Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish Ball Size (mm) RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant CSP BGA 10 X 10 144 SnAgCu Yes Yes Yes Yes 0.45 Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 1.83 E-02 1.27 E-03 1.27 E-03 3.18 E-04 6.37 E-05 2.12 E-02 Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 9.66 0.67 0.67 0.17 0.03 11.20 PPM 96577 6722 6722 1681 336 112039 Laminate Homogeneous Material Level Description Copper & its alloys Thermoset Other inorganic materials Other inorganic materials Other inorganic materials Other inorganic materials Other inorganic materials Other inorganic materials Other inorganic materials Thermoset Other inorganic materials Other organic materials Thermoset Other organic materials Other inorganic materials Other organic materials Other organic materials Other organic materials Others Other organic materials Other organic materials Other organic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal Substance Copper Foil Epoxy resin Silica Calcium oxide Magnesium oxide Aluminum oxide Boron oxide Zinc Chromium CAS# 7440-50-8 26265-08-7 14808-60-7 1305-78-8 1309-48-8 1344-28-1 Proprietary 7440-66-6 7440-47-3 Laminate Core Subtotal Acrylic resin Barium Sulfate, Silica, Talc 3-Methoxy-3-Methyl Butyl-Acetate Epoxy resin Dipropylene Glycol Monomethyl Ether Barium Sulfate Aromatic Carbonyl Compound High Boiling Point Petroleum Solvent Acrylic Monomer Levelling agent & others Organic filler Amine compound Phthalocyanine Green, Organic Pigment Soldermask Subtotal Copper Nickel Gold Component Level Weight (g) 1.93 E-02 6.32 E-03 3.27 E-03 7.70 E-04 7.70 E-04 7.57 E-04 3.83 E-04 7.92 E-05 1.27 E-05 3.17 E-02 3.28 E-03 2.50 E-03 1.84 E-03 1.72 E-03 1.18 E-03 8.42 E-04 3.24 E-04 3.11 E-04 5.05 E-04 2.07 E-04 1.68 E-04 5.18 E-05 2.59 E-05 1.30 E-02 2.59 E-02 7.20 E-04 7.20 E-04 7.20 E-02 Proprietary Proprietary Proprietary Proprietary 34590-94-8 7727-43-7 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 26.83 8.78 4.54 1.07 1.07 1.05 0.53 0.11 0.02 44.00 4.55 3.47 2.56 2.39 1.64 1.17 0.45 0.43 0.70 0.29 0.23 0.07 0.04 18.00 36.00 1.00 1.00 100.0 268312 87824 45364 10692 10692 10516 5324 1100 176 440000 45540 34740 25560 23940 16380 11700 4500 4320 7020 2880 2340 720 360 180000 360000 10000 10000 1000000 10.20 3.34 1.72 0.41 0.41 0.40 0.20 0.04 0.01 16.73 1.73 1.32 0.97 0.91 0.62 0.44 0.17 0.16 0.27 0.11 0.09 0.03 0.01 6.84 13.68 0.38 0.38 38.01 PPM 101993 33384 17244 4064 4064 3997 2024 418 67 167257 17311 13206 9716 9100 6227 4448 1711 1642 2669 1095 890 274 137 68423 136846 3801 3801 380129 Solder Ball Component Level Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Substance CAS# Weight (g) 7440-31-5 7440-22-4 7440-50-8 Tin Silver Copper 4.91 E-02 1.53 E-03 2.54 E-04 5.09 E-02 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 25.91 0.81 0.13 26.85 PPM 259138 8056 1343 268537 Bond Wires Homogeneous Material Level Description Precious metals Precious metals Subtotal Substance Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 1.15 E-03 1.17 E-05 1.17 E-03 Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 0.61 0.01 0.62 PPM 6091 62 6152 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon Component Level Weight (g) CAS# 7440-21-3 3.95 E-02 Percentage (%) PPM Percentage (%) 100 1000000 20.88 PPM 208772 Die Attach Component Level Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Other organic materials Thermoset Subtotal Substance Silver Polymeric materia Acrylate resin Diester resin Functionalized urethane resin Epoxy resin CAS# Weight (g) 3.05 E-03 7.63 E-04 2.86 E-04 2.86 E-04 1.14 E-04 1.14 E-04 4.62 E-03 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary Weight (g) 1.89 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 66.11 16.53 6.20 6.20 2.48 2.48 100.00 661100 165300 62000 62000 24800 24800 1000000 1.61 0.40 0.15 0.15 0.06 0.06 2.44 Percentage (%) 100.00 PPM 16112 4029 1511 1511 604 604 24372 PPM 1000000