, over-temperature,
and VOUT over-voltage
Less than 10uA in standby mode
Low external component count
SUMMARY SPECIFICATION
On-card switching regulators
Set-top box, DVD, LCD, LED supply
Industrial power supplies


Junction operating temperature -40 °C to 125 °C
Packaged in a 16pin QFN (3x3)
TYPICAL APPLICATIONS
Fixed Output
Adjustable Output
BST
Specifications subject to change
BST
VOUT
VSW
LOUT
RTOP
COUT
RBOT
FB
VOUT
10 kohm
(optional)
PG
EN
PG
EN
WWW.TRIUNESYSTEMS.COM
-1-
PGND
TS30011/12/13
VCC
GND
EN
GND
EN
TS30011/12/13
CBYPASS
VCC
CBST
VCC
PGND
VCC
VOUT
VSW
FB
VOUT
10 kohm
(optional)
PG
PG
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
PINOUT
VSW
PGND
PGND
VSW
PIN 1
VSW
VSW
VCC
VCC
TS30011/12/13
VCC
BST
GND
EN
PG
NC
NC
FB
Figure 1: 16 Lead 3x3 QFN, Top View
PIN DESCRIPTION FOR 16 LEAD 3X3 QFN
Pin Symbol
VSW
Pin #
1
Function
Switching Voltage Node
Description
Connected to 4.7uH (typical) inductor
VCC
2
Input Voltage
Input voltage
VCC
3
Input Voltage
Input voltage
GND
4
GND
Primary ground for the majority of the device except
the low-side power FET
FB
5
Feedback Input
Regulator FB Voltage. Connects to VOUT for fixed mode
and the output resistor divider for adjustable mode
NC
6
No Connect
Not Connected
NC
7
No Connect
Not Connected
PG
8
Power Good Output
Open-drain output
EN
9
Enable Input
Above 2.2V the device is enabled. GND the pin to put
device in standby mode. Includes internal pull-up
BST
10
Bootstrap Capacitor
Bootstrap capacitor for the high-side FET gate driver.
22nF ceramic capacitor from BST pin to VSW pin
VCC
11
Input Voltage
Input Voltage
VSW
12
Switching Voltage Node
Connected to 4.7uH (typical) inductor
VSW
13
Switching Voltage Node
Connected to 4.7uH (typical) inductor
PGND
14
Power GND
GND supply for internal low-side FET/integrated diode
PGND
15
Power GND
GND supply for internal low-side FET/integrated diode
VSW
16
Switching Voltage Node
Connected to 4.7uH (typical) inductor
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
-2-
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
FUNCTIONAL BLOCK DIAGRAM
PG
EN
VCC
4.2V
VCC
VIN
VCC
Under Voltage
Protection
MONITOR
&
CONTROL
Over & Under
Voltage
Protection
Oscillator
FB
Bootstrap
Voltage
Thermal
Protection
Ramp
Generator
Vref
&
Softstart
CBYPASS
VCC
BST
Over Current
Protection
VCC

CBST
Gate
Drive
Gate Drive
Control
VSW
LOUT
VOUT
COUT
Comparator
Gate
Drive
Error Amp
PGND
Vref
Compensation
Network
RTOP
FB
PFM Mode
Comparator
RBOT
GND
Figure 2: TS30011/12/13 Block Diagram
PG
VOUT-UV
EN
Filter
Filter
ENABLE
REGULATOR
Internal
POR
Filter
VCC-UV
Filter
TSD
Filter
VOUT-OV
Filter
IOCD
OCD_Filter
TRISTATE
VSW OUTPUT
Figure 3: Monitor & Control Logic Functionality
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
-3-
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
ABSOLUTE MAXIMUM RATINGS
Over operating free–air temperature range unless otherwise noted(1, 2)
Parameter
Value
Unit
VCC
-0.3 to 26.4
(-0.3 to 20 for TS30013)
V
BST
-0.3 to (VCC+6)
V
VSW
-1 to 26.4
(-1 to 20 for TS30013)
V
-0.3 to 6
V
Electrostatic Discharge – Human Body Model
+/-2k
V
Electrostatic Discharge – Charge Device Model
+/-500
V
260
C
EN, PG,FB
Lead Temperature (soldering, 10 seconds)
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional
operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
THERMAL CHARACTERISTICS
Symbol
Parameter
Value
Unit
JA
Thermal Resistance Junction to Air (Note 1)
34.5
°C/W
JC
Thermal Resistance Junction to Case (Note 1)
2.5
°C/W
TSTG
Storage Temperature Range
-65 to 150
°C
