Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Ni Si Mg Ag Item Sn MQFP 28 X 28 160 Pb-Free Molding Compound % of Compound Weight (g) 8 3.22 E-01 86 3.46 E+00 5 2.01 E-01 0.4 1.61 E-02 0.4 1.61 E-02 0.2 8.04 E-03 PPM 52944 569152 33090 2647 2647 1324 Item Pb Cd Hg Cr+6 PBB PBDE Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 1.13 E+00 3.53 E-02 7.64 E-03 1.76 E-03 PPM 186127 5804 1258 290 Item Pb Cd Hg Cr+6 Internal Leadframe Plating Weight (g) % of Plating 2.81 E-02 100 PPM 4627 External Leadframe Plating % of Plating Weight (g) 3.37 E-02 100 PPM 5551 Au Bond Wires % of Wire 99.99 Weight (g) 7.45 E-03 PPM 1227 Si Chip % of Chip 100 Weight (g) 7.53 E-01 PPM 123971 Weight (g) 1.48 E-02 4.20 E-02 PPM 2429 6912 Item Resin Ag Filler Die Attach % of Die Attach 26 74 PPM <2.0 <2.0 <2.0 <2.0 ND ND PPM <5.0 <5.0 <5.0 <5.0 Molding Compound Method EPA method #3052 (ICPAES) BS EN 1122:2001B (ICPaes) Mercury Analyser EPA method #3060A(UV) SGS In-House Method SGS In-House Method Die Attach Paste Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A Package Totals PPM Weight (g) 1000000 6.08 E+00 STS-S-B Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 04/07/04 Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Ni Si Mg Ag Item Sn Pb MQFP 28 X 28 160 Sn/Pb Molding Compound % of Compound Weight (g) 8 3.22 E-01 86 3.46 E+00 5 2.01 E-01 0.4 1.61 E-02 0.4 1.61 E-02 0.2 8.04 E-03 PPM 52944 569152 33090 2647 2647 1324 Item Pb Cd Hg Cr+6 PBB PBDE PPM <2.0 <2.0 <2.0 <2.0 ND ND Leadframe % of Leadframe 96.2 3 0.65 0.15 PPM 186127 5804 1258 290 Item Pb Cd Hg Cr+6 PPM <5.0 <5.0 <5.0 <5.0 Weight (g) 1.13 E+00 3.53 E-02 7.64 E-03 1.76 E-03 Internal Leadframe Plating Weight (g) % of Plating 2.81 E-02 100 PPM External Leadframe Plating % of Plating Weight (g) 2.87 E-02 85 5.06 E-03 15 PPM 4718 833 Bond Wires % of Wire 99.99 Weight (g) 7.45 E-03 PPM Si Chip % of Chip 100 Weight (g) 7.53 E-01 PPM 123971 Die Attach % of Die Attach 26 74 Weight (g) 1.48 E-02 4.20 E-02 PPM Item Die Attach Paste Method ICP-AES ICP-AES ICP-AES EPA method 7196A & EPA 3060A 4627 Au Resin Ag Filler Molding Compound Method EPA method #3052 (ICP-AES) BS EN 1122:2001B (ICP-AES) Mercury Analyser EPA method #3060A(UV) SGS In-House Method SGS In-House Method 1227 2429 6912 Package Totals PPM Weight (g) 1000000 6.08 E+00 STS-S-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 04/07/04