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Product / Package Information
Environmental Compliance Information
Package
Body Size/Pitch
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
TSOT
8
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Others
Other inorganic materials
Subtotal
Substance
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
5.18 E-03
2.67 E-04
1.78 E-04
1.78 E-04
1.19 E-04
1.19 E-05
5.93 E-03
CAS#
Weight (g)
Component Level
Percentage (%)
PPM
Percentage (%)
87.3
4.5
3.0
3.0
2.0
0.2
100.0
873000
45000
30000
30000
20000
2000
1000000
38.23
1.97
1.31
1.31
0.88
0.09
44
PPM
382255
19704
13136
13136
8757
876
437864
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
5.55 E-03
1.34 E-04
6.83 E-06
1.71 E-06
5.69 E-03
Component Level
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
40.98
0.99
0.05
0.01
42
PPM
409819
9878
504
126
420327
Internal Leadframe Plating
Homogeneous Material Level
Substance
Description
Precious metals
Silver
CAS#
Weight (g)
7440-22-4
5.75 E-05
Component Level
Percentage (%)
PPM
Percentage (%)
100
1000000
0.42
PPM
4246
External Leadframe Plating
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
Weight (g)
7440-31-5
6.13 E-04
Percentage (%)
PPM
Percentage (%)
100
1000000
4.53
PPM
45265
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
Weight (g)
7440 57 5
7440-57-5
2 00 E-05
2.00
Component Level
Percentage (%)
PPM
Percentage (%)
99 99
99.99
1000000
0 15
0.15
PPM
1477
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
Weight (g)
7440-21-3
1.16 E-03
Component Level
Percentage (%)
PPM
Percentage (%)
100
1000000
8.57
PPM
85653
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Others
Other organic materials
Subtotal
Package Totals
Substance
Silver
Carbocyclic Acrylates
Bismaleimide resin
2-preponoic acid, 2-methyl
Additive
Dicumyl peroxide
CAS#
7440-22-4
Proprietary
Proprietary
68586-19-6
Proprietary
80-43-3
Weight (g)
5.64 E-05
7.00 E-06
2.10 E-06
2.10 E-06
2.10 E-06
3.50 E-07
7.00 E-05
Weight (g)
1.35 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledg
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liabili
any inaccuracy of such information
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
80.50
10.00
3.00
3.0
3.0
0.5
100.00
805000
100000
30000
30000
30000
5000
1000000
0.42
0.05
0.02
0.02
0.02
0.00
0.52
Percentage (%)
100
PPM
4161
517
155
155
155
26
5169
PPM
1000000
Product / Package Information
Environmental Compliance Information
Package
Body Size/Pitch
LeadCount
Option
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
TSOT - COL
8
NiPdAu
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Others
Other inorganic materials
Subtotal
Silica
Phenol Resin
Epoxy Resin 1
Epoxy Resin 2
Others
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
1333-86-4
5.18 E-03
2.67 E-04
1.78 E-04
1.78 E-04
1.19 E-04
1.19 E-05
5.93 E-03
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
87.3
4.5
3.0
3.0
2.0
0.2
100.0
873000
45000
30000
30000
20000
2000
1000000
40.04
2.06
1.38
1.38
0.92
0.09
46
PPM
400378
20638
13759
13759
9172
917
458623
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
5.54 E-03
1.33 E-04
6.81 E-06
1.70 E-06
5.68 E-03
Component Level
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
42.81
1.03
0.05
0.01
44
PPM
428100
10318
527
132
439077
Internal/External Leadframe Plating
Homogeneous Material Level
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Substance
Nickel
Palladium
Gold
CAS#
Component Level
Weight (g)
7440-02-0
7440-05-3
7440-57-5
6.61 E-05
5.75 E-06
