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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy Cresol Novolac
SiO2 Filler
Phenol Novolac
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Cu
Fe
P
Zn
Molding Compound
% of Compound
Weight (g)
16
2.05 E-01
72
9.23 E-01
8
1.03 E-01
2.2
2.82 E-02
1.6
2.05 E-02
0.2
2.56 E-03
PPM
131320
590940
65660
18056
13132
1641
Item
Pb
Cd
Hg
Cr+6
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
PPM
149204
3596
46
184
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Item
Sn
Au
Si
Item
PPM
<2
Not Detected
<2
<2
Molding Compound
Method
US EPA method #3052 & 6010B
BS EN 1122:2001 ICP AES
US EPA method #3052 & 7471A
US EPA method #3060A & 6010B
Die Attach Paste
Weight (g)
2.33 E-01
5.61 E-03
7.17 E-05
2.87 E-04
Internal Leadframe Plating
% of Plating
Weight (g)
1.11 E-03
100
Ag
Resin
Ag Filler
PDIP
300 mils
24
Pb Free
External Leadframe Plating
% of Plating
Weight (g)
2.65 E-02
100
PPM
<2
<2
<2
<2
Not Detected
Not Detected
Method
ICP AES
ICP AES
ICP AES
ICP AES
PPM
708
PPM
16954
Bond Wires
% of Wire
99.99
Weight (g)
2.95 E-04
PPM
Chip
% of Chip
100
Weight (g)
1.23 E-02
PPM
Die Attach
% of Die Attach
25
75
Weight (g)
1.92 E-04
5.75 E-04
PPM
189
7879
123
368
Package Totals
PPM
Weight (g)
1000000
1.56 E+00
AMK-N-G
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
12/19/05
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy Cresol Novolac
SiO2 Filler
Phenol Novolac
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Cu
Fe
P
Zn
Molding Compound
% of Compound
Weight (g)
16
2.05 E-01
72
9.23 E-01
8
1.03 E-01
2.2
2.82 E-02
1.6
2.05 E-02
0.2
2.56 E-03
PPM
131320
590940
65660
18056
13132
1641
Item
Pb
Cd
Hg
Cr+6
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
PPM
149204
3596
46
184
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Item
Sn
Pb
Au
Si
Item
PPM
<2
Not Detected
<2
<2
Molding Compound
Method
US EPA method #3052 & 6010B
BS EN 1122:2001 ICP AES
US EPA method #3052 & 7471A
US EPA method #3060A & 6010B
Die Attach Paste
Weight (g)
2.33 E-01
5.61 E-03
7.17 E-05
2.87 E-04
Internal Leadframe Plating
% of Plating
Weight (g)
1.11 E-03
100
Ag
Resin
Ag Filler
PDIP
300 mils
24
Sn/Pb
External Leadframe Plating
% of Plating
Weight (g)
2.25 E-02
85
3.97 E-03
15
PPM
<2
<2
<2
<2
Not Detected
Not Detected
Method
ICP AES
ICP AES
ICP AES
ICP AES
PPM
708
PPM
14411
2543
Bond Wires
% of Wire
99.99
Weight (g)
2.95 E-04
PPM
Chip
% of Chip
100
Weight (g)
1.23 E-02
PPM
Die Attach
% of Die Attach
25
75
Weight (g)
1.92 E-04
5.75 E-04
PPM
189
7879
123
368
Package Totals
PPM
Weight (g)
1000000
1.56 E+00
AMK-N-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
12/19/05