PDF

Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
CSP BGA
8X8
120
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size (mm)
0.30
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
6.01 E-02
4.18 E-03
4.18 E-03
1.05 E-03
2.09 E-04
6.97 E-02
Percentage (%)
PPM
Percentage (%)
86.20
6.00
6.00
1.50
0.30
100.0
862000
60000
60000
15000
3000
1000000
40.32
2.81
2.81
0.70
0.14
46.77
PPM
403180
28064
28064
7016
1403
467726
Laminate
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Other inorganic materials
Thermoset
Thermoset
Thermoset
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Other inorganic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Glass Cloth
Copper Foil
Inorganic Filler
Epoxy resin
Bismaleimide
Triazine
Organic Filler
CAS#
1.60 E-02
7.43 E-03
6.40 E-03
3.20 E-03
3.20 E-03
3.20 E-03
7.67 E-05
3.95 E-02
1.54 E-03
1.57 E-03
8.64 E-04
8.08 E-04
5.52 E-04
2.35 E-04
1.53 E-04
1.48 E-04
9.71 E-05
2.56 E-05
1.02 E-05
6.01 E-03
4.99 E-03
5.68 E-04
6.14 E-05
5.11 E-02
65997-17-3
7440-50-8
Proprietary
7328-97-4
13676-54-5
25722-66-1
Proprietary
Laminate Core Subtotal
Modified resin
Barium Sulfate
Aromatic Hydrocarbon
Epoxy resin
Diethylene Glycol Monomethyl Ether Acetate
Acrylic Esters Monomer
Aromatic Carbonyl compound
Dipropylene gylcol monomethyl ether
Levelling Agents & Others
Amine Compound
Phthalocyanine Green
Soldermask Subtotal
Copper
Nickel
Gold
Component Level
Weight (g)
Proprietary
7727-43-7
Proprietary
85954-11-6
112-15-2
Proprietary
Proprietary
34590-94-8
Proprietary
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
Percentage (%)
PPM
Percentage (%)
31.29
14.53
12.52
6.26
6.26
6.26
0.15
77.27
3.02
3.07
1.69
1.58
1.08
0.46
0.30
0.29
0.19
0.05
0.02
11.75
9.75
1.11
0.12
100.00
312900
145300
125200
62600
62600
62600
1500
772700
30200
30700
16900
15800
10800
4600
3000
2900
1900
500
200
117500
97500
11100
1200
1000000
10.74
4.99
4.30
2.15
2.15
2.15
0.05
26.52
1.04
1.05
0.58
0.54
0.37
0.16
0.10
0.10
0.07
0.02
0.01
4.03
3.35
0.38
0.04
34.32
PPM
107383
49865
42967
21483
21483
21483
515
265179
10364
10536
5800
5422
3706
1579
1030
995
652
172
69
40324
33461
3809
412
343185
Solder Ball
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Substance
Tin
Silver
Copper
CAS#
Weight (g)
7440-31-5
7440-22-4
7440-50-8
1.21 E-02
3.77 E-04
6.28 E-05
1.26 E-02
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
8.13
0.25
0.04
8.43
PPM
81315
2528
421
84264
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Subtotal
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
7.58 E-04
7.66 E-06
7.66 E-04
Percentage (%)
PPM
Percentage (%)
99
1
100
990000
10000
1000000
0.51
0.01
0.51
PPM
5088
51
5140
Chip
Component Level
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
Weight (g)
7440-21-3
1.36 E-02
Percentage (%)
PPM
Percentage (%)
100
1000000
9.16
PPM
91563
Die Attach
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Subtotal
Substance
Silicon dioxide
Bismaleimide monomer
Acrylate monomer
Epoxy resin
Acryric resin
CAS#
Component Level
Weight (g)
60676-86-0
TS #10049
TS #10050
TS #10042
TS #10051
5.84 E-04
3.78 E-04
1.03 E-04
1.03 E-04
4.13 E-05
1.21 E-03
Weight (g)
1.49 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
48.30
31.25
8.52
8.52
3.41
100.00
483000
312500
85200
85200
34100
1000000
0.39
0.25
0.07
0.07
0.03
0.81
Percentage (%)
100.00
PPM
3923
2538
692
692
277
8122
PPM
1000000