Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOIC_N 150 mils 16 100 Sn Yes Yes No Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black CAS# Weight (g) 60676-86-0 Proprietary 9003-35-4 1309-64-4 40039-93-8 1333-86-4 8.21 E-02 7.15 E-03 3.81 E-03 1.43 E-03 4.77 E-04 2.86 E-04 9.53 E-02 Homogeneous Material Level Percentage (%) PPM 86.2 862000 7.5 75000 4 40000 1.5 15000 0.5 5000 0.3 3000 100 1000000 Component Level Percentage (%) PPM 52.73 527271 4.59 45876 2.45 24467 0.92 9175 0.31 3058 0.18 1835 61.17 611683 Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 100.00 1000000 Component Level Percentage (%) PPM 32.48 324753 0.76 7585 0.04 420 0.01 81 33.28 332839 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 0.34 3362 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 1.87 18740 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) PPM 0.33 3273 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 2.29 22914 Homogeneous Material Level Percentage (%) PPM 80 800000 15 150000 5 50000 100 1000000 Component Level Percentage (%) PPM 0.58 5751 0.11 1078 0.04 359 0.72 7189 Leadframe Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 5.06 E-02 1.18 E-03 6.55 E-05 1.26 E-05 5.19 E-02 Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 5.24 E-04 External Leadframe Plating Description Tin & its alloys Substance Tin CAS# Weight (g) 7440-31-5 2.92 E-03 Bond Wires Description Precious metals Substance Gold CAS# Weight (g) 7440-57-5 5.10 E-04 CAS# Weight (g) 7440-21-3 3.57 E-03 Chip Description Other inorganic materials Substance Doped Silicon Die Attach Description Precious metals Thermosets Others Subtotal Package Totals Substance Silver Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 Proprietary Proprietary 8.96 E-04 1.68 E-04 5.60 E-05 1.12 E-03 Weight (g) 1.56 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 1000000 Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOIC_N 150 mils 16 NiPdAu Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black CAS# 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-3 Component Level Weight (g) 9.19 E-02 5.24 E-03 5.24 E-03 2.10 E-03 3.14 E-04 1.05 E-01 Percentage (%) PPM Percentage (%) 87.7 5.0 5.0 2.0 0.3 100.0 877000 50000 50000 20000 3000 1000000 56.56 3.22 3.22 1.29 0.19 64 PPM 565582 32245 32245 12898 1935 644905 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) 5.25 E-02 1.26 E-03 6.46 E-05 1.61 E-05 5.38 E-02 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100 975000 23500 1200 300 1000000 32.28 0.78 0.04 0.01 33 PPM 322760 7779 397 99 331036 Internal/External Leadframe Plating Homogeneous Material Level Substance Description Nickel & its alloys Precious metals Precious metals Subtotal Nickel Palladium Gold CAS# 7440-02-0 7440-05-3 7440-57-5 Component Level Weight (g) 1.25 E-03 2.92 E-05 6.04 E-06 1.29 E-03 Percentage (%) PPM Percentage (%) 97.27 2.26 0.47 100.00 972697 22621 4683 1000000 0.77 0.02 0.00 0.79 PPM 7721 180 37 7937 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) 3.10 E-04 Percentage (%) PPM Percentage (%) 99.99 1000000 0.19 PPM 1907 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 1.63 E-03 Percentage (%) PPM Percentage (%) 100 1000000 1.00 PPM 10030 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Weight (g) 5.28 E-04 2.11 E-05 2.11 E-05 2.11 E-05 2.11 E-05 2.11 E-05 2.11 E-05 2.11 E-05 3.54 E-06 6.80 E-04 Weight (g) 1.63 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.33 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.002 0.42 Percentage (%) 100 PPM 3251 130 130 130 130 130 130 130 22 4184 PPM 1000000 Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOIC_N 150 mils 16 SnPb No No No Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy resin Phenol Novolac Antimony Trioxide Brominated Resin Carbon Black CAS# Weight (g) 60676-86-0 Proprietary 9003-35-4 1309-64-4 40039-93-8 1333-86-4 8.21 E-02 7.15 E-03 3.81 E-03 1.43 E-03 4.77 E-04 2.86 E-04 9.53 E-02 Homogeneous Material Level Percentage (%) PPM 86.2 862000 7.5 75000 4 40000 1.5 15000 0.5 5000 0.3 3000 100 1000000 Component Level Percentage (%) PPM 52.73 527271 4.59 45876 2.45 24467 0.92 9175 0.31 3058 0.18 1835 61.17 611683 Homogeneous Material Level Percentage (%) PPM 97.57 975706 2.28 22789 0.13 1263 0.02 242 100.00 1000000 Component Level Percentage (%) PPM 324753 32.48 7585 0.76 420 0.04 81 0.01 33.28 332839 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM Homogeneous Material Level Percentage (%) PPM 85.0 850000 15.0 150000 100.0 1000000 Component Level Percentage (%) PPM 1.59 0.28 1.87 15929 2811 18740 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) PPM 0.33 3273 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM Homogeneous Material Level Percentage (%) PPM 80 800000 15 150000 5 50000 100 1000000 Component Level Percentage (%) PPM 0.58 0.11 0.04 0.72 Leadframe Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 5.06 E-02 1.18 E-03 6.55 E-05 1.26 E-05 5.19 E-02 Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 5.24 E-04 3362 0.34 External Leadframe Plating Description Tin & its alloys Tin & its alloys Subtotal Substance Tin Lead CAS# Weight (g) 7440-31-5 7439-92-1 2.48 E-03 4.38 E-04 2.92 E-03 Bond Wires Description Precious metals Substance Gold CAS# Weight (g) 7440-57-5 5.10 E-04 Chip Description Other inorganic materials Substance Doped Silicon CAS# Weight (g) 7440-21-3 3.57 E-03 22914 2.29 Die Di Attach Att h Description Precious metals Thermosets Others Subtotal Substance Silver Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 Proprietary Proprietary 8.96 E-04 1.68 E-04 5.60 E-05 1.12 E-03 Weight (g) 1.56 E-01 Package Totals Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 5751 1078 359 7189 PPM 1000000