TJ MAX
Maximum Junction Temperature
150
°C
TJ
Operating Junction Temperature Range
-40 to 125
°C
Note 1: Assumes 16LD 3x3 QFN with hi-K JEDEC board and 13.5 inch2 of 1 oz Cu and 4 thermal vias connected to PAD
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Typ
Max
Unit
VCC
Input Operating Voltage
4.5
12
24
(18 for TS30013)
V
CBST
Bootstrap Capacitor
17.6
22
26.4
nF
LOUT
Output Filter Inductor Typical Value (Note 1)
3.76
4.7
5.64
uH
COUT
Output Filter Capacitor Typical Value (Note 2)
33
44 (2 x 22)
COUT-ESR
Output Filter Capacitor ESR
2
CBYPASS
Input Supply Bypass Capacitor Typical Value (Note 3)
8
uF
100
10
m
uF
Note 1: For best performance, an inductor with a saturation current rating higher than the maximum VOUT load requirement plus the inductor current ripple.
Note 2: For best performance, a low ESR ceramic capacitor should be used.
Note 3: For best performance, a low ESR ceramic capacitor should be used. If CBYPASS is not a low ESR ceramic capacitor, a 0.1uF ceramic capacitor should be
added in parallel to CBYPASS.
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
-4-
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
ELECTRICAL CHARACTERISTICS
Electrical Characteristics, TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
Symbol
Parameter
Condition
VCC Supply Voltage
VCC
Input Supply Voltage
Quiescent current
Normal Mode
Quiescent current Normal
ICC-NOSWITCH
Mode – Non-switching
Quiescent current
ICC-STBY
Standby Mode
VCC Under Voltage Lockout
Input Supply Under Voltage
VCC-UV
Threshold
Input Supply Under Voltage
VCC-UV_HYST
Threshold Hysteresis
OSC
FOSC
Oscillator Frequency
PG Open Drain Output
TPG
PG Release Timer
IOH-PG
High-Level Output Leakage
VOL-PG
Low-Level Output Voltage
EN Input Voltage Thresholds
VIH-EN
High Level Input Voltage
VIL-EN
Low Level Input Voltage
VHYST-EN
Input Hysteresis
ICC-NORM
IIN-EN
Input Leakage
Thermal Shutdown
Thermal Shutdown Junction
TSD
Temperature
TSDHYST
TSD Hysteresis
Specifications subject to change
Min
Typ
4.5
Max
Unit
24
(18 for
TS30013)
V
VCC = 12V, ILOAD = 0A
5.2
mA
VCC=12V, ILOAD=0A, Non-switching
2.3
mA
VCC = 12V, EN = 0V
5
10
uA
VCC Increasing
4.3
4.5
V
650
0.9
1
mV
1.1
ms
10
0.5
VPG = 5V
IPG = -0.3mA
0.01
2.2
Note: not tested in production
Note: not tested in production
WWW.TRIUNESYSTEMS.COM
-5-
150
uA
V
480
3.5
-1.5
V
V
mV
uA
uA
170
°C
10
°C
0.8
VEN=5V
VEN=0V
MHz
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
REGULATOR CHARACTERISTICS
Electrical Characteristics, TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
Symbol
Parameter
Condition
Switch Mode Regulator: L=4.7uH and C=2 x 22uF
VOUT-PWM
Output Voltage Tolerance in PWM
ILOAD =1A
Mode
VOUT-PFM
Output Voltage Tolerance in PFM
ILOAD = 0A
Mode
High Side Switch On Resistance
IVSW = -1A (Note 1)
RDSON
Low Side Switch On Resistance
IVSW = 1A (Note 1)
TS30013 (Note 4)
IOUT
Output Current
TS30012 (Note 4)
IOCD
FBTH
Over Current Detect
FBTH-TOL
TSS
Feedback Reference
(Adjustable Mode)
Feedback Reference Tolerance
Soft start Ramp Time
FBTH-PFM
PFM Mode FB Comparator Threshold
VOUT-UV
VOUT Under Voltage Threshold
VOUT-UV_HYST
VOUT Under Voltage Hysteresis
VOUT-OV
VOUT Over Voltage Threshold
VOUT-OV_HYST
VOUT Over Voltage Hysteresis
DUTYMAX
Max Duty Cycle
Note 1:
Note 2:
Note 3:
Note 4:
TS30011
HS switch current
TS30013
HS switch current
TS30012
HS switch current
TS30011
Min
VOUT –
2%
VOUT –
1%
Typ
VOUT
VOUT +
1%
180
120
Max
VOUT +
2%
VOUT +
3.5%
Unit
V
V
3
mΩ
mΩ
A
2
1
A
A
3.4
3.8
4.4
A
2.4
2.8
3.4
A
1.4
1.8
2.4
A
(Note 3)
0.886
0.9
0.914
V
