Materials Declaration Package Body Size LeadCount Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Item BT Resin Solder mask Cu Ni Au CSP_BGA 12 x 12 mm 182 SnPbAg 0.45 mm Molding Compound % of Compound 86.2 6.0 6.0 1.5 0.3 Laminate % of Laminate 75.0 21.6 3.0 0.3 0.1 Weight (g) 1.36 E-01 9.47 E-03 9.47 E-03 2.37 E-03 4.74 E-04 PPM 414390 28844 28844 7211 1442 Weight (g) 5.61 E-02 1.62 E-02 2.25 E-03 2.25 E-04 7.48 E-05 PPM 170900 49219 6836 684 228 Sn Pb Ag Solder Ball % of Plating 62.0 36.0 2.00 Weight (g) 4.52 E-02 2.63 E-02 1.46 E-03 PPM 137753 79985 4444 Au Bond Wires % of Wire 99.00 Weight (g) 4.28 E-03 PPM 13025 Si Chip % of Chip 100.0 Weight (g) 1.62 E-02 PPM 49437 Die Attach % of Die Attach 70.0 10.0 10.0 5.0 5.0 Weight (g) 1.55 E-03 2.22 E-04 2.22 E-04 1.11 E-04 1.11 E-04 PPM Weight (g) 3.28 E-01 PPM 1000000 Item Ag Filler Diester Functionalized ester Epoxy resin Polymeric resin Item Pb Cd Hg Cr+6 PBB PBDE Mold Compound Method PPM None Detected USEPA3050B. ICP-AES None Detected EN 1122 Method B:2001. ICP-AES None Detected USEPA 3052. ICP-AES None Detected USEPA 3060A & USEPA 7196A None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS 4731 676 676 338 338 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/20/2006 Materials Declaration Package Body Size LeadCount Option Ball Size Item SiO2 Filler Epoxy resin Phenol Resin Metal Hydroxide Carbon Black Item BT Resin Solder mask Cu Ni Au CSP_BGA 12 x 12 mm 182 SnAgCu 0.45 mm Molding Compound % of Compound Weight (g) 86.2 1.36 E-01 6.0 9.47 E-03 6.0 9.47 E-03 1.5 2.37 E-03 0.3 4.74 E-04 Laminate % of Laminate 75.0 21.6 3.0 0.3 0.1 PPM 425648 29627 29627 7407 1481 Weight (g) 5.61 E-02 1.62 E-02 2.25 E-03 2.25 E-04 7.48 E-05 PPM 175543 50556 7022 702 234 Sn Ag Cu Solder Ball % of Plating 96.5 3.00 0.50 Weight (g) 6.20 E-02 1.93 E-03 3.21 E-04 PPM 194014 6032 1005 Au Bond Wires % of Wire 99.00 Weight (g) 4.28 E-03 PPM 13379 Si Chip % of Chip 100.0 Weight (g) 1.62 E-02 PPM 50780 Die Attach % of Die Attach 70.0 10.0 10.0 5.0 5.0 Weight (g) 1.55 E-03 2.22 E-04 2.22 E-04 1.11 E-04 1.11 E-04 PPM Weight (g) 3.20 E-01 PPM 1000000 Item Ag Filler Diester Functionalized ester Epoxy resin Polymeric resin Item Pb Cd Hg Cr+6 PBB PBDE Mold Compound Method PPM None Detected USEPA3050B. ICP-AES None Detected EN 1122 Method B:2001. ICP-AES None Detected USEPA 3052. ICP-AES None Detected USEPA 3060A & USEPA 7196A None Detected Analysis was performed by GC/MS None Detected Analysis was performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE PPM 5.00 None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS Laminate Method US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3052. ICP-OES US EPA Method 3060A & 7196A. UV-VIS Analysis was performed by GC/MS Analysis was performed by GC/MS 4860 694 694 347 347 STS-BC-P Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 9/20/2006