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Product / Package Information
Environmental Information
Package
Body Size (mm)
Ball Count
Terminal Finish
CSP BGA
15 X 15
260
SnAgCu
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Ball Size
0.45 mm
Yes
Yes
No
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
CAS#
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
3.88 E-01
2.70 E-02
2.70 E-02
6.76 E-03
1.35 E-03
4.50 E-01
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.0
862000
60000
60000
15000
3000
1000000
53.41
3.72
3.72
0.93
0.19
61.96
PPM
534069
37174
37174
9294
1859
619570
Laminate
Homogeneous Material Level
Description
Copper & its alloys
Other inorganic materials
Thermoset
Substance
CAS#
Copper Foil
Glass Cloth
Core Resin
7440-50-8
Proprietary
Proprietary
3.49 E-02
3.49 E-02
2.18 E-02
9.15 E-02
1.20 E-02
1.06 E-02
6.11 E-03
4.48 E-03
4.29 E-03
3.50 E-03
1.77 E-03
1.21 E-03
1.17 E-03
6.07 E-04
4.29 E-04
1.59 E-04
1.17 E-04
1.21 E-04
1.40 E-05
4.67 E-02
2.17 E-02
1.94 E-03
E 03
1.62 E-04
1.62 E-01
Laminate Core Subtotal
Thermoset
Other inorganic materials
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Other inorganic materials
Other inorganic materials
Other inorganic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
Soldermask Acrylate Resin
Barium Sulfate
Epoxy Resin
Dipropylene glycol monomethyl ethe
Solvent naphta (petroleum), Heavy arom
Diethylene glycol monoethyl ether acetate
Acrylic Ester Monomer
Talc
Morpholine Derivatives
Urethane Resin
Silane Compounds
Triazine derivatives
Pigment Green
Silica
Pigment Yellow
Soldermask Subtotal
Copper
Nickel
Gold
Proprietary
7727-43-7
Proprietary
34590-94-8
64742-94-5
112-15-2
Proprietary
14807-96-6
Proprietary
Proprietary
Proprietary
Proprietary
328-53-6
7631-86-9
5468-75-7
Substance
CAS#
Component Level
Weight (g)
7440-50-8
7440-02-0
7440 02 0
7440-57-5
Percentage (%)
PPM
Percentage (%)
21.52
21.52
13.45
56.50
7.43
6.57
3.77
2.76
2.65
2.16
1.09
0.75
0.72
0.37
0.26
0.10
0.072
0.075
0.009
28.80
13.4
1.2
0.1
100.0
215238
215238
134524
565000
74304
65664
37728
27648
26496
21600
10944
7488
7200
3744
2650
979
720
749
86
288000
134000
12000
1000
1000000
4.80
4.80
3.00
12.59
1.66
1.46
0.84
0.62
0.59
0.48
0.24
0.17
0.16
0.08
0.06
0.022
0.016
0.017
0.002
6.42
2.99
0.27
0.02
22
PPM
47957
47957
29973
125887
16556
14631
8406
6160
5904
4813
2438
1668
1604
834
590
218
160
167
19
64169
29856
2674
223
222809
Solder Ball
Homogeneous Material Level
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Tin
Silver
Copper
Component Level
Weight (g)
7440-31-5
7440-22-4
7440-50-8
8.86 E-02
2.76 E-03
4.59 E-04
9.18 E-02
Percentage (%)
PPM
Percentage (%)
96.50
3.00
0.50
100
965000
30000
5000
1000000
12.19
0.38
0.06
12.63
PPM
121888
3789
632
126309
Bond Wires
Homogeneous Material Level
Description
Precious metals
Precious metals
Subtotal
CAS#
Substance
Gold
Palladium
Component Level
Weight (g)
2.08 E-03
2.11 E-05
2.11 E-03
7440-57-5
7440-05-3
Percentage (%)
PPM
Percentage (%)
99.0
1.0
100
990000
10000
1000000
0.29
0.003
0.29
PPM
2867
29
2896
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
Component Level
Weight (g)
CAS#
7440-21-3
1.85 E-02
Percentage (%)
PPM
Percentage (%)
100
1000000
2.54
PPM
25445
Die Attach
Homogeneous Material Level
Description
Other organic materials
Thermoset
Other organic materials
Other organic materials
Subtotal
Substance
CAS#
Diester resin
Epoxy resin
Functionalized ester
Polymeric material
Proprietary
Proprietary
Proprietary
Proprietary
1.05 E-03
4.67 E-04
4.67 E-04
1.75 E-04
2.16 E-03
Weight (g)
7.27 E-01
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
48.7
21.6
21.6
8.1
100.00
486600
216200
216200
81000
1000000
0.14
0.06
0.06
0.02
0.30
Percentage (%)
100.00
PPM
1446
642
642
241
2971
PPM
1000000