Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish CSP BGA 19 X 19 425 SnAgCu RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size 0.45 mm Yes Yes No Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Component Level Weight (g) CAS# 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 2.49 E-01 1.73 E-02 1.73 E-02 4.34 E-03 8.67 E-04 2.89 E-01 Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.0 862000 60000 60000 15000 3000 1000000 33.85 2.36 2.36 0.59 0.12 39.26 PPM 338463 23559 23559 5890 1178 392648 Laminate Homogeneous Material Level Description Copper & its alloys Other inorganic materials Thermoset Substance CAS# Copper Foil Glass Cloth Core Resin 7440-50-8 Proprietary Proprietary 4.16 E-02 4.16 E-02 2.60 E-02 1.09 E-01 1.34 E-02 1.19 E-02 6.81 E-03 4.99 E-03 4.78 E-03 3.90 E-03 1.98 E-03 1.35 E-03 1.30 E-03 6.76 E-04 4.78 E-04 1.77 E-04 1.30 E-04 1.35 E-04 1.56 E-05 5.20 E-02 8.32 E-02 1.30 E-02 E 02 2.60 E-03 2.60 E-01 Laminate Core Subtotal Thermoset Other inorganic materials Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Other inorganic materials Other inorganic materials Other inorganic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal Soldermask Acrylate Resin Barium Sulfate Epoxy Resin Dipropylene glycol monomethyl ethe Solvent naphta (petroleum), Heavy arom Diethylene glycol monoethyl ether acetate Acrylic Ester Monomer Talc Morpholine Derivatives Urethane Resin Silane Compounds Triazine derivatives Pigment Green Silica Pigment Yellow Soldermask Subtotal Copper Nickel Gold Proprietary 7727-43-7 Proprietary 34590-94-8 64742-94-5 112-15-2 Proprietary 14807-96-6 Proprietary Proprietary Proprietary Proprietary 328-53-6 7631-86-9 5468-75-7 Substance CAS# Component Level Weight (g) 7440-50-8 7440-02-0 7440 02 0 7440-57-5 Percentage (%) PPM Percentage (%) 16.00 16.00 10.00 42.00 5.16 4.56 2.62 1.92 1.84 1.50 0.76 0.52 0.50 0.26 0.18 0.07 0.050 0.052 0.006 20.00 32.0 5.0 1.0 100.0 160000 160000 100000 420000 51600 45600 26200 19200 18400 15000 7600 5200 5000 2600 1840 680 500 520 60 200000 320000 50000 10000 1000000 5.65 5.65 3.53 14.83 1.82 1.61 0.92 0.68 0.65 0.53 0.27 0.18 0.18 0.09 0.06 0.024 0.018 0.018 0.002 7.06 11.30 1.77 0.35 35 PPM 56485 56485 35303 148272 18216 16098 9249 6778 6496 5295 2683 1836 1765 918 650 240 177 184 21 70606 112969 17651 3530 353028 Solder Ball Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Tin Silver Copper Component Level Weight (g) 7440-31-5 7440-22-4 7440-50-8 1.45 E-01 4.50 E-03 7.51 E-04 1.50 E-01 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 19.68 0.61 0.10 20.39 PPM 196756 6117 1019 203893 Bond Wires Homogeneous Material Level Substance Description Precious metals Gold Component Level Weight (g) CAS# 3.07 E-03 7440-57-5 Percentage (%) PPM Percentage (%) 99.99 1000000 0.42 PPM 4174 Chip Homogeneous Material Level Description Other inorganic materials Substance CAS# Doped Silicon Component Level Weight (g) 7440-21-3 3.05 E-02 Percentage (%) PPM Percentage (%) 100 1000000 4.14 PPM 41421 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Other organic materials Thermoset Subtotal Substance CAS# Silver Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin 7440-22-4 Proprietary Proprietary Proprietary Proprietary Proprietary 2.35 E-03 5.89 E-04 2.21 E-04 2.21 E-04 8.83 E-05 8.83 E-05 3.56 E-03 Weight (g) 7.36 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 66.11 16.53 6.20 6.20 2.48 2.48 100.00 661100 165300 62000 62000 24800 24800 1000000 0.32 0.08 0.03 0.03 0.01 0.01 0.48 Percentage (%) 100.00 PPM 3197 799 300 300 120 120 4836 PPM 1000000