Materials Declaration Package Body Size LeadCount Option Item Epoxy Cresol Novolac SiO2 Filler Phenol Novolac Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Fe P Zn Molding Compound % of Compound Weight (g) 16 2.05 E-01 72 9.23 E-01 8 1.03 E-01 2.2 2.82 E-02 1.6 2.05 E-02 0.2 2.56 E-03 PPM 131320 590940 65660 18056 13132 1641 Item Pb Cd Hg Cr+6 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 149204 3596 46 184 Item Pb Cd Hg Cr+6 PBB PBDE Item Sn Au Si Item PPM <2 Not Detected <2 <2 Molding Compound Method US EPA method #3052 & 6010B BS EN 1122:2001 ICP AES US EPA method #3052 & 7471A US EPA method #3060A & 6010B Die Attach Paste Weight (g) 2.33 E-01 5.61 E-03 7.17 E-05 2.87 E-04 Internal Leadframe Plating % of Plating Weight (g) 1.11 E-03 100 Ag Resin Ag Filler PDIP 300 mils 24 Pb Free External Leadframe Plating % of Plating Weight (g) 2.65 E-02 100 PPM <2 <2 <2 <2 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES PPM 708 PPM 16954 Bond Wires % of Wire 99.99 Weight (g) 2.95 E-04 PPM Chip % of Chip 100 Weight (g) 1.23 E-02 PPM Die Attach % of Die Attach 25 75 Weight (g) 1.92 E-04 5.75 E-04 PPM 189 7879 123 368 Package Totals PPM Weight (g) 1000000 1.56 E+00 AMK-N-G Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 12/19/05 Materials Declaration Package Body Size LeadCount Option Item Epoxy Cresol Novolac SiO2 Filler Phenol Novolac Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Fe P Zn Molding Compound % of Compound Weight (g) 16 2.05 E-01 72 9.23 E-01 8 1.03 E-01 2.2 2.82 E-02 1.6 2.05 E-02 0.2 2.56 E-03 PPM 131320 590940 65660 18056 13132 1641 Item Pb Cd Hg Cr+6 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 149204 3596 46 184 Item Pb Cd Hg Cr+6 PBB PBDE Item Sn Pb Au Si Item PPM <2 Not Detected <2 <2 Molding Compound Method US EPA method #3052 & 6010B BS EN 1122:2001 ICP AES US EPA method #3052 & 7471A US EPA method #3060A & 6010B Die Attach Paste Weight (g) 2.33 E-01 5.61 E-03 7.17 E-05 2.87 E-04 Internal Leadframe Plating % of Plating Weight (g) 1.11 E-03 100 Ag Resin Ag Filler PDIP 300 mils 24 Sn/Pb External Leadframe Plating % of Plating Weight (g) 2.25 E-02 85 3.97 E-03 15 PPM <2 <2 <2 <2 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES PPM 708 PPM 14411 2543 Bond Wires % of Wire 99.99 Weight (g) 2.95 E-04 PPM Chip % of Chip 100 Weight (g) 1.23 E-02 PPM Die Attach % of Die Attach 25 75 Weight (g) 1.92 E-04 5.75 E-04 PPM 189 7879 123 368 Package Totals PPM Weight (g) 1000000 1.56 E+00 AMK-N-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 12/19/05