Materials Declaration Package Body Size LeadCount Option Ball Size Item SiO2 Filler Epoxy resin Phenol resin Metal Hydroxide Carbon black Subtotal Item Cu Fiber glass Epoxy Resin Nickel Au Subtotal CSP_BGA - Stacked Die 8 x 8 mm 105 Pb- free 0.40 mm Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Laminate % of Laminate 40.0 31.6 25.0 3.0 0.4 Weight (g) 7.45 E-02 5.19 E-03 5.19 E-03 1.30 E-03 2.59 E-04 8.64 E-02 PPM 445509 31010 31010 7752 1550 516832 Item Pb Cd Hg Cr+6 PBB PBDE Weight (g) 1.61 E-02 1.27 E-02 1.00 E-02 1.21 E-03 1.61 E-04 4.02 E-02 PPM 96131 75943 60082 7210 961 240327 Item Weight (g) 2.51 E-02 7.79 E-04 1.41 E-04 2.60 E-02 PPM 150154 4658 844 155656 Weight (g) 4.15 E-03 4.19 E-05 4.19 E-03 PPM 24805 251 25055 Weight (g) 9.36 E-03 PPM 55971 Weight (g) 2.34 E-04 1.51 E-04 8.25 E-05 4.13 E-05 4.13 E-05 5.50 E-04 PPM 1398 904 493 247 247 3289 Weight (g) 6.00 E-05 6.00 E-05 PPM Mold Compound PPM Method None Detected Draft IEC 62321. ICP-OES. None Detected Draft IEC 62321. ICP-OES. None Detected Draft IEC 62321. ICP-OES. None Detected Draft IEC 62321. UV-VIS. None Detected Draft IEC 62321. GC-MSD. None Detected Draft IEC 62321. GC-MSD. Die Attach 1 Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach 2 Solder Ball Sn Ag Cu Subtotal Au Pd Subtotal Si Item Silicon dioxide Diester resin Functionalized ester Epoxy resin Polymeric material Subtotal Item Proprietary filler Proprietary bismaleimide Proprietary polymer Subtotal Item Silicon dioxide Diester resin Functionalized ester Epoxy resin Polymeric material Subtotal Method USEPA 3050B. ICP-AES. BS EN 1122:2001. ICP-AES. USEPA 3052. ICP-AES. USEPA 3060A & 7196A. UV-VIS. USEPA 3540C. GC/MS. USEPA 3540C. GC/MS. % of Plating 96.5 3.0 0.50 Bond Wires % of Wire 99.00 1.0 Chip % of Chip 100.0 Die Attach 1 % of Die Attach 42.5 27.5 15.0 7.5 7.5 Die Attach 2 % of Die Attach 40.0 40.0 20.0 Die Attach 3 % of Die Attach 42.5 27.5 15.0 7.5 7.5 Die Attach 3 359 359 3.00 E-05 1.50 E-04 179 897 Weight (g) 1.40 E-04 9.08 E-05 4.95 E-05 2.48 E-05 2.48 E-05 3.30 E-04 PPM Weight (g) 1.67 E-01 PPM 1000000 839 543 296 148 148 1973 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method US EPA 3050B, USEPA6010B. ICP US EPA 3050B, USEPA6010B, ICP US EPA 3052, USEPA 6010B, ICP US EPA 3060A, USEPA 7196A, UV. US EPA 3540C. GC/MS US EPA 3540C. GC/MS Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD.