Materials Declaration Package Body Size Ball Count Option CSP BGA 17 X 17 mm 400 Pb-free, Halide-free - excludes laminate 0.45 mm Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Item Continuous Filament Fiber Glass Copper Bismaleimide / Triazine Epoxy resin Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Laminate % of Laminate 25.8 11.4 Ortho-Cresol, Polymer with 1-Chloro-2,3-Epoxypropane and Formaldehyde Brominated epoxy resin Diglycidyl ether of bisphenol A-based epoxy resins Subtotal Cu Solvent naphtha (petroleum), Heavy arom. Talc containing no asbestiform fibers Barium Sulfate Morpholine derivative Dipropylene glycol monomethyl ether Subtotal Ni Au Subtotal Sn Ag Cu Subtotal Au 12.4 Weight (g) 3.71 E-01 2.58 E-02 2.58 E-02 6.45 E-03 1.29 E-03 4.30 E-01 PPM 322732 22464 22464 5616 1123 374399 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Draft IEC 62321. ICP-OES. None Detected Draft IEC 62321. ICP-OES. None Detected Draft IEC 62321. ICP-OES. None Detected None Detected Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. None Detected Draft IEC 62321. GC-MSD. None Detected Weight (g) 1.37 E-01 6.06 E-02 PPM 119276 52770 Item Pb Cd Hg Cr+6 Die Attach Paste Method PPM Draft IEC 62321. ICP-OES. None Detected Draft IEC 62321. ICP-OES. None Detected None Detected Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. None Detected 6.59 E-02 57349 PBB PBDE None Detected None Detected 49.6 45.6 2.64 E-01 2.42 E-01 229394 210894 3.5 1.1 0.2 1.86 E-02 5.85 E-03 1.06 E-03 5.31 E-01 16187 5087 925 462488 Weight (g) 1.36 E-01 4.24 E-03 7.06 E-04 1.41 E-01 PPM 118661 3689 615 122965 Weight (g) 8.16 E-03 PPM 7097 Weight (g) 3.41 E-02 PPM 29645 Weight (g) 2.59 E-03 6.47 E-04 2.43 E-04 2.43 E-04 9.71 E-05 9.71 E-05 3.91 E-03 PPM 2252 563 211 211 84 84 3406 Package Totals Weight (g) 1.15 E+00 PPM 1000000 Solder Ball % of Solder Ball 96.5 3 0.5 Bond Wires % of Wire 99.99 Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Chip Si Item Silver Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin Subtotal % of Chip 100 Die Attach % of Die Attach 66.11 16.53 6.2 6.2 2.48 2.48 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary STS-BC-AB