Product / Package Information Environmental Compliance Information Package Body Size/Pitch Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant TSOT 8 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Substance Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 5.18 E-03 2.67 E-04 1.78 E-04 1.78 E-04 1.19 E-04 1.19 E-05 5.93 E-03 CAS# Weight (g) Component Level Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 38.23 1.97 1.31 1.31 0.88 0.09 44 PPM 382255 19704 13136 13136 8757 876 437864 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 5.55 E-03 1.34 E-04 6.83 E-06 1.71 E-06 5.69 E-03 Component Level Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 40.98 0.99 0.05 0.01 42 PPM 409819 9878 504 126 420327 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals Silver CAS# Weight (g) 7440-22-4 5.75 E-05 Component Level Percentage (%) PPM Percentage (%) 100 1000000 0.42 PPM 4246 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# Weight (g) 7440-31-5 6.13 E-04 Percentage (%) PPM Percentage (%) 100 1000000 4.53 PPM 45265 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# Weight (g) 7440 57 5 7440-57-5 2 00 E-05 2.00 Component Level Percentage (%) PPM Percentage (%) 99 99 99.99 1000000 0 15 0.15 PPM 1477 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 1.16 E-03 Component Level Percentage (%) PPM Percentage (%) 100 1000000 8.57 PPM 85653 Die Attach Component Level Homogeneous Material Level Description Precious metals Other organic materials Other organic materials Other organic materials Others Other organic materials Subtotal Package Totals Substance Silver Carbocyclic Acrylates Bismaleimide resin 2-preponoic acid, 2-methyl Additive Dicumyl peroxide CAS# 7440-22-4 Proprietary Proprietary 68586-19-6 Proprietary 80-43-3 Weight (g) 5.64 E-05 7.00 E-06 2.10 E-06 2.10 E-06 2.10 E-06 3.50 E-07 7.00 E-05 Weight (g) 1.35 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledg ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liabili any inaccuracy of such information ADI Proprietary Percentage (%) PPM Percentage (%) 80.50 10.00 3.00 3.0 3.0 0.5 100.00 805000 100000 30000 30000 30000 5000 1000000 0.42 0.05 0.02 0.02 0.02 0.00 0.52 Percentage (%) 100 PPM 4161 517 155 155 155 26 5169 PPM 1000000 Product / Package Information Environmental Compliance Information Package Body Size/Pitch LeadCount Option RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant TSOT - COL 8 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Thermosets Others Other inorganic materials Subtotal Silica Phenol Resin Epoxy Resin 1 Epoxy Resin 2 Others Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary Proprietary 1333-86-4 5.18 E-03 2.67 E-04 1.78 E-04 1.78 E-04 1.19 E-04 1.19 E-05 5.93 E-03 CAS# Weight (g) Percentage (%) PPM Percentage (%) 87.3 4.5 3.0 3.0 2.0 0.2 100.0 873000 45000 30000 30000 20000 2000 1000000 40.04 2.06 1.38 1.38 0.92 0.09 46 PPM 400378 20638 13759 13759 9172 917 458623 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 5.54 E-03 1.33 E-04 6.81 E-06 1.70 E-06 5.68 E-03 Component Level Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 42.81 1.03 0.05 0.01 44 PPM 428100 10318 527 132 439077 Internal/External Leadframe Plating Homogeneous Material Level Description Nickel & its alloys Precious metals Precious metals Subtotal Substance Nickel Palladium Gold CAS# Component Level Weight (g) 7440-02-0 7440-05-3 7440-57-5 6.61 E-05 5.75 E-06 8.63 E-07 7.27 E-05 CAS# Weight (g) Percentage (%) PPM Percentage (%) 90.91 7.91 1.19 100.00 909091 79051 11858 1000000 0.51 0.04 0.01 0.56 PPM 5114 445 67 5625 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance G ld Gold 7440-57-5 7440 57 5 2 00 E 2.00 E-05 05 Percentage (%) PPM Percentage (%) 99 99 99.99 1000000 0.15 0 15 PPM 1547 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.16 E-03 Percentage (%) PPM Percentage (%) 100 1000000 8.97 PPM 89714 Die Attach Component Level Homogeneous Material Level Description Other inorganic materials Other organic materials Thermoset Others Subtotal Package Totals Substance Aluminum oxide Diethylene glycol monoethyl ether acetate Epoxy Resin Amine CAS# 1344-28-1 112-15-1 Proprietary Proprietary Weight (g) 2.45 E-05 2.45 E-05 1.75 E-05 3.50 E-06 7.00 E-05 Weight (g) 1.29 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 35 35 25 5 100 350000 350000 250000 50000 1000000 0.19 0.19 0.14 0.03 0.54 Percentage (%) 100 PPM 1895 1895 1353 271 5414 PPM 1000000 Product / Package Information Environmental Compliance Information Package Body Size LeadCount Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant TSOT 8 85Sn15Pb No No No Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Other organic materials Other inorganic materials Other inorganic materials Subtotal Substance Silica Solid epoxy resin Phenol resin Brominated epoxy Antimony Trioxide Carbon Black CAS# Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1309-64-4 1333-86-4 4.63 E-03 7.12 E-04 3.56 E-04 1.19 E-04 1.07 E-04 1.19 E-05 5.93 E-03 CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 5.55 E-03 1.34 E-04 6.83 E-06 1.71 E-06 5.69 E-03 Homogeneous Material Level Percentage (%) PPM 78.00 780000 12.00 120000 6.00 60000 2.00 20000 1.80 18000 0.20 2000 100.0 1000000 Component Level Percentage (%) PPM 34.05 5.24 2.62 0.87 0.79 0.09 43.65 340495 52384 26192 8731 7858 873 436532 Homogeneous Material Level Percentage (%) PPM 97.50 975000 2.35 23500 0.12 1200 0.03 300 100.00 1000000 Component Level Percentage (%) PPM 40.85 0.98 0.05 0.01 41.90 408531 9847 503 126 419006 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 0.42 4233 Homogeneous Material Level Percentage (%) PPM 85.0 850000 15.0 150000 100.0 1000000 Component Level Percentage (%) PPM 4.10 0.72 4.82 40981 7232 48212 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) PPM 0.15 1472 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 8.54 85392 Homogeneous H M Material i l Level L l Percentage (%) PPM 80 800000 15 150000 5 50000 100 1000000 Component C L Levell Percentage (%) PPM 0.41 0.08 0.03 0.52 4122 773 258 5153 Leadframe Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 5.75 E-05 External Leadframe Plating Description Tin & its alloys Tin & its alloys Subtotal Substance Tin Lead CAS# Weight (g) 7440-31-5 7439-92-1 5.57 E-04 9.82 E-05 6.55 E-04 CAS# Weight (g) 7440-57-5 2.00 E-05 Bond Wires Description Precious metals Substance Gold Chip Substance Description Other inorganic materials Doped Silicon CAS# Weight (g) 7440-21-3 1.16 E-03 Die Attach Description Precious metals Thermosets Others Subtotal Substance Silver Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 Proprietary Proprietary 5.60 E-05 1.05 E-05 3.50 E-06 7.00 E-05 Weight (g) 1.36 E-02 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 1000000