(Note 3)
-1.5
1.5
%
ms
4
91%
VOUT
(Note 2)
95%
VOUT +
1%
93%
VOUT
1.5%
VOUT
103%
VOUT
1%
VOUT
97%
V
95%
VOUT
99%
RDSON is characterized at 1A and tested at lower current in production.
Regulator VSW pin is forced off for 240ns every 8 cycles to ensure the BST cap is replenished.
For the adjustable version, the ratio of VCC/Vout cannot exceed 16.
Based on Over Current Detect testing
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
-6-
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
FUNCTIONAL DESCRIPTION
The TS30011/12/13 current-mode synchronous step-down power supply product is ideal for use in the commercial, industrial,
and automotive market segments. It includes flexibility to be used for a wide range of output voltages and is optimized for high
efficiency power conversion with low RDSON integrated synchronous switches. A 1MHz internal switching frequency facilitates
low cost LC filter combinations. Additionally, the fixed output versions enable a minimum external component count to provide
a complete regulation solution with only 4 external components: an input bypass capacitor, an inductor, an output capacitor,
and the bootstrap capacitor. The regulator automatically transitions between PFM and PWM mode to maximize efficiency for
the load demand.
The TS30011/12/13 was designed to provide these system benefits:
 Reduced board real estate
 Lower system cost
o Lower cost inductor
o Low external parts count
 Ease of design
o Bill of Materials and suggested board layout provided
o Power Good output
o Integrated compensation network
o Wide input voltage range
 Robust solution
o Over current, over voltage and over temperature protection
DETAILED PIN DESCRIPTION
Unregulated input, VCC
This terminal is the unregulated input voltage source for the IC. It is recommended that a 10uF bypass capacitor be placed
close to the device for best performance. Since this is the main supply for the IC, good layout practices need to be followed for
this connection.
Bootstrap control, BST
This terminal will provide the bootstrap voltage required for the upper internal NMOS switch of the buck regulator. An external
ceramic capacitor placed between the BST input terminal and the VSW pin will provide the necessary voltage for the upper
switch. In normal operation the capacitor is re-charged on every low side synchronous switching action. In the case of where
the switch mode approaches 100% duty cycle for the high side FET, the device will automatically reduce the duty cycle switch
to a minimum off time on every 8th cycle to allow this capacitor to re-charge.
Sense feedback, FB
This is the input terminal for the output voltage feedback.
For the fixed mode versions, this should be hooked directly to VOUT. The connection on the PCB should be kept as short as
possible, and should be made as close as possible to the capacitor. The trace should not be shared with any other connection.
(Figure 23)
For adjustable mode versions, this should be connected to the external resistor divider. To choose the resistors, use the
following equation:
VOUT = 0.9 (1 + RTOP/RBOT)
The input to the FB pin is high impedance, and input current should be less than 100nA. As a result, good layout practices are
required for the feedback resistors and feedback traces. When using the adjustable version, the feedback trace should be kept
as short as possible and minimum width to reduce stray capacitance and to reduce the injection of noise.
For the adjustable version, the ratio of VCC/Vout cannot exceed 16.
