Product / Package Information Environmental Compliance Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOT 23 8 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 7.26 E-03 3.74 E-04 2.50 E-04 2.50 E-04 1.66 E-04 1.66 E-05 8.32 E-03 CAS# Weight (g) Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 39.72 2.05 1.37 1.37 0.91 0.09 46 PPM 397250 20477 13651 13651 9101 910 455040 Leadframe Component Level Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7.92 E-03 1.91 E-04 9.74 E-06 2.44 E-06 8.12 E-03 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 43.29 1.04 0.05 0.01 44 PPM 432892 10434 533 133 443992 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Component Level Weight (g) 8.20 E-05 Percentage (%) PPM Percentage (%) 100 1000000 0.45 PPM 4485 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) 5.24 E-04 Percentage (%) PPM Percentage (%) 100 1000000 2.87 PPM 28665 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) 1.70 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 0.93 PPM 9298 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.00 E-03 Percentage (%) PPM Percentage (%) 100 1000000 5.47 PPM 54692 Die Attach Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Others Other organic materials Subtotal Package Totals Substance Silver Carbocyclic Acrylates Bismaleimide resin 2-preponoic acid, 2-methyl Additive Dicumyl peroxide CAS# 7440-22-4 Proprietary Proprietary 68586-19-6 Proprietary 80-43-3 Component Level Weight (g) 5.64 E-05 7.00 E-06 2.10 E-06 2.10 E-06 2.10 E-06 3.50 E-07 7.00 E-05 Weight (g) 1.83 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 80.50 10.00 3.00 3.0 3.0 0.5 100.00 805000 100000 30000 30000 30000 5000 1000000 0.31 0.04 0.01 0.01 0.01 0.002 0.38 Percentage (%) 100 PPM 3082 383 115 115 115 19 3828 PPM 1000000 Product / Package Information Environmental Compliance Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOT23 - COL 8 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) 8.29 E-03 4.28 E-04 2.85 E-04 2.85 E-04 1.90 E-04 1.90 E-05 9.50 E-03 Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 46.23 2.38 1.59 1.59 1.06 0.11 53 PPM 462291 23829 15886 15886 10591 1059 529543 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 6.93 E-03 1.67 E-04 8.53 E-06 2.13 E-06 7.11 E-03 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 38.64 0.93 0.05 0.01 40 PPM 386354 9312 476 119 396261 Internal/External Leadframe Plating Homogeneous Material Level Description Nickel & its alloys Precious metals Precious metals Subtotal Substance Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Component Level Weight (g) 8.28 E-05 7.20 E-06 1.08 E-06 9.11 E-05 Percentage (%) PPM Percentage (%) 90.91 7.91 1.19 100.00 909091 79051 11858 1000000 0.46 0.04 0.01 0.51 PPM 4615 401 60 5077 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 1.70 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 0.95 PPM 9476 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.00 E-03 Percentage (%) PPM Percentage (%) 100 1000000 5.57 PPM 55741 Die Attach Homogeneous Material Level Description Other inorganic materials Other organic materials Thermoset Others Subtotal Package Totals Substance Aluminum oxide Diethylene glycol monoethyl ether acetate Epoxy Resin Amine CAS# 1344-28-1 112-15-2 Proprietary Proprietary Component Level Weight (g) 2.45 E-05 2.45 E-05 1.75 E-05 3.50 E-06 7.00 E-05 Weight (g) 1.79 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 35 35 25 5 100 350000 350000 250000 50000 1000000 0.14 0.14 0.10 0.02 0.39 Percentage (%) 100 PPM 1366 1366 975 195 3902 PPM 1000000 Product / Package Information Environmental Compliance Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOT 23 8 85Sn15Pb No No Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 7.26 E-03 3.74 E-04 2.50 E-04 2.50 E-04 1.66 E-04 1.66 E-05 8.32 E-03 CAS# Weight (g) Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 39.72 2.05 1.37 1.37 0.91 0.09 46 PPM 397250 20477 13651 13651 9101 910 455040 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 7.92 E-03 1.91 E-04 9.74 E-06 2.44 E-06 8.12 E-03 Component Level Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 43.29 1.04 0.05 0.01 44 PPM 432892 10434 533 133 443992 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance CAS# 7440-22-4 Silver Component Level Weight (g) 8.20 E-05 Percentage (%) PPM Percentage (%) 100 1000000 0.45 PPM 4485 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Tin & its alloys Subtotal Substance Tin Lead CAS# 7440-31-5 7439-92-1 Weight (g) 4.45 E-04 7.86 E-05 5.24 E-04 Percentage (%) PPM Percentage (%) 85 15 100 850000 150000 1000000 2.44 0.43 2.87 PPM 24365 4300 28665 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) 1.70 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 0.93 PPM 9298 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.00 E-03 Percentage (%) PPM Percentage (%) 100 1000000 5.47 PPM 54692 Die Attach Component Level Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Others Other organic materials Subtotal Package Totals Substance Silver Carbocyclic Acrylates Bismaleimide resin 2-preponoic acid, 2-methyl Additive Dicumyl peroxide CAS# 7440-22-4 Proprietary Proprietary 68586-19-6 Proprietary 80-43-3 Weight (g) 5.64 E-05 7.00 E-06 2.10 E-06 2.10 E-06 2.10 E-06 3.50 E-07 7.00 E-05 Weight (g) 1.83 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 80.50 10.00 3.00 3.0 3.0 0.5 100.00 805000 100000 30000 30000 30000 5000 1000000 0.31 0.04 0.01 0.01 0.01 0.002 0.38 Percentage (%) 100 PPM 3082 383 115 115 115 19 3828 PPM 1000000