Product / Package Information Environmental Information Package Body Size (mm) Ball Count Terminal Finish CSP BGA 15 X 15 260 SnAgCu RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Ball Size 0.45 mm Yes Yes No Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Substance CAS# Silica Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 3.88 E-01 2.70 E-02 2.70 E-02 6.76 E-03 1.35 E-03 4.50 E-01 Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.0 862000 60000 60000 15000 3000 1000000 53.41 3.72 3.72 0.93 0.19 61.96 PPM 534069 37174 37174 9294 1859 619570 Laminate Homogeneous Material Level Description Copper & its alloys Other inorganic materials Thermoset Substance CAS# Copper Foil Glass Cloth Core Resin 7440-50-8 Proprietary Proprietary 3.49 E-02 3.49 E-02 2.18 E-02 9.15 E-02 1.20 E-02 1.06 E-02 6.11 E-03 4.48 E-03 4.29 E-03 3.50 E-03 1.77 E-03 1.21 E-03 1.17 E-03 6.07 E-04 4.29 E-04 1.59 E-04 1.17 E-04 1.21 E-04 1.40 E-05 4.67 E-02 2.17 E-02 1.94 E-03 E 03 1.62 E-04 1.62 E-01 Laminate Core Subtotal Thermoset Other inorganic materials Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Other inorganic materials Other inorganic materials Other inorganic materials Copper & its alloys Nickel & its alloys Precious metals Subtotal Soldermask Acrylate Resin Barium Sulfate Epoxy Resin Dipropylene glycol monomethyl ethe Solvent naphta (petroleum), Heavy arom Diethylene glycol monoethyl ether acetate Acrylic Ester Monomer Talc Morpholine Derivatives Urethane Resin Silane Compounds Triazine derivatives Pigment Green Silica Pigment Yellow Soldermask Subtotal Copper Nickel Gold Proprietary 7727-43-7 Proprietary 34590-94-8 64742-94-5 112-15-2 Proprietary 14807-96-6 Proprietary Proprietary Proprietary Proprietary 328-53-6 7631-86-9 5468-75-7 Substance CAS# Component Level Weight (g) 7440-50-8 7440-02-0 7440 02 0 7440-57-5 Percentage (%) PPM Percentage (%) 21.52 21.52 13.45 56.50 7.43 6.57 3.77 2.76 2.65 2.16 1.09 0.75 0.72 0.37 0.26 0.10 0.072 0.075 0.009 28.80 13.4 1.2 0.1 100.0 215238 215238 134524 565000 74304 65664 37728 27648 26496 21600 10944 7488 7200 3744 2650 979 720 749 86 288000 134000 12000 1000 1000000 4.80 4.80 3.00 12.59 1.66 1.46 0.84 0.62 0.59 0.48 0.24 0.17 0.16 0.08 0.06 0.022 0.016 0.017 0.002 6.42 2.99 0.27 0.02 22 PPM 47957 47957 29973 125887 16556 14631 8406 6160 5904 4813 2438 1668 1604 834 590 218 160 167 19 64169 29856 2674 223 222809 Solder Ball Homogeneous Material Level Description Tin & its alloys Tin & its alloys Tin & its alloys Subtotal Tin Silver Copper Component Level Weight (g) 7440-31-5 7440-22-4 7440-50-8 8.86 E-02 2.76 E-03 4.59 E-04 9.18 E-02 Percentage (%) PPM Percentage (%) 96.50 3.00 0.50 100 965000 30000 5000 1000000 12.19 0.38 0.06 12.63 PPM 121888 3789 632 126309 Bond Wires Homogeneous Material Level Description Precious metals Precious metals Subtotal CAS# Substance Gold Palladium Component Level Weight (g) 2.08 E-03 2.11 E-05 2.11 E-03 7440-57-5 7440-05-3 Percentage (%) PPM Percentage (%) 99.0 1.0 100 990000 10000 1000000 0.29 0.003 0.29 PPM 2867 29 2896 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon Component Level Weight (g) CAS# 7440-21-3 1.85 E-02 Percentage (%) PPM Percentage (%) 100 1000000 2.54 PPM 25445 Die Attach Homogeneous Material Level Description Other organic materials Thermoset Other organic materials Other organic materials Subtotal Substance CAS# Diester resin Epoxy resin Functionalized ester Polymeric material Proprietary Proprietary Proprietary Proprietary 1.05 E-03 4.67 E-04 4.67 E-04 1.75 E-04 2.16 E-03 Weight (g) 7.27 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 48.7 21.6 21.6 8.1 100.00 486600 216200 216200 81000 1000000 0.14 0.06 0.06 0.02 0.30 Percentage (%) 100.00 PPM 1446 642 642 241 2971 PPM 1000000