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Materials Declaration
Package
Body Size
Ball Count
Option
CSP BGA
6X6
64
SnAgCu
0.40 mm
Ball Size
Item
SiO2 Filler
Epoxy resin
Phenol Resin
Metal Hydroxide
Carbon Black
Subtotal
Item
BT Resin
Glass Fiber
Copper
Solder Mask
Nickel
Gold
Subtotal
Sn
Ag
Cu
Subtotal
Molding Compound
% of Compound
86.2
6.0
6.0
1.5
0.3
Laminate
% of Laminate
25.0
25.0
19.0
12.2
11.0
7.8
Solder Ball
% of Solder Ball
96.5
3
0.5
Weight (g)
3.40 E-02
2.37 E-03
2.37 E-03
5.92 E-04
1.18 E-04
3.95 E-02
PPM
359950
25054
25054
6263
1248
417570
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Molding Compound
Method
PPM
Not Detected
Draft IEC 62321. ICP-OES
Not Detected
Draft IEC 62321. ICP-OES
Not Detected
Draft IEC 62321. ICP-OES
Not Detected
Draft IEC 62321. UV-VIS.
Not Detected
Draft IEC 62321. GC-MSD.
Not Detected
Draft IEC 62321. GC-MSD.
Weight (g)
7.48 E-03
7.48 E-03
5.68 E-03
3.65 E-03
3.29 E-03
2.33 E-03
2.99 E-02
PPM
79119
79119
60127
38607
34809
24684
316465
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Weight (g)
1.53 E-02
4.76 E-04
7.90 E-05
1.59 E-02
PPM
162100
5036
836
167972
Die Attach Paste
Au
Bond Wires
% of Wire
99.99
Weight (g)
5.27 E-04
PPM
5576
Si
Chip
% of Chip
100
Weight (g)
7.84 E-03
PPM
82896
Weight (g)
5.95 E-04
1.49 E-04
5.60 E-05
5.60 E-05
2.20 E-05
2.20 E-05
9.00 E-04
PPM
6295
1576
592
592
233
233
9522
Item
Silver
Polymeric material
Acrylate resin
Diester resin
Functionalized urethane resin
Epoxy resin
Subtotal
Die Attach
% of Die Attach
66.11
16.53
6.2
6.2
2.48
2.48
Package Totals
Weight (g)
PPM
1000000
9.45 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
Draft IEC 62321. ICP-OES
Draft IEC 62321. ICP-OES
Draft IEC 62321. ICP-OES
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
STS-BC-AD