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
-7-
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
Switching output, VSW
This is the switching node of the regulator. It should be connected directly to the 4.7uH inductor with a wide, short trace and to
one end of the Bootstrap capacitor. It is switching between VCC and PGND at the switching frequency.
Ground, GND
This ground is used for the majority of the device including the analog reference, control loop, and other circuits.
Power Ground, PGND
This is a separate ground connection used for the low side synchronous switch to isolate switching noise from the rest of the
device. (Figure 23)
Enable, high-voltage, EN
This is the input terminal to activate the regulator. The input threshold is TTL/CMOS compatible. It also has an internal pullup to ensure a stable state if the pin is disconnected.
Power Good Output, PG
This is an open drain, active low output. The switched mode output voltage is monitored and the PG line will remain low until
the output voltage reaches the VOUT-UV threshold. Once the internal comparator detects the output voltage is above the desired
threshold, an internal delay timer is activated and the PG line is de-asserted to high once this delay timer expires. In the event
the output voltage decreases below VOUT-UV, the PG line will be asserted low and remain low until the output rises above VOUT-UV
and the delay timer times out. See Figure 2 for the circuit schematic for the PG signal.
INTERNAL PROTECTION DETAILS
Internal Current Limit
The current through the high side FET is sensed on a cycle by cycle basis and if current limit is reached, it will abbreviate the
cycle. In addition, the device senses the FB pin to identify hard short conditions and will direct the VSW output to skip 4 cycles
if current limit occurs when FB is low. This allows current built up in the inductor during the minimum on time to decay
sufficiently. Current limit is always active when the regulator is enabled. Soft start ensures current limit does not prevent
regulator startup.
Under extended over current conditions (such as a short), the device will automatically disable. Once the over current
condition is removed, the device returns to normal operation automatically. (Alternately the factory can configure the device’s
NVM to shutdown the regulator if an extended over current event is detected and require a toggle of the Enable pin to return
the device to normal operation.)
Thermal Shutdown
If the temperature of the die exceeds 170°C (typical), the VSW outputs will tri-state to protect the device from damage. The PG
and all other protection circuitry will stay active to inform the system of the failure mode. Once the device cools to 160°C
(typical), the device will start up again, following the normal soft start sequence. If the device reaches 170°C, the
shutdown/restart sequence will repeat.
Reference Soft Start
The reference in this device is ramped at a rate of 4ms to prevent the output from overshoot during startup. This ramp restarts
whenever there is a rising edge sensed on the Enable pin. This occurs in both the fixed and adjustable versions. During the soft
start ramp, current limit is still active, and will still protect the device in case of a short on the output.
Output Overvoltage
If the output of the regulator exceeds 103% of the regulation voltage, the VSW outputs will tri-state to protect the device from
damage. This check occurs at the start of each switching cycle. If it occurs during the middle of a cycle, the switching for that
cycle will complete, and the VSW outputs will tri-state at the beginning of the next cycle.
VCC Under-Voltage Lockout
The device is held in the off state until VCC reaches 4.5V (typical). There is a 500mV hysteresis on this input, which requires the
input to fall below 4.0V (typical) before the device will disable.
