Materials Declaration Package Body Size Lead Count Option Item Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black Subtotal Item Cu Fe Zn P Subtotal TO-92 N/A 3 Pb-free Molding Compound % of Compound 86 7.5 4 2 0.5 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Mold Compound Weight (g) 9.51 E-02 8.30 E-03 4.42 E-03 2.21 E-03 5.53 E-04 1.11 E-01 PPM 453059 39511 21072 10536 2634 526812 Weight (g) 8.80 E-02 2.12 E-03 1.08 E-04 2.71 E-05 9.02 E-02 PPM 418997 10099 516 129 429740 Item Ag Internal Leadframe Plating % of Plating Weight (g) 100 6.32 E-05 Item Sn External Leadframe Plating % of Plating Weight (g) 100 7.08 E-03 PPM 7524 Item Chip % of Chip 100 Weight (g) 2.00 E-04 PPM Weight (g) 1.60 E-04 3.00 E-05 1.00 E-05 2.00 E-04 PPM Item Ag Epoxy Resin Curing agent & hardener Subtotal PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected 952 762 143 48 952 Package Totals Weight (g) PPM 1000000 2.10 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. Die Attach Paste PPM 33718 Weight (g) 1.58 E-03 Die Attach % of Die Attach 80 15 5 Item Pb Cd Hg Cr+6 PBB PBDE Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. 301 Bond Wires % of Wire 99.99 Si PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected PPM Item Au Item Pb Cd Hg Cr+6 PBB PBDE Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. Materials Declaration Package Body Size Lead Count Option Item Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black Subtotal Item Cu Fe Zn P Subtotal TO-92 N/A 3 SnPb Molding Compound % of Compound Weight (g) 86 9.51 E-02 7.5 8.30 E-03 4 4.42 E-03 2 2.21 E-03 0.5 5.53 E-04 1.11 E-01 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Weight (g) 8.80 E-02 2.12 E-03 1.08 E-04 2.71 E-05 9.02 E-02 Ag Internal Leadframe Plating % of Plating Weight (g) 100 6.32 E-05 Sn Pb Subtotal External Leadframe Plating % of Plating Weight (g) 85 6.02 E-03 15 1.06 E-03 7.08 E-03 Item Item PPM 453059 39511 21072 10536 2634 526812 PPM 418997 10099 516 129 429740 Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. 301 PPM 28660 5058 33718 Item Bond Wires % of Wire 99.99 Weight (g) 1.58 E-03 PPM Item Weight (g) 2.00 E-04 PPM Si Chip % of Chip 100 Weight (g) 1.60 E-04 3.00 E-05 1.00 E-05 2.00 E-04 PPM Item Ag Epoxy Resin Curing agent & hardener Subtotal Mold Compound Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. PPM Au Die Attach % of Die Attach 80 15 5 Item Pb Cd Hg Cr+6 PBB PBDE 7524 952 762 143 48 952 Package Totals Weight (g) PPM 1000000 2.10 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary