Materials Declaration Package Body Size LeadCount Option SOIC_N 150 mils 14 Pb-free Molding Compound % of Compound 86.20 7.50 4.00 1.50 0.50 0.30 100.0 Weight (g) 6.46 E-02 5.62 E-03 3.00 E-03 1.12 E-03 3.75 E-04 2.25 E-04 7.49 E-02 PPM 463969 40369 21530 8074 2691 1615 538247 Leadframe % of Leadframe 97.5 2.35 0.12 0.03 100 Weight (g) 5.22 E-02 1.26 E-03 6.40 E-05 1.60 E-05 5.35 E-02 PPM 374749 9029 460 115 384353 Substance Internal Leadframe Plating Weight (g) % of Plating 7.34 E-04 100.0 PPM 5272 Substance External Leadframe Plating Weight (g) % of Plating 2.39 E-03 100.0 PPM 17154 Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black Subtotal Substance Copper Iron Zinc Phosphorus Subtotal Silver Tin Gold Bond Wires % of Wire 99.99 Weight (g) 3.47 E-04 PPM 2493 Substance Doped Silicon Chip % of Chip 100.0 Weight (g) 5.68 E-03 PPM 40772 Die Attach % of Die Attach 80 15 5 100 Weight (g) 1.30 E-03 2.45 E-04 8.15 E-05 1.63 E-03 PPM 9367 1756 585 11709 Substance Substance Silver Epoxy Resin Curing agent & hardener Subtotal Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Molding Compound PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Substance Lead Cadmium Mercury Chromium+6 Polybrominated biphenyls (PBB) Polybrominated Diphenyl Ethers (PBDE) Die Attach Paste PPM Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected Method Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. ICP-OES. Draft IEC 62321. UV-VIS. Draft IEC 62321. GC-MSD. Draft IEC 62321. GC-MSD. Package Totals Weight (g) PPM 1000000 1.39 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Product / Package Information Environmental Information Package Body Size/Pitch LeadCount Option RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliance SOIC_N - COL 14 NiPdAu Yes Yes Yes Level A Compliant Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-3 7.17 E-02 4.09 E-03 4.09 E-03 1.63 E-03 2.45 E-04 8.17 E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 87.7 5.0 5.0 2.0 0.3 100.0 877000 50000 50000 20000 3000 1000000 52.88 3.02 3.02 1.21 0.18 60 PPM 528836 30150 30150 12060 1809 603006 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 4.73 E-02 1.14 E-03 5.82 E-05 1.46 E-05 4.85 E-02 Component Level Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 34.91 0.84 0.04 0.01 36 PPM 349063 8413 430 107 358014 Internal/External Leadframe Plating Homogeneous Material Level Description Nickel & its alloys Precious metals Precious metals Subtotal Substance Nickel Palladium Gold CAS# Component Level Weight (g) 7440-02-0 7440-05-3 7440-57-5 6.61 E-05 5.75 E-06 8.63 E-07 7.27 E-05 CAS# Weight (g) Percentage (%) PPM Percentage (%) 90.91 7.91 1.19 100.00 909091 79051 11858 1000000 0.05 0.00 0.00 0.05 PPM 488 42 6 537 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold 7440-57-5 4.90 E-04 Component Level Percentage (%) PPM Percentage (%) 99.99 1000000 0.36 PPM 3615 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 3.62 E-03 Percentage (%) PPM Percentage (%) 100 1000000 2.67 PPM 26712 Die Attach Homogeneous Material Level Description Thermoset Other inorganic materials Other inorganic materials Other inorganic materials Others Subtotal Package Totals Substance Epoxy Resin Metal Oxide Glycol Ethers Silica Curing agent & hardener CAS# Proprietary Proprietary Proprietary Proprietary Proprietary Component Level Weight (g) 3.41 E-04 3.41 E-04 2.42 E-04 8.80 E-05 8.80 E-05 1.10 E-03 Weight (g) 1.36 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 31 31 22 8 8 100 310000 310000 220000 80000 80000 1000000 0.25 0.25 0.18 0.06 0.06 0.81 Percentage (%) 100 PPM 2516 2516 1786 649 649 8117 PPM 1000000 Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SOIC 150 mils 14 Sn/Pb Molding Compound % of Compound Weight (g) 10 1.04 E-02 85 8.88 E-02 3 3.13 E-03 1.5 1.57 E-03 0.5 5.22 E-04 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 4.88 E-02 1.18 E-03 1.50 E-05 6.00 E-05 Ag Internal Leadframe Plating % of Plating Weight (g) 4.45 E-04 100 Sn Pb External Leadframe Plating % of Plating Weight (g) 85 1.28 E-03 15 2.27 E-04 Item Au Bond Wires % of Wire 99.99 PPM 66024 561201 19807 9904 3301 PPM 308274 7430 95 379 PPM Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected 2813 PPM 8.12 E+03 1.43 E+03 Weight (g) 3.09 E-04 PPM Weight (g) 1.30 E-03 PPM Weight (g) 4.22 E-05 1.27 E-04 PPM 1952 Chip % of Chip Si 100 Item Resin Ag Filler Die Attach % of Die Attach 25 75 8198 267 801 Package Totals Weight (g) PPM 1000000 1.58 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method ICP AES ICP AES ICP AES ICP AES