Materials Declaration Package Body Size LeadCount Option Item Epoxy Cresol Novolac SiO2 Filler Epoxy Resin Phenol Resin Carbon Black Item Cu Zr PLCC 9x9 20 Pb Free Molding Compound % of Compound Weight (g) 2 1.01 E-02 85 4.30 E-01 6.4 3.24 E-02 6.4 3.24 E-02 0.2 1.01 E-03 PPM 17255 733354 55217 55217 1726 Item Pb Cd Hg Cr+6 PPM <2 ,2 <2 <2 Leadframe % of Leadframe 99.9 0.1 PPM 158663 159 Item Pb Cd Hg Cr+6 PPM <2 <2 <2 <2 Die Attach Paste Weight (g) 9.30 E-02 9.31 E-05 Ag Internal Leadframe Plating % of Plating Weight (g) 6.43 E-04 100 Sn External Leadframe Plating % of Plating Weight (g) 1.18 E-02 100 Item 1096 PPM 20173 Weight (g) 1.01 E-03 PPM Au Weight (g) 4.64 E-03 PPM Si Chip % of Chip 100 Die Attach % of Die Attach 25 75 Weight (g) 4.01 E-04 1.20 E-03 PPM Item Method ICP AES ICP AES ICP AES ICP AES PPM Bond Wires % of Wire 99.99 Resin Ag Filler Molding Compound Method US EPA method #3052 & 6010B BS EN 1122:2001 ICP AES US EPA method #3052 & 7471A US EPA method #3060A & 6010B 1714 7908 684 2051 Package Totals PPM Weight (g) 1000000 5.86 E-01 AMK-P-J Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 06/03/05 Materials Declaration Package Body Size LeadCount Option Item Epoxy Cresol Novolac SiO2 Filler Phenol Novolac Antimony_Sb2O3 Brominated Resin Carbon Black Item Cu Zr PLCC 9x9 20 Sn/Pb Molding Compound % of Compound Weight (g) 16 7.28 E-02 72 3.28 E-01 8 3.64 E-02 2.2 1.00 E-02 1.6 7.28 E-03 0.2 9.11 E-04 PPM 128175 576785 64087 17624 12817 1602 Item Pb Cd Hg Cr+6 Leadframe % of Leadframe 99.9 0.1 PPM 163690 164 Item Pb Cd Hg Cr+6 PBB PBDE Internal Leadframe Plating % of Plating Weight (g) 6.43 E-04 100 Sn Pb External Leadframe Plating % of Plating Weight (g) 1.01 E-02 85 1.77 E-03 15 PPM 1131 Weight (g) 1.01 E-03 PPM Au Weight (g) 4.64 E-03 PPM Si Chip % of Chip 100 Die Attach % of Die Attach 25 75 Weight (g) 4.53 E-04 1.36 E-03 PPM Item PPM <2 <2 <2 <2 Not Detected Not Detected Method ICP AES ICP AES ICP AES ICP AES PPM 17690 3122 Bond Wires % of Wire 99.99 Resin Ag Filler Molding Compound Method US EPA method #3052 & 6010B BS EN 1122:2001 ICP AES US EPA method #3052 & 7471A US EPA method #3060A & 6010B Die Attach Paste Weight (g) 9.30 E-02 9.31 E-05 Ag Item PPM <2 Not Detected <2 <2 1769 8158 797 2390 Package Totals PPM Weight (g) 1000000 5.68 E-01 AMK-P-A Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 06/03/05