Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish CSP BGA 8X8 120 SnAgCu RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size (mm) 0.30 Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 6.01 E-02 4.18 E-03 4.18 E-03 1.05 E-03 2.09 E-04 6.97 E-02 Percentage (%) PPM Percentage (%) 86.20 6.00 6.00 1.50 0.30 100.0 862000 60000 60000 15000 3000 1000000 40.32 2.81 2.81 0.70 0.14 46.77 PPM 403180 28064 28064 7016 1403 467726 Laminate Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Other inorganic materials Thermoset Thermoset Thermoset Other organic materials Other organic materials Other inorganic materials Other organic materials Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Others Other organic materials Other inorganic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal Glass Cloth Copper Foil Inorganic Filler Epoxy resin Bismaleimide Triazine Organic Filler CAS# 1.60 E-02 7.43 E-03 6.40 E-03 3.20 E-03 3.20 E-03 3.20 E-03 7.67 E-05 3.95 E-02 1.54 E-03 1.57 E-03 8.64 E-04 8.08 E-04 5.52 E-04 2.35 E-04 1.53 E-04 1.48 E-04 9.71 E-05 2.56 E-05 1.02 E-05 6.01 E-03 4.99 E-03 5.68 E-04 6.14 E-05 5.11 E-02 65997-17-3 7440-50-8 Proprietary 7328-97-4 13676-54-5 25722-66-1 Proprietary Laminate Core Subtotal Modified resin Barium Sulfate Aromatic Hydrocarbon Epoxy resin Diethylene Glycol Monomethyl Ether Acetate Acrylic Esters Monomer Aromatic Carbonyl compound Dipropylene gylcol monomethyl ether Levelling Agents & Others Amine Compound Phthalocyanine Green Soldermask Subtotal Copper Nickel Gold Component Level Weight (g) Proprietary 7727-43-7 Proprietary 85954-11-6 112-15-2 Proprietary Proprietary 34590-94-8 Proprietary Proprietary Proprietary 7440-50-8 7440-02-0 7440-57-5 Percentage (%) PPM Percentage (%) 31.29 14.53 12.52 6.26 6.26 6.26 0.15 77.27 3.02 3.07 1.69 1.58 1.08 0.46 0.30 0.29 0.19 0.05 0.02 11.75 9.75 1.11 0.12 100.00 312900 145300 125200 62600 62600 62600 1500 772700 30200 30700 16900 15800 10800 4600 3000 2900 1900 500 200 117500 97500 11100 1200 1000000 10.74 4.99 4.30 2.15 2.15 2.15 0.05 26.52 1.04 1.05 0.58 0.54 0.37 0.16 0.10 0.10 0.07 0.02 0.01 4.03 3.35 0.38 0.04 34.32 PPM 107383 49865 42967 21483 21483 21483 515 265179 10364 10536 5800 5422 3706 1579 1030 995 652 172 69 40324 33461 3809 412 343185 Solder Ball Component Level Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Substance Tin Silver Copper CAS# Weight (g) 7440-31-5 7440-22-4 7440-50-8 1.21 E-02 3.77 E-04 6.28 E-05 1.26 E-02 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 8.13 0.25 0.04 8.43 PPM 81315 2528 421 84264 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# Component Level Weight (g) 7440-57-5 7440-05-3 7.58 E-04 7.66 E-06 7.66 E-04 Percentage (%) PPM Percentage (%) 99 1 100 990000 10000 1000000 0.51 0.01 0.51 PPM 5088 51 5140 Chip Component Level Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# Weight (g) 7440-21-3 1.36 E-02 Percentage (%) PPM Percentage (%) 100 1000000 9.16 PPM 91563 Die Attach Homogeneous Material Level Description Other inorganic materials Other organic materials Other organic materials Thermoset Other organic materials Subtotal Substance Silicon dioxide Bismaleimide monomer Acrylate monomer Epoxy resin Acryric resin CAS# Component Level Weight (g) 60676-86-0 TS #10049 TS #10050 TS #10042 TS #10051 5.84 E-04 3.78 E-04 1.03 E-04 1.03 E-04 4.13 E-05 1.21 E-03 Weight (g) 1.49 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 48.30 31.25 8.52 8.52 3.41 100.00 483000 312500 85200 85200 34100 1000000 0.39 0.25 0.07 0.07 0.03 0.81 Percentage (%) 100.00 PPM 3923 2538 692 692 277 8122 PPM 1000000