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Materials Declaration
Package
Body Size
LeadCount
Option
SOIC
300 mils
18
Pb Free
Molding Compound
% of Compound
Weight (g)
10
3.54 E-02
85
3.01 E-01
3
1.06 E-02
1.5
5.31 E-03
0.5
1.77 E-03
PPM
69857
593786
20957
10479
3493
Cu
Fe
P
Zn
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Weight (g)
1.33 E-01
3.20 E-03
4.09 E-05
1.64 E-04
PPM
262237
6321
81
323
Ag
Internal Leadframe Plating
Weight (g)
% of Plating
1.40 E-03
100
PPM
2763
External Leadframe Plating
% of Plating
Weight (g)
3.21 E-03
100
PPM
6327
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Item
Sn
Au
Si
Item
Resin
Ag Filler
Bond Wires
% of Wire
99.99
Weight (g)
7.68 E-04
PPM
1516
Chip
% of Chip
100
Weight (g)
1.02 E-02
PPM
20158
Die Attach
% of Die Attach
25
75
Weight (g)
2.16 E-04
6.47 E-04
PPM
Item
Pb
Cd
Hg
Cr+6
Molding Compound
Method
PPM
<2
US EPA method #3052 & 6010B
Not Detected BS EN 1122:2001 ICP AES
<2
US EPA method #3052 & 7471A
<2
US EPA method #3060A & 6010B
Die Attach Paste
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5
<5
<5
<5
Not Detected
Not Detected
Method
ICP AES
ICP AES
ICP AES
ICP AES
426
1277
Package Totals
PPM
Weight (g)
1000000
5.07 E-01
AMK-RW-F
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
05/27/04
Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy resin
SiO2 Filler
Phenol Resin
Antimony_Sb2O3
Brominated Resin
Item
Cu
Fe
P
Zn
SOIC
300 mils
18
Sn/Pb
Molding Compound
% of Compound
Weight (g)
10
3.54 E-02
85
3.01 E-01
3
1.06 E-02
1.5
5.31 E-03
0.5
1.77 E-03
PPM
69857
593786
20957
10479
3493
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
PPM
262237
6321
81
323
Weight (g)
1.33 E-01
3.20 E-03
4.09 E-05
1.64 E-04
Internal Leadframe Plating
Weight (g)
% of Plating
1.40 E-03
100
PPM
Ag
PPM
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
2.73 E-03
85
4.81 E-04
15
Item
Au
Si
Item
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
Molding Compound
Method
PPM
<2
US EPA method #3052 & 6010B
Not Detected BS EN 1122:2001 ICP AES
<2
US EPA method #3052 & 7471A
<2
US EPA method #3060A & 6010B
Die Attach Paste
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
<5
<5
<5
<5
Not Detected
Not Detected
Method
ICP AES
ICP AES
ICP AES
ICP AES
2763
5378
949
Bond Wires
% of Wire
99.99
Weight (g)
7.68 E-04
PPM
Chip
% of Chip
100
Weight (g)
1.02 E-02
PPM
20158
Die Attach
% of Die Attach
25
75
Weight (g)
2.16 E-04
6.47 E-04
PPM
1516
426
1277
Package Totals
PPM
Weight (g)
1000000
5.07 E-01
AMK-RW-A
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
05/27/04