Product / Package Information Environmental Information Package Body Size Ball Count Terminal Finish CSP BGA 12 X 12 mm 164 SnAgCu RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size 0.45 mm MS Number MS011251A + MS011200A Yes Yes Yes Yes Materials Declaration Underfill Description Other inorganic materials Other organic materials Thermosets Other organic materials Thermosets Others Other inorganic materials Subtotal Substance Silicon dioxide p-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline Bisphenol F type liquid epoxy resin Amine type hardener Bisphenol A type liquid epoxy resin Additive Carbon Black Subtotal CAS# Weight (g) 60676-86-0 5026-74-4 9003-36-5 Proprietary 25068-38-6 Proprietary 1333-86-4 3.32 E-03 5.10 E-04 5.10 E-04 3.83 E-04 1.28 E-04 1.28 E-04 2.55 E-05 5.00 E-03 Homogeneous Material Level Percentage (%) PPM 66.34 663400 10.20 102000 10.20 102000 7.65 76530 2.55 25500 2.55 25500 0.51 5100 100.00 1000030 Percentage (%) 0.97 0.15 0.15 0.11 0.04 0.04 0.01 1.46 Component Level Homogeneous Material Level Percentage (%) PPM 86.20 862000 6.00 60000 6.00 60000 1.50 15000 0.30 3000 100.00 1000000 Percentage (%) 40.84 2.84 2.84 0.71 0.142 47.37 Homogeneous Material Level Percentage (%) PPM 5.85 58497 26.08 260809 10.43 104324 5.22 52162 5.22 52162 5.22 52162 52.16 521618 3.51 35133 1.84 18369 1.61 16123 0.63 6257 0.31 3128 0.05 481 0.04 401 0.03 321 8.02 80213 33.64 336357 96.50 965000 3.00 30000 0.50 5000 100.00 1000000 0.33 3314 100.00 1000000 Percentage (%) 1.41 6.29 2.51 1.26 1.26 1.26 12.57 0.85 0.44 0.39 0.15 0.08 0.01 0.01 0.01 1.93 8.11 0.08 0.002 0.0004 0.08 0.08 24 Homogeneous Material Level Percentage (%) PPM 96.50 965000 3.00 30000 0.50 5000 100 1000000 Percentage (%) 16.29 0.51 0.08 16.88 Homogeneous Material Level Percentage (%) PPM 100 1000000 Percentage (%) 6.29 Homogeneous Material Level Percentage (%) PPM 98.20 982000 1.80 18000 100.00 1000000 Percentage (%) 3.63 0.07 3.70 Homogeneous Material Level Percentage (%) PPM 67.95 679500 14.56 145600 5.83 58300 5.83 58300 5.83 58300 100.00 1000000 Percentage (%) 0.03 0.01 0.003 0.003 0.003 0.05 Homogeneous Material Level Percentage (%) PPM 90.85 908532 6.86 68554 Percentage (%) 0.142 0.011 PPM 9654 1484 1484 1114 371 371 74 14553 Mold Compound Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Description Copper & its alloys Composite Others Thermoset Thermoset Thermoset Other organic materials Other inorganic materials Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Copper & its alloys Tin & its alloys Tin & its alloys Tin & its alloys Substance Copper Foil Glass Cloth Inorganic Filler Epoxy Resin Flame Resistant Epoxy Resin Heat Resistant Resin Laminate Core Subtotal Acrylic resin Barium sulfate, Silica, Talc Epoxy Resin Acrylic Monomer Aromatic Carbonyl Compound Leveling Agents & others Amine Compound Phthalocyanine Blue, Organic Pigment Soldermask Subtotal Copper plating Tin Silver Copper SOP Subtotal SOP Subtotal CAS# Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 1.40 E-01 9.77 E-03 9.77 E-03 2.44 E-03 4.88 E-04 1.63 E-01 CAS# Weight (g) 7440-50-8 65997-17-3 Proprietary 7328-97-4 Proprietary Proprietary 4.84 E-03 2.16 E-02 8.64 E-03 4.32 E-03 4.32 E-03 4.32 E-03 4.32 E-02 2.91 E-03 1.52 E-03 1.34 E-03 5.18 E-04 2.59 E-04 3.99 E-05 3.32 E-05 2.66 E-05 6.64 E-03 2.79 E-02 2.65 E-04 8.23 E-06 1.37 E-06 2.74 E-04 2.74 E-04 8.28 E-02 Proprietary 7727-43-7 / 14807-96-6 Proprietary Proprietary Proprietary Proprietary Proprietary Proprietary 7440-50-8 7440-31-5 7440-22-4 7440-50-8 Subtotal Component Level PPM 408353 28424 28424 7106 1421 473728 Component Level PPM 14101 62868 25147 12574 12574 12574 125737 8469 4428 3886 1508 754 116 97 77 19336 81079 771 24 4 799 799 241051 Solder Ball Substance Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Tin Silver Copper CAS# Weight (g) 7440-31-5 7440-22-4 7440-50-8 5.60 E-02 1.74 E-03 2.90 E-04 5.80 E-02 Component Level PPM 162856 5063 844 168763 Chip Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 2.16 E-02 Component Level PPM 62923 Solder Bump Description Tin & its alloys Tin & its alloys Subtotal Substance Tin Silver CAS# Weight (g) 7440-31-5 7440-22-4 1.25 E-02 2.29 E-04 1.27 E-02 Component Level PPM 36293 665 36958 Polyimide Description Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Subtotal Substance Resin Tetraethylene Glycol Dimethacrylate Trifluoroacetic Anhydride 4,4'-Oxydiphthalic Anhydride 2-Hydroxyethyl Methacrylate CAS# Weight (g) Proprietary 109-17-1 407-25-0 1823-59-2 868-77-9 1.08 E-04 2.31 E-05 9.25 E-06 9.25 E-06 9.25 E-06 1.59 E-04 Component Level PPM 314 67 27 27 27 462 UBM Description Substance CAS# Weight (g) Component Level PPM Nickel and its alloys Copper & its alloys Nickel Copper 7440-02-0 7440-50-8 4.88 E-04 3.68 E-05 Other non-ferrous metals and alloys Titanium 7440-32-6 1.23 E-05 2.29 22914 0.004 36 5.37 E-04 100.00 1000000 0.16 1562 Weight (g) 3.44 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 1419 107 PPM 1000000