Materials Declaration Package Body Size LeadCount Option Item Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black Subtotal Item Cu Fe Zn P Subtotal Ag PDIP 300 mils 8 Pb-free, Halide free Molding Compound % of Compound 86 7.5 4 2 0.5 Weight (g) 2.82 E-01 2.46 E-02 1.31 E-02 6.57 E-03 1.64 E-03 3.28 E-01 PPM 567886 49525 26413 13207 3302 660333 Weight (g) 1.49 E-01 3.60 E-03 1.84 E-04 4.59 E-05 1.53 E-01 PPM 299925 7229 369 92 307615 Internal Leadframe Plating % of Plating 100 Weight (g) 1.55 E-03 PPM 3107 External Leadframe Plating % of Plating 100 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Weight (g) 1.07 E-02 PPM 21585 Weight (g) 2.60 E-04 PPM Au Bond Wires % of Wire 99.99 Si Chip % of Chip 100 Weight (g) 2.50 E-03 PPM 5027 Weight (g) 7.20 E-04 1.35 E-04 4.50 E-05 9.00 E-04 PPM 1448 271 90 1810 Item Sn Item Ag Filler Resin Curing agent and hardener Subtotal Die Attach % of Die Attach 80 15 5 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound PPM Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste PPM Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. 523 Package Totals PPM Weight (g) 1000000 4.97 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary N-01 Materials Declaration Package Body Size LeadCount Option Item Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black Subtotal Item Cu Fe Zn P Subtotal PDIP 300 mils 8 with Pb, Halide-free Molding Compound % of Compound 86 7.5 4 2 0.5 Molding Compound Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Internal Leadframe Plating % of Plating 100 Ag Item Sn Pb Subtotal External Leadframe Plating % of Plating 85 15 Weight (g) 2.82 E-01 2.46 E-02 1.31 E-02 6.57 E-03 1.64 E-03 3.28 E-01 PPM 567886 49525 26413 13207 3302 660333 Weight (g) 1.49 E-01 3.60 E-03 1.84 E-04 4.59 E-05 1.53 E-01 PPM 299925 7229 369 92 307615 Weight (g) 1.55 E-03 PPM Weight (g) 9.12 E-03 1.61 E-03 1.07 E-02 PPM 18347 3238 21585 Bond Wires % of Wire 99.99 Weight (g) 2.60 E-04 PPM Weight (g) 2.50 E-03 PPM Si Chip % of Chip 100 Weight (g) 7.20 E-04 1.35 E-04 4.50 E-05 9.00 E-04 PPM Item Ag Filler Resin Curing agent and hardener Subtotal PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. Die Attach Paste Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. 523 5027 1448 271 90 1810 Package Totals PPM Weight (g) 1000000 4.97 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. 3107 Au Die Attach % of Die Attach 80 15 5 Item Pb Cd Hg Cr+6 PBB PBDE N-02 Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Cresol Novolac Phenol Novolac Sb2O3 Brominated Resin Carbon Black Subtotal Item Cu Fe Zn P Subtotal Ag Item Sn PDIP 300 mils 8 Pb-free Molding Compound % of Compound 72 16 8 2.2 1.6 0.2 Weight (g) 1.69 E-01 3.76 E-02 1.88 E-02 5.17 E-03 3.76 E-03 4.70 E-04 2.35 E-01 PPM 380178 84584 42292 11630 8458 1057 528200 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound PPM Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Not Detected Draft IEC 62321. Weight (g) 1.86 E-01 4.48 E-03 5.72 E-05 2.29 E-04 1.91 E-01 PPM 418421 10078 129 515 429143 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Internal Leadframe Plating Weight (g) % of Plating 8.67 E-04 100 PPM 1950 External Leadframe Plating Weight (g) % of Plating 8.15 E-03 100 PPM 18334 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Die Attach Paste Bond Wires % of Wire 99.99 Weight (g) 9.83 E-05 PPM Au Si Chip % of Chip 100 Weight (g) 9.08 E-03 PPM 20426 Weight (g) 6.14 E-04 1.15 E-04 3.83 E-05 7.67 E-04 PPM 1380 259 86 1725 Item Ag Filler Resin Curing agent and hardener Subtotal Die Attach % of Die Attach 80 15 5 Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. 221 Package Totals PPM Weight (g) 1000000 4.45 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. N-03 Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy Cresol Novolac Phenol Novolac Sb2O3 Brominated Resin Carbon Black Subtotal Item Cu Fe Zn P Subtotal PDIP 300 mils 8 with Pb Molding Compound % of Compound 72 16 8 2.2 1.6 0.2 Molding Compound Leadframe % of Leadframe 97.5 2.35 0.12 0.03 Weight (g) 1.69 E-01 3.76 E-02 1.88 E-02 5.17 E-03 3.76 E-03 4.70 E-04 2.35 E-01 PPM 380187 84586 42293 11631 8459 1057 528212 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 1.86 E-01 4.48 E-03 5.72 E-05 2.29 E-04 1.91 E-01 PPM 418430 10078 129 515 429153 Item Pb Cd Hg Cr+6 PBB PBDE PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Weight (g) 8.67 E-04 PPM Internal Leadframe Plating % of Plating 100 Sn Pb Subtotal External Leadframe Plating Weight (g) % of Plating 6.92 E-03 85 1.22 E-03 15 8.14 E-03 Weight (g) 9.83 E-05 PPM Si Chip % of Chip 100 Weight (g) 9.08 E-03 PPM 20427 Weight (g) 6.14 E-04 1.15 E-04 3.83 E-05 7.67 E-04 PPM 221 1380 259 86 1725 Package Totals PPM Weight (g) 1000000 4.45 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. PPM 15567 2745 18312 Bond Wires % of Wire 99.99 Die Attach % of Die Attach 80 15 5 Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. 1950 Au Item Ag Filler Resin Curing agent and hardener Subtotal Method ICP-OES. ICP-OES. ICP-OES. UV-VIS. GC-MSD. GC-MSD. Die Attach Paste Ag Item Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. Draft IEC 62321. N-04