Materials Declaration Package Body Size LeadCount Option SOIC 300 mils 24 Pb Free Molding Compound % of Compound Weight (g) 10 3.95 E-02 85 3.35 E-01 3 1.18 E-02 1.5 5.92 E-03 0.5 1.97 E-03 PPM 62281 529390 18684 9342 3114 Cu Fe P Zn Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 1.97 E-01 4.74 E-03 6.05 E-05 2.42 E-04 PPM 310453 7483 96 382 Ag Internal Leadframe Plating Weight (g) % of Plating 1.82 E-03 100 PPM 2868 External Leadframe Plating % of Plating Weight (g) 4.27 E-03 100 PPM 6739 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Item Sn Au Si Item Resin Ag Filler Bond Wires % of Wire 99.99 Weight (g) 1.02 E-03 PPM 1610 Chip % of Chip 100 Weight (g) 2.79 E-02 PPM 43991 Die Attach % of Die Attach 25 75 Weight (g) 5.65 E-04 1.70 E-03 PPM Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 892 2675 Package Totals PPM Weight (g) 1000000 6.34 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SOIC 300 mils 24 Sn/Pb Molding Compound % of Compound Weight (g) 10 3.95 E-02 85 3.35 E-01 3 1.18 E-02 1.5 5.92 E-03 0.5 1.97 E-03 PPM 62281 529390 18684 9342 3114 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 310453 7483 96 382 Weight (g) 1.97 E-01 4.74 E-03 6.05 E-05 2.42 E-04 Internal Leadframe Plating Weight (g) % of Plating 1.82 E-03 100 PPM Ag PPM Sn Pb External Leadframe Plating % of Plating Weight (g) 3.63 E-03 85 6.41 E-04 15 Item Au Si Item Resin Ag Filler Item Pb Cd Hg Cr+6 PPM <2 Not Detected <2 <2 Molding Compound Method US EPA method #3052 & 6010B BS EN 1122:2001 ICP AES US EPA method #3052 & 7471A US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 2868 5728 1011 Bond Wires % of Wire 99.99 Weight (g) 1.02 E-03 PPM Chip % of Chip 100 Weight (g) 2.79 E-02 PPM 43991 Die Attach % of Die Attach 25 75 Weight (g) 5.65 E-04 1.70 E-03 PPM 1610 892 2675 Package Totals PPM Weight (g) 1000000 6.34 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary