PDF

Product / Package Information
Environmental Compliance Information
Package
Body Size
Lead Count
Terminal Finish
Ball Size
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
CSPBGA
12 X 12
184
SnAgCu
0.45
MS011817B
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Substance
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
1.53 E-01
1.06 E-02
1.06 E-02
2.66 E-03
5.31 E-04
1.77 E-01
Substance
CAS#
Weight (g)
Pre-preg Filler
Pre-preg Resin
Pre-preg Glass Cloth
Core Glass Cloth
Copper Foil
Core Resin
Core Filler
Laminate Core Subtotal
Barium Sulfate
Epoxy Resin
Dipropylene glycol monomethyl ether
Solvent naphta (petroleum), Heavy arom
Talc
Morpholine Derivatives
Silica
Soldermask Subtotal
Copper
Nickel
Gold
Proprietary
7328-97-4
65997-17-3
65997-17-3
7440-50-8
Proprietary
7631-86-9
1.73 E-02
2.59 E-02
1.44 E-02
8.64 E-03
2.25 E-02
6.47 E-03
5.63 E-03
1.01 E-01
4.36 E-03
2.13 E-03
2.22 E-03
9.12 E-05
3.83 E-04
3.83 E-04
9.12 E-05
9.66 E-03
6.95 E-02
2.22 E-03
1.64 E-04
1.82 E-01
Substance
CAS#
Weight (g)
7440-31-5
7440-22-4
7440-50-8
6.28 E-02
1.95 E-03
3.25 E-04
6.51 E-02
CAS#
Weight (g)
7440-57-5
2.83 E-03
Silica
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Homogeneous Material Level
Percentage (%)
PPM
862000
86.20
60000
6.00
60000
6.00
15000
1.50
3000
0.30
100.00
1000000
Component Level
Percentage (%)
34.83
2.42
2.42
0.61
0.12
40.40
PPM
348268
24241
24241
6060
1212
404023
Laminate
Description
Other inorganic materials
Thermoset
Composite
Composite
Copper & its alloys
Thermoset
Other inorganic materials
Thermoset
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Other inorganic materials
Copper & its alloys
Nickel & its alloys
Precious metals
Subtotal
7727-43-7
85954-11-6
34590-94-8
64742-94-5
14807-96-6
Proprietary
Proprietary
7440-50-8
7440-02-0
7440-57-5
Homogeneous Material Level
PPM
Percentage (%)
94800
9.48
14.22
79000
7.90
4.74
47400
123200
12.32
3.55
35500
3.09
30900
410800
55.30
2.39
23900
1.17
11700
1.22
12200
0.05
500
0.21
2100
0.21
2100
0.05
500
5.30
53000
38.09
380900
1.22
12200
0.09
900
100.00
857800
Component Level
Percentage (%)
3.94
PPM
39443
32869
19721
51259
14770
12856
170918
9944
4868
5076
208
874
874
208
22051
158478
5076
374
356898
3.29
1.97
5.13
1.48
1.29
17.09
0.99
0.49
0.51
0.02
0.09
0.09
0.02
2.21
15.85
0.51
0.04
35.69
Solder Ball
Description
Tin & its alloys
Tin & its alloys
Tin & its alloys
Subtotal
Tin
Silver
Copper
Homogeneous Material Level
PPM
Percentage (%)
965000
96.50
30000
3.00
5000
0.50
100.0
1000000
Percentage (%)
14.32
0.45
0.07
14.84
Component Level
Homogeneous Material Level
PPM
Percentage (%)
100.0
1000000
Percentage (%)
0.65
Homogeneous Material Level
PPM
Percentage (%)
100.0
1000000
Percentage (%)
2.33
Homogeneous Material Level
PPM
Percentage (%)
48.30
483000
31.25
312500
8.52
85200
8.52
85200
3.41
34100
100.00
1000000
Percentage (%)
0.08
0.05
0.01
0.01
0.01
0.17
PPM
Percentage (%)
94.08
PPM
PPM
143248
4453
742
148444
Bond Wires
Substance
Description
Precious metals
Gold
Component Level
PPM
6451
Chip
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
Weight (g)
7440-21-3
1.02 E-02
Component Level
PPM
23273
Die Attach
Description
Other inorganic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Subtotal
Package Totals
Substance
Silicon dioxide
Bismaleimide monomer
Acrylate monomer
Epoxy resin
Acryric resin
CAS#
Weight (g)
60676-86-0
TS #10049
TS #10050
TS #10042
TS #10051
3.70 E-04
2.39 E-04
6.53 E-05
6.53 E-05
2.61 E-05
7.66 E-04
Weight (g)
4.38 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Component Level
844
546
149
149
60
1748
940836