8.63 E-07
7.27 E-05
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
90.91
7.91
1.19
100.00
909091
79051
11858
1000000
0.51
0.04
0.01
0.56
PPM
5114
445
67
5625
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
G ld
Gold
7440-57-5
7440 57 5
2 00 E
2.00
E-05
05
Percentage (%)
PPM
Percentage (%)
99 99
99.99
1000000
0.15
0 15
PPM
1547
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
1.16 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
8.97
PPM
89714
Die Attach
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Other organic materials
Thermoset
Others
Subtotal
Package Totals
Substance
Aluminum oxide
Diethylene glycol monoethyl ether acetate
Epoxy Resin
Amine
CAS#
1344-28-1
112-15-1
Proprietary
Proprietary
Weight (g)
2.45 E-05
2.45 E-05
1.75 E-05
3.50 E-06
7.00 E-05
Weight (g)
1.29 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
35
35
25
5
100
350000
350000
250000
50000
1000000
0.19
0.19
0.14
0.03
0.54
Percentage (%)
100
PPM
1895
1895
1353
271
5414
PPM
1000000
Product / Package Information
Environmental Compliance Information
Package
Body Size
LeadCount
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
TSOT
8
85Sn15Pb
No
No
No
Yes
Materials Declaration
Molding Compound
Description
Other inorganic materials
Thermosets
Thermosets
Other organic materials
Other inorganic materials
Other inorganic materials
Subtotal
Substance
Silica
Solid epoxy resin
Phenol resin
Brominated epoxy
Antimony Trioxide
Carbon Black
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1309-64-4
1333-86-4
4.63 E-03
7.12 E-04
3.56 E-04
1.19 E-04
1.07 E-04
1.19 E-05
5.93 E-03
CAS#
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
5.55 E-03
1.34 E-04
6.83 E-06
1.71 E-06
5.69 E-03
Homogeneous Material Level
Percentage (%)
PPM
78.00
780000
12.00
120000
6.00
60000
2.00
20000
1.80
18000
0.20
2000
100.0
1000000
Component Level
Percentage (%)
PPM
34.05
5.24
2.62
0.87
0.79
0.09
43.65
340495
52384
26192
8731
7858
873
436532
Homogeneous Material Level
Percentage (%)
PPM
97.50
975000
2.35
23500
0.12
1200
0.03
300
100.00
1000000
Component Level
Percentage (%)
PPM
40.85
0.98
0.05
0.01
41.90
408531
9847
503
126
419006
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
0.42
4233
Homogeneous Material Level
Percentage (%)
PPM
85.0
850000
15.0
150000
100.0
1000000
Component Level
Percentage (%)
PPM
4.10
0.72
4.82
40981
7232
48212
Homogeneous Material Level
Percentage (%)
PPM
99.99
1000000
Component Level
Percentage (%)
PPM
0.15
1472
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
8.54
85392
Homogeneous
H
M
Material
i l Level
L
l
Percentage (%)
PPM
80
800000
15
150000
5
50000
100
1000000
Component
C
L
Levell
Percentage (%)
PPM
0.41
0.08
0.03
0.52
4122
773
258
5153
Leadframe
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
Internal Leadframe Plating
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
7440-22-4
5.75 E-05
External Leadframe Plating
Description
Tin & its alloys
Tin & its alloys
Subtotal
Substance
Tin
Lead
CAS#
Weight (g)
7440-31-5
7439-92-1
5.57 E-04
9.82 E-05
6.55 E-04
CAS#
Weight (g)
7440-57-5
2.00 E-05
Bond Wires
Description
Precious metals
Substance
Gold
Chip
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
Weight (g)
7440-21-3
1.16 E-03
Die Attach
Description
Precious metals
Thermosets
Others
Subtotal
Substance
Silver
Epoxy Resin
Curing agent & hardener
CAS#
Weight (g)
7440-22-4
Proprietary
Proprietary
5.60 E-05
1.05 E-05
3.50 E-06
7.00 E-05
Weight (g)
1.36 E-02
Package Totals
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100.00
PPM
1000000