Materials Declaration Package Body Size LeadCount Option SOIC 300 mils 18 Pb Free Molding Compound % of Compound Weight (g) 10 3.54 E-02 85 3.01 E-01 3 1.06 E-02 1.5 5.31 E-03 0.5 1.77 E-03 PPM 69857 593786 20957 10479 3493 Cu Fe P Zn Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 1.33 E-01 3.20 E-03 4.09 E-05 1.64 E-04 PPM 262237 6321 81 323 Ag Internal Leadframe Plating Weight (g) % of Plating 1.40 E-03 100 PPM 2763 External Leadframe Plating % of Plating Weight (g) 3.21 E-03 100 PPM 6327 Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Item Sn Au Si Item Resin Ag Filler Bond Wires % of Wire 99.99 Weight (g) 7.68 E-04 PPM 1516 Chip % of Chip 100 Weight (g) 1.02 E-02 PPM 20158 Die Attach % of Die Attach 25 75 Weight (g) 2.16 E-04 6.47 E-04 PPM Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 426 1277 Package Totals PPM Weight (g) 1000000 5.07 E-01 AMK-RW-F Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 05/27/04 Materials Declaration Package Body Size LeadCount Option Item Epoxy resin SiO2 Filler Phenol Resin Antimony_Sb2O3 Brominated Resin Item Cu Fe P Zn SOIC 300 mils 18 Sn/Pb Molding Compound % of Compound Weight (g) 10 3.54 E-02 85 3.01 E-01 3 1.06 E-02 1.5 5.31 E-03 0.5 1.77 E-03 PPM 69857 593786 20957 10479 3493 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 262237 6321 81 323 Weight (g) 1.33 E-01 3.20 E-03 4.09 E-05 1.64 E-04 Internal Leadframe Plating Weight (g) % of Plating 1.40 E-03 100 PPM Ag PPM Sn Pb External Leadframe Plating % of Plating Weight (g) 2.73 E-03 85 4.81 E-04 15 Item Au Si Item Resin Ag Filler Item Pb Cd Hg Cr+6 Molding Compound Method PPM <2 US EPA method #3052 & 6010B Not Detected BS EN 1122:2001 ICP AES <2 US EPA method #3052 & 7471A <2 US EPA method #3060A & 6010B Die Attach Paste Item Pb Cd Hg Cr+6 PBB PBDE PPM <5 <5 <5 <5 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES 2763 5378 949 Bond Wires % of Wire 99.99 Weight (g) 7.68 E-04 PPM Chip % of Chip 100 Weight (g) 1.02 E-02 PPM 20158 Die Attach % of Die Attach 25 75 Weight (g) 2.16 E-04 6.47 E-04 PPM 1516 426 1277 Package Totals PPM Weight (g) 1000000 5.07 E-01 AMK-RW-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 05/27/04