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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Cu
Ni
Si
Mg
Ag
Item
Sn
MQFP
28 X 28
160
Pb-Free
Molding Compound
% of Compound
Weight (g)
8
3.22 E-01
86
3.46 E+00
5
2.01 E-01
0.4
1.61 E-02
0.4
1.61 E-02
0.2
8.04 E-03
PPM
52944
569152
33090
2647
2647
1324
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
Leadframe
% of Leadframe
96.2
3
0.65
0.15
Weight (g)
1.13 E+00
3.53 E-02
7.64 E-03
1.76 E-03
PPM
186127
5804
1258
290
Item
Pb
Cd
Hg
Cr+6
Internal Leadframe Plating
Weight (g)
% of Plating
2.81 E-02
100
PPM
4627
External Leadframe Plating
% of Plating
Weight (g)
3.37 E-02
100
PPM
5551
Au
Bond Wires
% of Wire
99.99
Weight (g)
7.45 E-03
PPM
1227
Si
Chip
% of Chip
100
Weight (g)
7.53 E-01
PPM
123971
Weight (g)
1.48 E-02
4.20 E-02
PPM
2429
6912
Item
Resin
Ag Filler
Die Attach
% of Die Attach
26
74
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
PPM
<5.0
<5.0
<5.0
<5.0
Molding Compound
Method
EPA method #3052 (ICPAES)
BS EN 1122:2001B (ICPaes)
Mercury Analyser
EPA method #3060A(UV)
SGS In-House Method
SGS In-House Method
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
Package Totals
PPM
Weight (g)
1000000
6.08 E+00
STS-S-B
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
04/07/04
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Carbon Black
Item
Cu
Ni
Si
Mg
Ag
Item
Sn
Pb
MQFP
28 X 28
160
Sn/Pb
Molding Compound
% of Compound
Weight (g)
8
3.22 E-01
86
3.46 E+00
5
2.01 E-01
0.4
1.61 E-02
0.4
1.61 E-02
0.2
8.04 E-03
PPM
52944
569152
33090
2647
2647
1324
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<2.0
<2.0
<2.0
<2.0
ND
ND
Leadframe
% of Leadframe
96.2
3
0.65
0.15
PPM
186127
5804
1258
290
Item
Pb
Cd
Hg
Cr+6
PPM
<5.0
<5.0
<5.0
<5.0
Weight (g)
1.13 E+00
3.53 E-02
7.64 E-03
1.76 E-03
Internal Leadframe Plating
Weight (g)
% of Plating
2.81 E-02
100
PPM
External Leadframe Plating
% of Plating
Weight (g)
2.87 E-02
85
5.06 E-03
15
PPM
4718
833
Bond Wires
% of Wire
99.99
Weight (g)
7.45 E-03
PPM
Si
Chip
% of Chip
100
Weight (g)
7.53 E-01
PPM
123971
Die Attach
% of Die Attach
26
74
Weight (g)
1.48 E-02
4.20 E-02
PPM
Item
Die Attach Paste
Method
ICP-AES
ICP-AES
ICP-AES
EPA method 7196A & EPA 3060A
4627
Au
Resin
Ag Filler
Molding Compound
Method
EPA method #3052 (ICP-AES)
BS EN 1122:2001B (ICP-AES)
Mercury Analyser
EPA method #3060A(UV)
SGS In-House Method
SGS In-House Method
1227
2429
6912
Package Totals
PPM
Weight (g)
1000000
6.08 E+00
STS-S-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
04/07/04