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Product / Package Information
Environmental Information
Package
Body Size
Ball Count
Terminal Finish
CSP BGA
12 X 12 mm
164
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size
0.45 mm
MS Number
MS011251A + MS011200A
Yes
Yes
Yes
Yes
Materials Declaration
Underfill
Description
Other inorganic materials
Other organic materials
Thermosets
Other organic materials
Thermosets
Others
Other inorganic materials
Subtotal
Substance
Silicon dioxide
p-(2,3-epoxypropoxy)-N,N-bis(2,3-epoxypropyl)aniline
Bisphenol F type liquid epoxy resin
Amine type hardener
Bisphenol A type liquid epoxy resin
Additive
Carbon Black
Subtotal
CAS#
Weight (g)
60676-86-0
5026-74-4
9003-36-5
Proprietary
25068-38-6
Proprietary
1333-86-4
3.32 E-03
5.10 E-04
5.10 E-04
3.83 E-04
1.28 E-04
1.28 E-04
2.55 E-05
5.00 E-03
Homogeneous Material Level
Percentage (%)
PPM
66.34
663400
10.20
102000
10.20
102000
7.65
76530
2.55
25500
2.55
25500
0.51
5100
100.00
1000030
Percentage (%)
0.97
0.15
0.15
0.11
0.04
0.04
0.01
1.46
Component Level
Homogeneous Material Level
Percentage (%)
PPM
86.20
862000
6.00
60000
6.00
60000
1.50
15000
0.30
3000
100.00
1000000
Percentage (%)
40.84
2.84
2.84
0.71
0.142
47.37
Homogeneous Material Level
Percentage (%)
PPM
5.85
58497
26.08
260809
10.43
104324
5.22
52162
5.22
52162
5.22
52162
52.16
521618
3.51
35133
1.84
18369
1.61
16123
0.63
6257
0.31
3128
0.05
481
0.04
401
0.03
321
8.02
80213
33.64
336357
96.50
965000
3.00
30000
0.50
5000
100.00
1000000
0.33
3314
100.00
1000000
Percentage (%)
1.41
6.29
2.51
1.26
1.26
1.26
12.57
0.85
0.44
0.39
0.15
0.08
0.01
0.01
0.01
1.93
8.11
0.08
0.002
0.0004
0.08
0.08
24
Homogeneous Material Level
Percentage (%)
PPM
96.50
965000
3.00
30000
0.50
5000
100
1000000
Percentage (%)
16.29
0.51
0.08
16.88
Homogeneous Material Level
Percentage (%)
PPM
100
1000000
Percentage (%)
6.29
Homogeneous Material Level
Percentage (%)
PPM
98.20
982000
1.80
18000
100.00
1000000
Percentage (%)
3.63
0.07
3.70
Homogeneous Material Level
Percentage (%)
PPM
67.95
679500
14.56
145600
5.83
58300
5.83
58300
5.83
58300
100.00
1000000
Percentage (%)
0.03
0.01
0.003
0.003
0.003
0.05
Homogeneous Material Level
Percentage (%)
PPM
90.85
908532
6.86
68554
Percentage (%)
0.142
0.011
PPM
9654
1484
1484
1114
371
371
74
14553
Mold Compound
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Description
Copper & its alloys
Composite
Others
Thermoset
Thermoset
Thermoset
Other organic materials
Other inorganic materials
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Copper & its alloys
Tin & its alloys
Tin & its alloys
Tin & its alloys
Substance
Copper Foil
Glass Cloth
Inorganic Filler
Epoxy Resin
Flame Resistant Epoxy Resin
Heat Resistant Resin
Laminate Core Subtotal
Acrylic resin
Barium sulfate, Silica, Talc
Epoxy Resin
Acrylic Monomer
Aromatic Carbonyl Compound
Leveling Agents & others
Amine Compound
Phthalocyanine Blue, Organic Pigment
Soldermask Subtotal
Copper plating
Tin
Silver
Copper
SOP Subtotal
SOP Subtotal
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
1.40 E-01
9.77 E-03
9.77 E-03
2.44 E-03
4.88 E-04
1.63 E-01
CAS#
Weight (g)
7440-50-8
65997-17-3
Proprietary
7328-97-4
Proprietary
Proprietary
4.84 E-03
2.16 E-02
8.64 E-03
4.32 E-03
4.32 E-03
4.32 E-03
4.32 E-02
2.91 E-03
1.52 E-03
1.34 E-03
5.18 E-04
2.59 E-04
3.99 E-05
3.32 E-05
2.66 E-05
6.64 E-03
2.79 E-02
2.65 E-04
8.23 E-06
1.37 E-06
2.74 E-04
2.74 E-04
8.28 E-02
Proprietary
7727-43-7 / 14807-96-6
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
7440-50-8
7440-31-5
7440-22-4
7440-50-8
Subtotal
Component Level
PPM
408353
28424
28424
7106
1421
473728
Component Level
PPM
14101
62868
25147
12574
12574
12574
125737
8469
4428
3886
1508
754
116
97
77
19336
81079
771
24
4
799
799
241051
Solder Ball
Substance
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Tin
Silver
Copper
CAS#
Weight (g)
7440-31-5
7440-22-4
7440-50-8
5.60 E-02
1.74 E-03
2.90 E-04
5.80 E-02
Component Level
PPM
162856
5063
844
168763
Chip
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Weight (g)
7440-21-3
2.16 E-02
Component Level
PPM
62923
Solder Bump
Description
Tin & its alloys
Tin & its alloys
Subtotal
Substance
Tin
Silver
CAS#
Weight (g)
7440-31-5
7440-22-4
1.25 E-02
2.29 E-04
1.27 E-02
Component Level
PPM
36293
665
36958
Polyimide
Description
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Subtotal
Substance
Resin
Tetraethylene Glycol Dimethacrylate
Trifluoroacetic Anhydride
4,4'-Oxydiphthalic Anhydride
2-Hydroxyethyl Methacrylate
CAS#
Weight (g)
Proprietary
109-17-1
407-25-0
1823-59-2
868-77-9
1.08 E-04
2.31 E-05
9.25 E-06
9.25 E-06
9.25 E-06
1.59 E-04
Component Level
PPM
314
67
27
27
27
462
UBM
Description
Substance
CAS#
Weight (g)
Component Level
PPM
Nickel and its alloys
Copper & its alloys
Nickel
Copper
7440-02-0
7440-50-8
4.88 E-04
3.68 E-05
Other non-ferrous metals and
alloys
Titanium
7440-32-6
1.23 E-05
2.29
22914
0.004
36
5.37 E-04
100.00
1000000
0.16
1562
Weight (g)
3.44 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100.00
1419
107
PPM
1000000