Materials Declaration Package Body Size Ball Count Option CSP BGA 6X6 64 SnAgCu 0.40 mm Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Subtotal Item BT Resin Glass Fiber Copper Solder Mask Nickel Gold Subtotal Sn Ag Cu Subtotal Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Laminate % of Laminate 25.0 25.0 19.0 12.2 11.0 7.8 Solder Ball % of Solder Ball 96.5 3 0.5 Weight (g) 3.40 E-02 2.37 E-03 2.37 E-03 5.92 E-04 1.18 E-04 3.95 E-02 PPM 359950 25054 25054 6263 1248 417570 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected Draft IEC 62321. ICP-OES Not Detected Draft IEC 62321. ICP-OES Not Detected Draft IEC 62321. ICP-OES Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. Weight (g) 7.48 E-03 7.48 E-03 5.68 E-03 3.65 E-03 3.29 E-03 2.33 E-03 2.99 E-02 PPM 79119 79119 60127 38607 34809 24684 316465 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 1.53 E-02 4.76 E-04 7.90 E-05 1.59 E-02 PPM 162100 5036 836 167972 Die Attach Paste Au Bond Wires % of Wire 99.99 Weight (g) 5.27 E-04 PPM 5576 Si Chip % of Chip 100 Weight (g) 7.84 E-03 PPM 82896 Weight (g) 5.95 E-04 1.49 E-04 5.60 E-05 5.60 E-05 2.20 E-05 2.20 E-05 9.00 E-04 PPM 6295 1576 592 592 233 233 9522 Item Silver Polymeric material Acrylate resin Diester resin Functionalized urethane resin Epoxy resin Subtotal Die Attach % of Die Attach 66.11 16.53 6.2 6.2 2.48 2.48 Package Totals Weight (g) PPM 1000000 9.45 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. ICP-OES Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. STS-BC-AD