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
-8-
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
TYPICAL PERFORMANCE CHARACTERISTICS
5V/div
500mA/div
1V/div
50mV/div
TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
Figure 5. 100mA to 1A Load Step (Vcc=12V, VOUT=1.8V)
1A/div
1A/div
100mV/div
100mV/div
Figure 4. Startup Response
Figure 6. 100mA to 2A Load (VCC=12V, VOUT=1.8V)
2A/div
5V/div
50mV/div
100mV/div
Figure 7. 100mA to 1A Load Step (VCC=12V, VOUT=3.3V)
Figure 8. 100mA to 2A Load Step (VCC=12V, VOUT=3.3V)
Specifications subject to change
Figure 9. Line Transient Response (VCC=12V, VOUT=3.3V)
WWW.TRIUNESYSTEMS.COM
-9-
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
TYPICAL PERFORMANCE CHARACTERISTICS
TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
Figure 10. Load Regulation
Figure 11. Line Regulation (IOUT=1A)
Figure 12. Efficiency vs. Output Current ( VOUT = 1.8V)
Figure 13. Efficiency vs. Output Current ( VOUT = 3.3V)
Figure 14. Efficiency vs. Output Current ( VOUT = 5V)
Figure 15. Efficiency vs. Input Voltage (VOUT = 3.3V)
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
- 10 -
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
TYPICAL PERFORMANCE CHARACTERISTICS
TJ = -40C to 125C, VCC = 12V (unless otherwise noted)
7.0
Standby Current (uA)
6.5
6.0
5.5
5.0
4.5
4.0
-50
Figure 16. Standby Current vs. Input Voltage
100
150
Iout=30mA
3.300
3.295
Iout=300mA
3.290
3.285
3.280
-50
0
50
100
Oscillator Frequency (MHz)
1.05
3.305
Output Voltage (V)
50
Temperature (°C)
Figure 17. Standby Current vs. Temperature
3.310
1.03
1.01
0.99
0.97
0.95
150
-50
0
50
100
150
Temperature (°C)
Temperature (°C)
Figure 18. Output Voltage vs. Temperature
Figure 19. Oscillator Frequency vs. Temperature (Iout=300mA)
Input Current No SW (mA)
6.00
Quiscent Current (mA)
0
5.50
5.00
4.50
4.00
-50
0
50
100
2
1.98
1.96
1.94
1.92
1.9
1.88
1.86
1.84
-50
150
Specifications subject to change
50
100
150
Temperature (°C)
Temperature (°C)
Figure 20. Quiescent Current vs. Temperature (No load)
0
Figure 21. Input Current vs. Temperature (No load, No switching)
WWW.TRIUNESYSTEMS.COM
- 11 -
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
TYPICAL APPLICATION SCHEMATIC
BST
VCC
VCC
10uF 35V
0.1uF
(optional)
EN
GND
EN
TS30011/12/13
CBYPASS2
22nF
PGND
CBYPASS
CBST
VSW
VOUT
LOUT
4.7uH
2.5V
DCATCH
COUT1
COUT2
(optional)
22uF 10V
22uF 10V
RTOP
FB
17.8K
VOUT
RBOT
RPUP
10K
10K
(optional)
PG
PG
Figure 22: TS30011/12/13 Application Schematic
A minimal schematic suitable for most applications is shown on page 1. Figure 22 includes optional
components that may be considered to address specific issues as listed in the External Component
Selection section.
PCB LAYOUT
For proper operation and minimum EMI, care must be taken during PCB layout. An improper layout can lead to issues such as
poor stability and regulation, noise sensitivity and increased EMI radiation. (figure 23) The main guidelines are the following:
 provide low inductive and resistive paths for loops with high di/dt,
 provide low capacitive paths with respect to all the other nodes for traces with high di/dt,
 sensitive nodes not assigned to power transmission should be referenced to the analog signal ground (GND) and be
always separated from the power ground (PGND).
The negative ends of CBYPASS, COUT and the Schottky diode DCATCH (optional) should be placed close to each other and connected
using a wide trace. Vias must be used to connect the PGND node to the ground plane. The PGND node must be placed as close as
possible to the TS30011/12/13 PGND pins to avoid additional voltage drop in traces.
The bypass capacitor CBYPASS (optionally paralleled to a 0.1µF capacitor) must be placed close to the VCC pins of
TS30011/12/13.
The inductor must be placed close to the VSW pins and connected directly to C OUT in order to minimize the area between the
VSW pin, the inductor, the COUT capacitor and the PGND pins. The trace area and length of the switching nodes VSW and BST
should be minimized.
For the adjustable output voltage version of the TS30011/12/13, feedback resistors RBOT and RTOP are required for Vout
settings greater than 0.9V and should be placed close to the TS30011/12/13 in order to keep the traces of the sensitive node FB
as short as possible and away from switching signals. RBOT should be connected to the analog ground pin (GND) directly and
should never be connected to the ground plane. The analog ground trace (GND) should be connected in only one point to the
power ground (PGND). A good connection point is under the TS30011/12/13 package to the exposed thermal pad and vias
which are connected to PGND. RTOP will be connected to the VOUT node using a trace that ends close to the actual load.
For fixed output voltage versions of the TS30011/12/13, RBOT and RTOP are not required and the FB pin should be connected
directly to the Vout.
