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Product / Package Information
Environmental Compliance Information
Package
Body Size
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
PDIP
300 mils
20
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy Resin
Phenol Resin
Epoxy Cresol Novolac
Carbon Black
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
29690-82-2
1333-86-3
8.24 E-01
4.70 E-02
4.70 E-02
1.88 E-02
2.82 E-03
9.40 E-01
CAS#
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
4.30 E-01
1.00 E-02
5.57 E-04
1.07 E-04
4.41 E-01
Homogeneous Material Level
Percentage (%)
PPM
87.7
877000
5.0
50000
5.0
50000
2.0
20000
0.3
3000
100
1000000
Percentage (%)
58.30
3.32
3.32
1.33
0.20
66.47
Homogeneous Material Level
Percentage (%)
PPM
97.57
975706
2.28
22789
0.13
1263
0.02
242
100.00
1000000
Percentage (%)
30.43
0.71
0.04
0.01
31.19
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Percentage (%)
0.07
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Percentage (%)
1.56
Homogeneous Material Level
Percentage (%)
PPM
99.99
1000000
Percentage (%)
0.02
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Percentage (%)
0.64
Homogeneous Material Level
Percentage (%)
PPM
80
800000
15
150000
5
50000
100
1000000
Percentage (%)
0.04
0.01
0 00
0.00
0.05
PPM
Percentage (%)
100.00
PPM
Component Level
PPM
582962
33236
33236
13294
1994
664723
Leadframe
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
Component Level
PPM
304309
7108
394
76
311886
Internal Leadframe Plating
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
7440-22-4
9.21 E-04
Component Level
PPM
652
External Leadframe Plating
Description
Tin & its alloys
Substance
Tin
CAS#
Weight (g)
7440-31-5
2.21 E-02
Component Level
PPM
15600
Bond Wires
Description
Precious metals
Substance
Gold
CAS#
Weight (g)
7440-57-5
2.46 E-04
Component Level
PPM
174
Chip
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
Weight (g)
7440-21-3
9.08 E-03
Component Level
PPM
6422
Die Attach
Description
Precious metals
Thermosets
Others
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
Curing agent & hardener
CAS#
Weight (g)
7440-22-4
Proprietary
Proprietary
6.14 E-04
1.15 E-04
3 83 E-05
3.83
7.67 E-04
Weight (g)
1.41 E+00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
434
81
27
542
1000000
Product / Package Information
Environmental Compliance Information
Package
Body Size
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
PDIP
300 mils
20
85Sn15Pb
No
No
Yes
Yes
Materials Declaration
Molding Compound
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy Resin
Phenol Resin
Epoxy Cresol Novolac
Carbon Black
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
29690-82-2
1333-86-3
8.24 E-01
4.70 E-02
4.70 E-02
1.88 E-02
2.82 E-03
9.40 E-01
Homogeneous Material Level
Percentage (%)
PPM
87.7
877000
5.0
50000
5.0
50000
2.0
20000
0.3
3000
100
1000000
Component Level
Percentage (%)
PPM
58.30
582962
3.32
33236
3.32
33236
1.33
13294
0.20
1994
66.47
664723
Homogeneous Material Level
Percentage (%)
PPM
97.57
975706
2.28
22789
0.13
1263
0.02
242
1000000
100.00
Component Level
Percentage (%)
PPM
30.43
304309
0.71
7108
0.04
394
0.01
76
31.19
311886
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
0.07
652
Homogeneous Material Level
Percentage (%)
PPM
85.0
850000
15.0
150000
100.0
1000000
Component Level
Percentage (%)
PPM
1.33
0.23
1.56
13260
2340
15600
Homogeneous Material Level
Percentage (%)
PPM
99.99
1000000
Component Level
Percentage (%)
PPM
0.02
174
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
0.64
6422
Homogeneous Material Level
Percentage (%)
PPM
80
800000
15
150000
5
50000
100
1000000
Component Level
Percentage (%)
PPM
0.04
0.01
0.00
0.05
434
81
27
542
Leadframe
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
4.30 E-01
1.00 E-02
5.57 E-04
1.07 E-04
4.41 E-01
Internal Leadframe Plating
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
7440-22-4
9.21 E-04
External Leadframe Plating
Description
Tin & its alloys
Tin & its alloys
Subtotal
Substance
Tin
Lead
CAS#
Weight (g)
7440-31-5
7439-92-1
1.87 E-02
3.31 E-03
2.21 E-02
Bond Wires
Description
Precious metals
Substance
Gold
CAS#
Weight (g)
7440-57-5
2.46 E-04
Chip
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Weight (g)
7440-21-3
9.08 E-03
Die Attach
Description
Precious metals
Thermosets
Others
Subtotal
Substance
Silver
Epoxy Resin
Curing agent & hardener
CAS#
Weight (g)
7440-22-4
Proprietary
Proprietary
6.14 E-04
1.15 E-04
3.83 E-05
7.67 E-04
Weight (g)
1.41 E+00
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100.00
PPM
1000000