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Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
CSP BGA
19 X 19
425
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size
0.45 mm
Yes
Yes
No
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Component Level
Weight (g)
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
2.49 E-01
1.73 E-02
1.73 E-02
4.34 E-03
8.67 E-04
2.89 E-01
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.0
862000
60000
60000
15000
3000
1000000
33.85
2.36
2.36
0.59
0.12
39.26
PPM
338463
23559
23559
5890
1178
392648
Laminate
Homogeneous Material Level
Description
Copper & its alloys
Other inorganic materials
Thermoset
Substance
CAS#
Copper Foil
Glass Cloth
Core Resin
7440-50-8
Proprietary
Proprietary
4.16 E-02
4.16 E-02
2.60 E-02
1.09 E-01
1.34 E-02
1.19 E-02
6.81 E-03
4.99 E-03
4.78 E-03
3.90 E-03
1.98 E-03
1.35 E-03
1.30 E-03
6.76 E-04
4.78 E-04
1.77 E-04
1.30 E-04
1.35 E-04
1.56 E-05
5.20 E-02
8.32 E-02
1.30 E-02
E 02
2.60 E-03
2.60 E-01
Laminate Core Subtotal
Thermoset
Other inorganic materials
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Other inorganic materials
Other inorganic materials
Other inorganic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Soldermask Acrylate Resin
Barium Sulfate
Epoxy Resin
Dipropylene glycol monomethyl ethe
Solvent naphta (petroleum), Heavy arom
Diethylene glycol monoethyl ether acetate
Acrylic Ester Monomer
Talc
Morpholine Derivatives
Urethane Resin
Silane Compounds
Triazine derivatives
Pigment Green
Silica
Pigment Yellow
Soldermask Subtotal
Copper
Nickel
Gold
Proprietary
7727-43-7
Proprietary
34590-94-8
64742-94-5
112-15-2
Proprietary
14807-96-6
Proprietary
Proprietary
Proprietary
Proprietary
328-53-6
7631-86-9
5468-75-7
Substance
CAS#
Component Level
Weight (g)
7440-50-8
7440-02-0
7440 02 0
7440-57-5
Percentage (%)
PPM
Percentage (%)
16.00
16.00
10.00
42.00
5.16
4.56
2.62
1.92
1.84
1.50
0.76
0.52
0.50
0.26
0.18
0.07
0.050
0.052
0.006
20.00
32.0
5.0
1.0
100.0
160000
160000
100000
420000
51600
45600
26200
19200
18400
15000
7600
5200
5000
2600
1840
680
500
520
60
200000
320000
50000
10000
1000000
5.65
5.65
3.53
14.83
1.82
1.61
0.92
0.68
0.65
0.53
0.27
0.18
0.18
0.09
0.06
0.024
0.018
0.018
0.002
7.06
11.30
1.77
0.35
35
PPM
56485
56485
35303
148272
18216
16098
9249
6778
6496
5295
2683
1836
1765
918
650
240
177
184
21
70606
112969
17651
3530
353028
Solder Ball
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Tin
Silver
Copper
Component Level
Weight (g)
7440-31-5
7440-22-4
7440-50-8
1.45 E-01
4.50 E-03
7.51 E-04
1.50 E-01
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
19.68
0.61
0.10
20.39
PPM
196756
6117
1019
203893
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Gold
Component Level
Weight (g)
CAS#
3.07 E-03
7440-57-5
Percentage (%)
PPM
Percentage (%)
99.99
1000000
0.42
PPM
4174
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
CAS#
Doped Silicon
Component Level
Weight (g)
7440-21-3
3.05 E-02
Percentage (%)
PPM
Percentage (%)
100
1000000
4.14
PPM
41421
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Thermoset
Subtotal
Substance
CAS#
Silver
Polymeric material
Acrylate resin
Diester resin
Functionalized urethane resin
Epoxy resin
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
2.35 E-03
5.89 E-04
2.21 E-04
2.21 E-04
8.83 E-05
8.83 E-05
3.56 E-03
Weight (g)
7.36 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
66.11
16.53
6.20
6.20
2.48
2.48
100.00
661100
165300
62000
62000
24800
24800
1000000
0.32
0.08
0.03
0.03
0.01
0.01
0.48
Percentage (%)
100.00
PPM
3197
799
300
300
120
120
4836
PPM
1000000