Materials Declaration Package Body Size LeadCount Option SSOP 5.3 mm 28 Pb Free Molding Compound % of Compound Weight (g) 10 1.35 E-02 85 1.15 E-01 3 4.06 E-03 1.5 2.03 E-03 0.5 6.77 E-04 PPM 61959 526656 18588 9294 3098 Cu Fe P Zn Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 6.50 E-02 1.57 E-03 2.00 E-05 8.00 E-05 PPM 297407 7168 92 366 Ag Internal Leadframe Plating Weight (g) % of Plating 9.82 E-04 100 PPM 4497 External Leadframe Plating % of Plating Weight (g) 3.58 E-03 100 PPM 16387 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Item Sn Au Bond Wires % of Wire 99.99 Weight (g) 8.18 E-04 PPM 3743 Si Chip % of Chip 100 Weight (g) 9.99 E-03 PPM 45729 Die Attach % of Die Attach 25 75 Weight (g) 2.74 E-04 8.22 E-04 PPM 1254 3763 Item Resin Ag Filler Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES Package Totals PPM Weight (g) 1000000 2.18 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 4/5/04 Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SSOP 5.3 mm 28 Sn/Pb Molding Compound % of Compound Weight (g) 10 1.35 E-02 85 1.15 E-01 3 4.06 E-03 1.5 2.03 E-03 0.5 6.77 E-04 PPM 61959 526656 18588 9294 3098 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 297407 7168 92 366 Weight (g) 6.50 E-02 1.57 E-03 2.00 E-05 8.00 E-05 Ag Internal Leadframe Plating Weight (g) % of Plating 9.82 E-04 100 Sn Pb External Leadframe Plating % of Plating Weight (g) 3.04 E-03 85 5.37 E-04 15 Item PPM Molding Compound Method US EPA method #3052 & 6010B BS EN 1122:2001 ICP AES US EPA method #3052 & 7471A US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES PPM 13929 2458 Bond Wires % of Wire 99.99 Weight (g) 8.18 E-04 PPM Si Chip % of Chip 100 Weight (g) 9.99 E-03 PPM 45729 Die Attach % of Die Attach 25 75 Weight (g) 2.74 E-04 8.22 E-04 PPM Item PPM <2 Not Detected <2 <2 4497 Au Resin Ag Filler Item Pb Cd Hg Cr+6 3743 1254 3763 Package Totals PPM Weight (g) 1000000 2.18 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 4/5/04