PDF

Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
CSP BGA - Stacked Die
9X9
128
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size (mm)
0.40
Yes
Yes
No
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Component Level
Weight (g)
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
1.05 E-01
5.54 E-03
5.54 E-03
1.85 E-03
3.54 E-04
1.18 E-01
Percentage (%)
PPM
Percentage (%)
88.73
4.70
4.70
1.57
0.30
100.00
887300
47000
47000
15700
3000
1000000
51.23
2.71
2.71
0.91
0.17
57.74
PPM
512291
27136
27136
9065
1732
577359
Laminate
Homogeneous Material Level
Substance
Description
Thermoset
Copper & its alloys
Composite
Other inorganic materials
Composite
Thermoset
Other inorganic materials
Other organic materials
Other inorganic materials
Other inorganic materials
Other organic materials
Other organic materials
Other inorganic materials
Copper & its alloys
Nickel & its alloys
Precious Metals
Subtotal
Pre-preg Resin
Copper Foil
Pre-preg Glass Cloth
Pre-preg Filler
Core Glass Cloth
Core Resin
Core Filler
Laminate Core Subtotal
Solvent Naphtha, Heavy Arom
Barium Sulfate
Silica
Acetophenone Derivatives
Dipropylene glycol monomethyl ether
Talc
Soldermask Subtotal
Copper
Nickel
Gold
CAS#
Component Level
Weight (g)
68541-56-0 / 29690-82-2 /25068-38-6
7440-50-8
65997-17-3
Proprietary
65997-17-3
68541-56-0 / 29690-82-2 /25068-38-6
Proprietary
4.85 E-03
4.62 E-03
3.47 E-03
1.85 E-03
1.94 E-03
1.71 E-03
7.86 E-04
1.92 E-02
2.77 E-03
2.34 E-03
1.70 E-03
1.28 E-03
8.51 E-04
8.51 E-04
9.80 E-03
4.56 E-03
4.08 E-04
3.40 E-05
3.40 E-02
64742-94-5
7727-43-7
14808-60-7
Proprietary
34590-94-8
14807-96-6
7440-50-8
7440-02-0
7440-57-5
Percentage (%)
PPM
Percentage (%)
14.26
13.58
10.19
5.43
5.70
5.03
2.31
56.50
8.14
6.89
5.01
3.76
2.50
2.50
28.80
13.40
1.20
0.10
100.00
142600
135800
101900
54300
57000
50300
23100
565000
81400
68900
50100
37600
25000
25000
288000
134000
12000
1000
1000000
2.37
2.26
1.70
0.90
0.95
0.84
0.38
9.41
1.36
1.15
0.83
0.63
0.42
0.42
4.80
2.23
0.20
0.02
16.7
PPM
23748
22616
16970
9043
9493
8377
3847
94094
13556
11474
8344
6262
4163
4163
47963
22316
1998
167
166538
Solder Ball
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Substance
Tin
Silver
Copper
CAS#
Weight (g)
7440-31-5
7440-22-4
7440-50-8
3.06 E-02
9.53 E-04
1.59 E-04
3.18 E-02
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
15.00
0.47
0.08
15.54
PPM
150003
4663
777
155444
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
Component Level
Weight (g)
E-03
3.51 E
03
7440-57-5
7440 57 5
Percentage (%)
PPM
Percentage (%)
100
1000000
1.72
PPM
17179
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
Component Level
Weight (g)
CAS#
7440-21-3
1.58 E-02
Percentage (%)
PPM
Percentage (%)
100
1000000
7.71
PPM
77146
Die Attach 1
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Other organic materials
Subtotal
Substance
Silver
Bismaleimide monomer
Acrylate monomer
CAS#
Weight (g)
7440-22-4
TS#10049
TS #10055
5.02 E-04
1.00 E-04
5.02 E-05
6.52 E-04
Percentage (%)
PPM
Percentage (%)
76.93
15.38
7.69
100.00
769300
153800
76900
1000000
0.25
0.05
0.02
0.32
PPM
2457
491
246
3193
Die Attach 2
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Subtotal
Substance
Silica
Di-ester resin
Functionalized ester
Epoxy resin
Polymeric material
CAS#
Component Level
Weight (g)
60676-86-0 / 7631-86-9
Proprietary
Proprietary
Proprietary
Proprietary
8.45 E-05
5.16 E-05
3.75 E-05
1.41 E-05
1.41 E-05
2.02 E-04
Percentage (%)
PPM
Percentage (%)
41.86
25.58
18.60
6.98
6.98
100.00
418600
255800
186000
69800
69800
1000000
0.04
0.03
0.02
0.01
0.01
0.10
PPM
414
253
184
69
69
988
Die Attach 3
Homogeneous Material Level
Description
Other organic materials
Thermoset
Other organic materials
Subtotal
Substance
Acrylic co-polymer
Epoxy resin
Phenol resin
CAS#
Component Level
Weight (g)
60676-86-0/ 7631-86-9
Proprietary
Proprietary
3.07 E-04
8.97 E-05
4.38 E-05
4.40 E-04
Weight (g)
2.04 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
69.66
20.39
9.95
100.00
696600
203900
99500
1000000
0.15
0.04
0.02
0.22
Percentage (%)
100.00
PPM
1500
439
214
2154
PPM
1000000