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Materials Declaration
Package
Body Size
Ball Count
Option
CSP BGA
17 X 17 mm
400
Pb-free, Halide-free - excludes laminate
0.45 mm
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Item
Continuous Filament Fiber Glass
Copper
Bismaleimide / Triazine
Epoxy resin
Molding Compound
% of Compound
86.2
6.0
6.0
1.5
0.3
Laminate
% of Laminate
25.8
11.4
Ortho-Cresol, Polymer with 1-Chloro-2,3-Epoxypropane and
Formaldehyde
Brominated epoxy resin
Diglycidyl ether of bisphenol A-based epoxy resins
Subtotal
Cu
Solvent naphtha (petroleum), Heavy arom.
Talc containing no asbestiform fibers
Barium Sulfate
Morpholine derivative
Dipropylene glycol monomethyl ether
Subtotal
Ni
Au
Subtotal
Sn
Ag
Cu
Subtotal
Au
12.4
Weight (g)
3.71 E-01
2.58 E-02
2.58 E-02
6.45 E-03
1.29 E-03
4.30 E-01
PPM
322732
22464
22464
5616
1123
374399
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Draft IEC 62321. ICP-OES.
None Detected
Draft IEC 62321. ICP-OES.
None Detected
Draft IEC 62321. ICP-OES.
None Detected
None Detected
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
None Detected
Draft IEC 62321. GC-MSD.
None Detected
Weight (g)
1.37 E-01
6.06 E-02
PPM
119276
52770
Item
Pb
Cd
Hg
Cr+6
Die Attach Paste
Method
PPM
Draft IEC 62321. ICP-OES.
None Detected
Draft IEC 62321. ICP-OES.
None Detected
None Detected
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
None Detected
6.59 E-02
57349
PBB
PBDE
None Detected
None Detected
49.6
45.6
2.64 E-01
2.42 E-01
229394
210894
3.5
1.1
0.2
1.86 E-02
5.85 E-03
1.06 E-03
5.31 E-01
16187
5087
925
462488
Weight (g)
1.36 E-01
4.24 E-03
7.06 E-04
1.41 E-01
PPM
118661
3689
615
122965
Weight (g)
8.16 E-03
PPM
7097
Weight (g)
3.41 E-02
PPM
29645
Weight (g)
2.59 E-03
6.47 E-04
2.43 E-04
2.43 E-04
9.71 E-05
9.71 E-05
3.91 E-03
PPM
2252
563
211
211
84
84
3406
Package Totals
Weight (g)
1.15 E+00
PPM
1000000
Solder Ball
% of Solder Ball
96.5
3
0.5
Bond Wires
% of Wire
99.99
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Chip
Si
Item
Silver
Polymeric material
Acrylate resin
Diester resin
Functionalized urethane resin
Epoxy resin
Subtotal
% of Chip
100
Die Attach
% of Die Attach
66.11
16.53
6.2
6.2
2.48
2.48
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
STS-BC-AB