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Materials Declaration
Package
Body Size
LeadCount
Option
SOIC_N
150 mils
14
Pb-free
Molding Compound
% of Compound
86.20
7.50
4.00
1.50
0.50
0.30
100.0
Weight (g)
6.46 E-02
5.62 E-03
3.00 E-03
1.12 E-03
3.75 E-04
2.25 E-04
7.49 E-02
PPM
463969
40369
21530
8074
2691
1615
538247
Leadframe
% of Leadframe
97.5
2.35
0.12
0.03
100
Weight (g)
5.22 E-02
1.26 E-03
6.40 E-05
1.60 E-05
5.35 E-02
PPM
374749
9029
460
115
384353
Substance
Internal Leadframe Plating
Weight (g)
% of Plating
7.34 E-04
100.0
PPM
5272
Substance
External Leadframe Plating
Weight (g)
% of Plating
2.39 E-03
100.0
PPM
17154
Substance
Silica
Epoxy resin
Phenol Novolac
Antimony Trioxide
Brominated Resin
Carbon Black
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
Subtotal
Silver
Tin
Gold
Bond Wires
% of Wire
99.99
Weight (g)
3.47 E-04
PPM
2493
Substance
Doped Silicon
Chip
% of Chip
100.0
Weight (g)
5.68 E-03
PPM
40772
Die Attach
% of Die Attach
80
15
5
100
Weight (g)
1.30 E-03
2.45 E-04
8.15 E-05
1.63 E-03
PPM
9367
1756
585
11709
Substance
Substance
Silver
Epoxy Resin
Curing agent & hardener
Subtotal
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Molding Compound
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Substance
Lead
Cadmium
Mercury
Chromium+6
Polybrominated biphenyls (PBB)
Polybrominated Diphenyl Ethers (PBDE)
Die Attach Paste
PPM
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Not Detected
Method
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. ICP-OES.
Draft IEC 62321. UV-VIS.
Draft IEC 62321. GC-MSD.
Draft IEC 62321. GC-MSD.
Package Totals
Weight (g)
PPM
1000000
1.39 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Product / Package Information
Environmental Information
Package
Body Size/Pitch
LeadCount
Option
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
JIG Material Content Compliance
SOIC_N - COL
14
NiPdAu
Yes
Yes
Yes
Level A Compliant
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy Resin
Phenol Resin
Epoxy Cresol Novolac
Carbon Black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
29690-82-2
1333-86-3
7.17 E-02
4.09 E-03
4.09 E-03
1.63 E-03
2.45 E-04
8.17 E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
87.7
5.0
5.0
2.0
0.3
100.0
877000
50000
50000
20000
3000
1000000
52.88
3.02
3.02
1.21
0.18
60
PPM
528836
30150
30150
12060
1809
603006
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
4.73 E-02
1.14 E-03
5.82 E-05
1.46 E-05
4.85 E-02
Component Level
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100
975000
23500
1200
300
1000000
34.91
0.84
0.04
0.01
36
PPM
349063
8413
430
107
358014
Internal/External Leadframe Plating
Homogeneous Material Level
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Substance
Nickel
Palladium
Gold
CAS#
Component Level
Weight (g)
7440-02-0
7440-05-3
7440-57-5
6.61 E-05
5.75 E-06
8.63 E-07
7.27 E-05
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
90.91
7.91
1.19
100.00
909091
79051
11858
1000000
0.05
0.00
0.00
0.05
PPM
488
42
6
537
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
7440-57-5
4.90 E-04
Component Level
Percentage (%)
PPM
Percentage (%)
99.99
1000000
0.36
PPM
3615
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
3.62 E-03
Percentage (%)
PPM
Percentage (%)
100
1000000
2.67
PPM
26712
Die Attach
Homogeneous Material Level
Description
Thermoset
Other inorganic materials
Other inorganic materials
Other inorganic materials
Others
Subtotal
Package Totals
Substance
Epoxy Resin
Metal Oxide
Glycol Ethers
Silica
Curing agent & hardener
CAS#
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Component Level
Weight (g)
3.41 E-04
3.41 E-04
2.42 E-04
8.80 E-05
8.80 E-05
1.10 E-03
Weight (g)
1.36 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
31
31
22
8
8
100
310000
310000
220000
80000
80000
1000000
0.25
0.25
0.18
0.06
0.06
0.81
Percentage (%)
100
PPM
2516
2516
1786
649
649
8117
PPM
1000000
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Fe
P
Zn
SOIC
150 mils
14
Sn/Pb
Molding Compound
% of Compound
Weight (g)
10
1.04 E-02
85
8.88 E-02
3
3.13 E-03
1.5
1.57 E-03
0.5
5.22 E-04
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Weight (g)
4.88 E-02
1.18 E-03
1.50 E-05
6.00 E-05
Ag
Internal Leadframe Plating
% of Plating
Weight (g)
4.45 E-04
100
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
85
1.28 E-03
15
2.27 E-04
Item
Au
Bond Wires
% of Wire
99.99
PPM
66024
561201
19807
9904
3301
PPM
308274
7430
95
379
PPM
Item
Pb
Cd
Hg
Cr+6
Molding Compound
Method
PPM
<2
US EPA method #3052 & 6010B
Not Detected
BS EN 1122:2001 ICP AES
<2
US EPA method #3052 & 7471A
<2
US EPA method #3060A & 6010B
Die Attach Paste
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5
<5
<5
<5
Not Detected
Not Detected
2813
PPM
8.12 E+03
1.43 E+03
Weight (g)
3.09 E-04
PPM
Weight (g)
1.30 E-03
PPM
Weight (g)
4.22 E-05
1.27 E-04
PPM
1952
Chip
% of Chip
Si
100
Item
Resin
Ag Filler
Die Attach
% of Die Attach
25
75
8198
267
801
Package Totals
Weight (g)
PPM
1000000
1.58 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
ICP AES
ICP AES
ICP AES
ICP AES