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
- 12 -
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
The exposed thermal pad must be soldered to the PCB for mechanical reliability and to achieve good power dissipation. Vias
must be placed under the pad to transfer the heat to the ground plane.
VOUT
COUT
LOUT
VSW
VSW
VSW
VCC
VCC
VCC
BST
GND
EN
PG
NC
FB
NC
Vias to
ground
plane
PGND
VSW
CBYP
PGND
DCATCH
Switching
node
CBST
COUT
RPLP
CBYPASS
PGND
RBOT
Analog
ground
(GND)
VCC
RTOP
Vias to
ground
plane
Figure 23: TS30011/12/13 PCB Layout, Top View
EXTERNAL COMPONENT BILL OF MATERIALS
Description
Suggested
Manufacturer
Manufacturer Code
Qty
Input Supply Bypass
Capacitor
10uF 10%
35V
TDK
CGA5L3X5R1V106K160AB
1
COUT
Output Filter Capacitor
22uF 10%
10V
TDK
C2012X5R1A226K125AB
2
LOUT
Output Filter Inductor (1A)
4.7uH 2A
TDK
Wurth
SLF7045T-4R7M2R0-PF
7447745047
1
LOUT
Output Filter Inductor (2A)
4.7uH 3A
TDK
Wurth
VLC5045T-4R7M
744774047
1
LOUT
Output Filter Inductor (3A)
4.7uH 4.37A
TDK
Wurth
VLP6045LT-4R7M
744777004
1
CBST
Boost Capacitor
22nF 10V
TDK
C1005X7R1C223K
1
Designator
CBYPASS
Function
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
- 13 -
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
Note 1:
RTOP
Voltage Feedback Resistor
(optional)
17.8K
(Note 1)
1
RBOT
Voltage Feedback Resistor
(optional)
10K
(Note 1)
1
RPLP
PG Pin Pull-up Resistor
(optional)
10K
1
DCATCH
Catch Diode (optional, 1A)
30V 2A
SOD-123FL
On
Semiconductor
MBR230LSFT1G
1
DCATCH
Catch Diode (optional, 2A)
40V 3A
SOD-123
NXP
Semiconductors
PMEG4030ER,115
1
DCATCH
Catch Diode (optional, 3A)
40V 5A
SOD-123FL
NXP
Semiconductors
PMEG4050EP,1
1
The voltage divider resistor values are calculated for an output voltage of 2.5V. For fixed output versions, the FB pin is connected directly to VOUT.
EXTERNAL COMPONENT SELECTION
The 1MHz internal switching frequency of the TS30011/12/13 facilitates low cost LC filter combinations. Additionally, the fixed
output versions enable a minimum external component count to provide a complete regulation solution with only 4 external
components: an input bypass capacitor, an inductor, an output capacitor, and the bootstrap capacitor. The internal
compensation is optimized for a 44uF output capacitor and a 4.7uH inductor.
For best performance, a low ESR ceramic capacitor should be used for C BYPASS. If CBYPASS is not a low ESR ceramic capacitor, a
0.1uF ceramic capacitor should be added in parallel to C BYPASS.
The minimum allowable value for the output capacitor is 33uF. To keep the output ripple low, a low ESR (less than 35mOhm)
ceramic is recommended. Multiple capacitors can be paralleled to reduce the ESR.
The inductor range is 4.7uH +/-20%. For optimal over-current protection, the inductor should be able to handle up to the
regulator current limit without saturation. Otherwise, an inductor with a saturation current rating higher than the maximum
IOUT load requirement plus the inductor current ripple should be used.
For high current modes, the optional Schottky diode will improve the overall efficiency and reduce the heat. It is up to the user
to determine the cost/benefit of adding this additional component in the user’s application. The diode is typically not needed.
For the adjustable output version of the TS30011/12/13, the output voltage can be adjusted by sizing R TOP and RBOT feedback
resistors. The equation for the output voltage is
 R
Vout  0.9  1   TOP
  RBOT
For the adjustable version, the ratio of VCC/Vout cannot exceed 16.

 
 .
RPUP is only required when the Power Good signal (PG) is utilized.
THERMAL INFORMATION
TS30011/12/13 is designed for a maximum operating junction temperature Tj of 125°C. The maximum output power is limited
by the power losses that can be dissipated over the thermal resistance given by the package and the PCB structures. The PCB
must provide heat sinking to keep the TS30011/12/13 cool. The exposed metal on the bottom of the QFN package must be
soldered to a ground plane. This ground should be tied to other copper layers below with thermal vias. Adding more copper to
the top and the bottom layers and tying this copper to the internal planes with vias can reduce thermal resistance further. For a
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
- 14 -
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
hi-K JEDEC board and 13.5 square inch of 1 oz Cu, the thermal resistance from junction to ambient can be reduced to JA =
38°C/W. The power dissipation of other power components (catch diode, inductor) cause additional copper heating and can
further increase what the TS30011/12/13 sees as ambient temperature.
PACKAGE MECHANICAL DRAWINGS (all dimensions in mm)
TOP VIEW
EXPOSED
PAD
BOTTOM VIEW
Units
Dimensions Limits
Number of Pins
N
Pitch
e
Overall Height
A
Standoff
A1
Contact Thickness
A3
Overall Length
D
Exposed Pad Width
E2
Overall Width
E
Exposed Pad Length
D2
Contact Width
b
Contact Length
L
Contact-to-Exposed Pad
K
Specifications subject to change
MIN
0.80
0.00
1.55
1.55
0.20
0.20
0.20
WWW.TRIUNESYSTEMS.COM
- 15 -
MILLIMETERS
NOM
16
0.50 BSC
0.90
0.02
0.20 REF
3.00 BSC
1.70
3.00 BSC
1.70
0.25
0.30
-
MAX
1.00
0.05
1.80
1.80
0.30
0.40
-
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
RECOMMEDED PCB LAND PATTERN
Silk Screen
RECOMMENDED
LAND PATTERN
DIMENSIONS IN MILLIMETERS
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
W2
Optional Center Pad Length
T2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X16)
X1
Contact Pad Length (X16)
Y1
Distance Between Pads
G
MILLIMETERS
MIN
NOM
0.50 BSC
3.00
3.00
0.15
-
MAX
1.70
1.70
0.35
0.65
-
Notes:
Dimensions and tolerances per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact values shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information only.
PACAKGING INFORMATION
Pb-Free (RoHS): The TS30011/12/13 devices are fully compliant for all materials covered by European Union Directive 2002/95/EC, and meet all IPC1752 Level 3 materials declaration requirements.
MSL, Peak Temp: The TS30011/12/13 family has a Moisture Sensitivity Level (MSL) 1 rating per JEDEC J-STD-020D. These devices also have a Peak
Profile Solder Temperature (Tp) of 260°C.
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
- 16 -
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
ORDERING INFORMATION
TS3001x-MvvvQFNR
x
1
2
3
Specifications subject to change
Output Current
1 Amp
2 Amp
3 Amp
vvv
015
018
025
033
050
000
Output Voltage
1.5 V
1.8 V
2.5 V
3.3 V
5.0 V
Adjustable
WWW.TRIUNESYSTEMS.COM
- 17 -
Copyright © 2012, Triune Systems, LLC
TS30011/12/13
Version 1.6
Legal Notices
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by
updates. It is your responsibility to ensure that your application meets with your specifications. “Typical” parameters which may be provided in Triune
Systems data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for your application by your technical experts. TRIUNE SYSTEMS MAKES NO REPRESENTATIONS
OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE
INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR
PURPOSE. Triune Systems disclaims all liability arising from this information and its use. Triune System products are not designed, intended, or
authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for
any other application in which the failure of the Triune Systems product could create a situation where personal injury or death may occur. Should the
Buyer purchase or use Triune Systems products for any such unintended or unauthorized application, the Buyer shall indemnify and hold Triune Systems,
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney
fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that Triune Systems was negligent regarding the design or manufacture of the part. No licenses are conveyed, implicitly or otherwise, under any
Triune Systems intellectual property rights.
Trademarks
The Triune Systems® name and logo, MPPT-lite™, and nanoSmart® are trademarks of Triune Systems, LLC. in the U.S.A..
All other trademarks mentioned herein are property of their respective companies.
© 2012 Triune Systems, LLC. All Rights Reserved.
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
- 18 -
Copyright © 2012, Triune Systems, LLC